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公开(公告)号：US20150001075A1
公开(公告)日：2015-01-01
申请号：US13929525
申请日：2013-06-27
Applicant: STMicroelectronics Pte Ltd.
Inventor： Olivier Le Neel , Suman Cherian , Calvin Leung , Ravi Shankar , Tien Choy Loh , Shian Yeu Kam
IPC: G01N27/416 , H01L35/34
CPC classification number: H01L35/34 , G01N27/3274 , Y10T29/49117
Abstract: A bio-fluid sensor is formed by depositing polyimide on a glass substrate. Gold and platinum are deposited on the polyimide and patterned to form fluid sensing electrodes, signal traces, and a temperature sensor. The fluid sensor is then fixed to a flexible tape and peeled off of the glass substrate.
Abstract translation: 通过在玻璃基板上沉积聚酰亚胺形成生物流体传感器。 金和铂沉积在聚酰亚胺上并图案化以形成流体感测电极，信号迹线和温度传感器。 然后将流体传感器固定到柔性带并从玻璃基板上剥离。
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公开(公告)号：US11009477B2
公开(公告)日：2021-05-18
申请号：US16397635
申请日：2019-04-29
Applicant: STMicroelectronics Pte Ltd.
Inventor： Olivier Le Neel , Ravi Shankar , Suman Cherian , Calvin Leung , Tien-Choy Loh , Shian-Yeu Kam
IPC: G01K7/01 , G01K7/16 , G01K7/18 , G01K7/20 , G01L9/12 , H01L25/00 , H01L27/02 , H01L29/78 , G01N27/22 , H01L25/065 , G01L19/00 , G01D21/02
Abstract: A semiconductor-based multi-sensor module integrates miniature temperature, pressure, and humidity sensors onto a single substrate. Pressure and humidity sensors can be implemented as capacitive thin film sensors, while the temperature sensor is implemented as a precision miniature Wheatstone bridge. Such multi-sensor modules can be used as building blocks in application-specific integrated circuits (ASICs). Furthermore, the multi-sensor module can be built on top of existing circuitry that can be used to process signals from the sensors. An integrated multi-sensor module that uses differential sensors can measure a variety of localized ambient environmental conditions substantially simultaneously, and with a high level of precision. The multi-sensor module also features an integrated heater that can be used to calibrate or to adjust the sensors, either automatically or as needed. Such a miniature integrated multi-sensor module that features low power consumption can be used in medical monitoring and mobile computing, including smart phone applications.
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公开(公告)号：US20190257780A1
公开(公告)日：2019-08-22
申请号：US16397635
申请日：2019-04-29
Applicant: STMicroelectronics Pte Ltd.
Inventor： Olivier LE NEEL , Ravi Shankar , Suman Cherian , Calvin Leung , Tien-Choy Loh , Shian-Yeu Kam
IPC: G01N27/22 , G01L19/00 , H01L27/02 , G01K7/16 , G01K7/20 , G01K7/18 , G01K7/01 , G01L9/12 , H01L25/00 , H01L25/065 , H01L29/78
Abstract: A semiconductor-based multi-sensor module integrates miniature temperature, pressure, and humidity sensors onto a single substrate. Pressure and humidity sensors can be implemented as capacitive thin film sensors, while the temperature sensor is implemented as a precision miniature Wheatstone bridge. Such multi-sensor modules can be used as building blocks in application-specific integrated circuits (ASICs). Furthermore, the multi-sensor module can be built on top of existing circuitry that can be used to process signals from the sensors. An integrated multi-sensor module that uses differential sensors can measure a variety of localized ambient environmental conditions substantially simultaneously, and with a high level of precision. The multi-sensor module also features an integrated heater that can be used to calibrate or to adjust the sensors, either automatically or as needed. Such a miniature integrated multi-sensor module that features low power consumption can be used in medical monitoring and mobile computing, including smart phone applications.
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公开(公告)号：US10094797B2
公开(公告)日：2018-10-09
申请号：US15605825
申请日：2017-05-25
Applicant: STMicroelectronics Pte Ltd.
Inventor： Olivier Le Neel , Ravi Shankar , Suman Cherian , Calvin Leung , Tien-Choy Loh , Shian-Yeu Kam
IPC: H01L29/84 , G01N27/22 , H01L25/065 , H01L29/78 , G01L9/12 , G01K7/18 , G01K7/20 , G01L19/00 , G01K7/16 , H01L25/00 , H01L27/02 , G01K7/01 , G01D21/02
Abstract: A semiconductor-based multi-sensor module integrates miniature temperature, pressure, and humidity sensors onto a single substrate. Pressure and humidity sensors can be implemented as capacitive thin film sensors, while the temperature sensor is implemented as a precision miniature Wheatstone bridge. Such multi-sensor modules can be used as building blocks in application-specific integrated circuits (ASICs). Furthermore, the multi-sensor module can be built on top of existing circuitry that can be used to process signals from the sensors. An integrated multi-sensor module that uses differential sensors can measure a variety of localized ambient environmental conditions substantially simultaneously, and with a high level of precision. The multi-sensor module also features an integrated heater that can be used to calibrate or to adjust the sensors, either automatically or as needed. Such a miniature integrated multi-sensor module that features low power consumption can be used in medical monitoring and mobile computing, including smart phone applications.
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公开(公告)号：US09689824B2
公开(公告)日：2017-06-27
申请号：US14887145
申请日：2015-10-19
Applicant: STMicroelectronics Pte Ltd.
Inventor： Olivier Le Neel , Ravi Shankar , Suman Cherian , Calvin Leung , Tien-Choy Loh , Shian-Yeu Kam
IPC: G01P15/08 , H01L29/84 , G01N27/22 , H01L25/065 , H01L25/00 , G01L9/12 , G01K7/01 , H01L27/02 , H01L29/78 , G01K7/18 , G01K7/20 , G01L19/00 , G01K7/16 , G01D21/02
CPC classification number: G01N27/223 , G01D21/02 , G01K7/01 , G01K7/16 , G01K7/186 , G01K7/20 , G01L9/12 , G01L19/0092 , H01L25/0652 , H01L25/50 , H01L27/0248 , H01L29/7804 , H01L2924/0002 , H01L2924/00
Abstract: A semiconductor-based multi-sensor module integrates miniature temperature, pressure, and humidity sensors onto a single substrate. Pressure and humidity sensors can be implemented as capacitive thin film sensors, while the temperature sensor is implemented as a precision miniature Wheatstone bridge. Such multi-sensor modules can be used as building blocks in application-specific integrated circuits (ASICs). Furthermore, the multi-sensor module can be built on top of existing circuitry that can be used to process signals from the sensors. An integrated multi-sensor module that uses differential sensors can measure a variety of localized ambient environmental conditions substantially simultaneously, and with a high level of precision. The multi-sensor module also features an integrated heater that can be used to calibrate or to adjust the sensors, either automatically or as needed. Such a miniature integrated multi-sensor module that features low power consumption can be used in medical monitoring and mobile computing, including smart phone applications.
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Patent Agency Ranking
公开(公告)号：US09618653B2
公开(公告)日：2017-04-11
申请号：US13853801
申请日：2013-03-29
Applicant: STMicroelectronics Pte Ltd.
Inventor： Olivier Le Neel , Ravi Shankar , Suman Cherian
Abstract: Sensors for air flow, temperature, pressure, and humidity are integrated onto a single semiconductor die within a miniaturized Venturi chamber to provide a microelectronic semiconductor-based environmental multi-sensor module that includes an air flow meter. One or more such multi-sensor modules can be used as building blocks in dedicated application-specific integrated circuits (ASICs) for use in environmental control appliances that rely on measurements of air flow. Furthermore, the sensor module can be built on top of existing circuitry that can be used to process signals from the sensors. By integrating the Venturi chamber with accompanying environmental sensors, correction factors can be obtained and applied to compensate for temporal humidity fluctuations and spatial temperature variation using the Venturi apparatus.
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公开(公告)号：US20140291677A1
公开(公告)日：2014-10-02
申请号：US13853732
申请日：2013-03-29
Applicant: STMICROELECTRONICS PTE LTD.
Inventor： Olivier Le Neel , Ravi Shankar , Suman Cherian , Calvin Leung , Tien-Choy Loh , Shian-Yeu Kam
IPC: G01K7/16 , G01N27/22 , G01L9/12 , H01L25/065 , H01L25/00
CPC classification number: G01N27/223 , G01D21/02 , G01K7/01 , G01K7/16 , G01K7/186 , G01K7/20 , G01L9/12 , G01L19/0092 , H01L25/0652 , H01L25/50 , H01L27/0248 , H01L29/7804 , H01L2924/0002 , H01L2924/00
Abstract: A semiconductor-based multi-sensor module integrates miniature temperature, pressure, and humidity sensors onto a single substrate. Pressure and humidity sensors can be implemented as capacitive thin film sensors, while the temperature sensor is implemented as a precision miniature Wheatstone bridge. Such multi-sensor modules can be used as building blocks in application-specific integrated circuits (ASICs). Furthermore, the multi-sensor module can be built on top of existing circuitry that can be used to process signals from the sensors. An integrated multi-sensor module that uses differential sensors can measure a variety of localized ambient environmental conditions substantially simultaneously, and with a high level of precision. The multi-sensor module also features an integrated heater that can be used to calibrate or to adjust the sensors, either automatically or as needed. Such a miniature integrated multi-sensor module that features low power consumption can be used in medical monitoring and mobile computing, including smart phone applications.
Abstract translation: 基于半导体的多传感器模块将微型温度，压力和湿度传感器集成在单个基板上。 压力和湿度传感器可以实现为电容薄膜传感器，而温度传感器实现为精密微型惠斯通电桥。 这种多传感器模块可以用作专用集成电路（ASIC）中的构建块。 此外，多传感器模块可以构建在可用于处理来自传感器的信号的现有电路之上。 使用差分传感器的集成多传感器模块可以大量同时测量各种局部环境条件，并以高精度测量。 多传感器模块还具有集成加热器，可用于自动或根据需要校准或调整传感器。 这种具有低功耗的微型集成多传感器模块可用于医疗监控和移动计算，包括智能手机应用。
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公开(公告)号：US10317357B2
公开(公告)日：2019-06-11
申请号：US16128076
申请日：2018-09-11
Applicant: STMicroelectronics Pte Ltd.
Inventor： Olivier Le Neel , Ravi Shankar , Suman Cherian , Calvin Leung , Tien-Choy Loh , Shian-Yeu Kam
IPC: G01K7/18 , G01N27/22 , H01L25/00 , H01L25/065 , H01L29/78 , H01L27/02 , G01L19/00 , G01L9/12 , G01K7/20 , G01K7/16 , G01K7/01 , G01D21/02
Abstract: A semiconductor-based multi-sensor module integrates miniature temperature, pressure, and humidity sensors onto a single substrate. Pressure and humidity sensors can be implemented as capacitive thin film sensors, while the temperature sensor is implemented as a precision miniature Wheatstone bridge. Such multi-sensor modules can be used as building blocks in application-specific integrated circuits (ASICs). Furthermore, the multi-sensor module can be built on top of existing circuitry that can be used to process signals from the sensors. An integrated multi-sensor module that uses differential sensors can measure a variety of localized ambient environmental conditions substantially simultaneously, and with a high level of precision. The multi-sensor module also features an integrated heater that can be used to calibrate or to adjust the sensors, either automatically or as needed. Such a miniature integrated multi-sensor module that features low power consumption can be used in medical monitoring and mobile computing, including smart phone applications.
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公开(公告)号：US10299711B2
公开(公告)日：2019-05-28
申请号：US15873557
申请日：2018-01-17
Applicant: STMICROELECTRONICS PTE LTD
Inventor： Olivier Le Neel , Suman Cherian , Calvin Leung
IPC: G01N27/327 , A61B5/1473 , A61B5/145 , A61B5/1468
Abstract: A universal electrochemical micro-sensor can be used either as a biosensor or an environmental sensor. Because of its small size and flexibility, the micro-sensor is suitable for continuous use to monitor fluids within a live subject, or as an environmental monitor. The micro-sensor can be formed on a reusable glass carrier substrate. A flexible polymer backing, together with a set of electrodes, forms a reservoir that contains an electrolytic fluid chemical reagent. During fabrication, the glass carrier substrate protects the fluid chemical reagent from degradation. A conductive micromesh further contains the reagent while allowing partial exposure to the ambient biological or atmospheric environment. The micromesh density can be altered to accommodate fluid reagents having different viscosities. Flexibility is achieved by attaching a thick polymer tape and peeling away the micro-sensor from the glass carrier substrate. The final structure is thereby transferred to the polymer tape, providing a flexible product.
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公开(公告)号：US20190025236A1
公开(公告)日：2019-01-24
申请号：US16128076
申请日：2018-09-11
Applicant: STMicroelectronics Pte Ltd.
Inventor： Olivier Le Neel , Ravi Shankar , Suman Cherian , Calvin Leung , Tien-Choy Loh , Shian-Yeu Kam
IPC: G01N27/22 , G01K7/18 , H01L25/00 , H01L25/065 , H01L29/78 , H01L27/02 , G01K7/01 , G01L19/00 , G01L9/12 , G01K7/20 , G01K7/16
Abstract: A semiconductor-based multi-sensor module integrates miniature temperature, pressure, and humidity sensors onto a single substrate. Pressure and humidity sensors can be implemented as capacitive thin film sensors, while the temperature sensor is implemented as a precision miniature Wheatstone bridge. Such multi-sensor modules can be used as building blocks in application-specific integrated circuits (ASICs). Furthermore, the multi-sensor module can be built on top of existing circuitry that can be used to process signals from the sensors. An integrated multi-sensor module that uses differential sensors can measure a variety of localized ambient environmental conditions substantially simultaneously, and with a high level of precision. The multi-sensor module also features an integrated heater that can be used to calibrate or to adjust the sensors, either automatically or as needed. Such a miniature integrated multi-sensor module that features low power consumption can be used in medical monitoring and mobile computing, including smart phone applications.
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