Method of producing a device for adiabatic coupling between waveguide arrays, corresponding device, and system

    公开(公告)号:US10761279B2

    公开(公告)日:2020-09-01

    申请号:US16428428

    申请日:2019-05-31

    Abstract: A method includes providing a semiconductor body comprising a surface with a recessed portion therein. The recessed portion includes a bottom surface. Optical waveguide cores in a first array of optical waveguide cores extend side-by-side at the bottom surface. The method further includes providing a second array of optical waveguide cores over the first array of optical waveguide cores. Optical waveguide cores in the second array of optical waveguide cores extend side-by-side. Each optical waveguide core in the second array of optical waveguide cores is in an adiabatic coupling relationship with a corresponding optical waveguide core in the first array of optical waveguide cores. The method also includes applying an optical waveguide cladding material over the second array of optical waveguide cores.

    Multi-substrate electro-optical interconnection system
    17.
    发明授权
    Multi-substrate electro-optical interconnection system 有权
    多基板电光互连系统

    公开(公告)号:US09391708B2

    公开(公告)日:2016-07-12

    申请号:US14714582

    申请日:2015-05-18

    Abstract: An intra-board chip-to-chip optical communications system has a high bit rate and high data throughput based on the use of a silicon photonic interposer. The system includes a multi-substrate electro-optical structure for communications with CMOS and/or BiCMOS IC chips of a PCB. The structure includes a multi-chip module primary substrate mounted over the supporting PCB. The multi-chip module primary substrate implements high frequency electrical interconnections between transceiver circuit chips, mounted on the silicon photonic interposer, and the IC chips.

    Abstract translation: 基于硅光子插入器的使用,板内芯片到芯片的光通信系统具有高比特率和高数据吞吐量。 该系统包括用于与PCB的CMOS和/或BiCMOS IC芯片通信的多基板电光结构。 该结构包括安装在支撑PCB上的多芯片模块主要基板。 多芯片模块主要基板在安装在硅光子插入器上的收发器电路芯片和IC芯片之间实现高频电互连。

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