公开(公告)号：US10382137B2

公开(公告)日：2019-08-13

申请号：US16014932

申请日：2018-06-21

Applicant: STMicroelectronics S.r.l.

Inventor： Luca Maggi ,  Antonio Fincato ,  Salvatore Mario Rotolo ,  Matteo Alessio Traldi ,  Luigi Verga ,  Mark Andrew Shaw

IPC: G02B6/36 ,  H04B10/114 ,  H04J14/02 ,  H04B10/40 ,  G02B6/42 ,  H04B10/80 ,  H04B10/2575

Abstract: An optoelectronic device may include a package having a component for sending/receiving optical signals along a first direction, and a chip of semiconductor material housed within the package. The chip may have a main surface and a portion exposed on the main surface for sending/receiving the optical signals along a second direction different from the first direction. The optoelectronic device may further include a component for deflecting the optical signals between the first direction and the second direction, the component being mounted on the main surface.

公开(公告)号：US20180302166A1

公开(公告)日：2018-10-18

申请号：US16014932

申请日：2018-06-21

Applicant: STMicroelectronics S.r.l.

Inventor： Luca Maggi ,  Antonio Fincato ,  Salvatore Mario Rotolo ,  Matteo Alessio Traldi ,  Luigi Verga ,  Mark Andrew Shaw

IPC: H04B10/40 ,  G02B6/42 ,  H04B10/2575

CPC classification number: H04B10/40 ,  G02B6/36 ,  G02B6/42 ,  G02B6/4206 ,  G02B6/4214 ,  G02B6/4246 ,  G02B6/4292 ,  H04B10/1143 ,  H04B10/2575 ,  H04B10/80 ,  H04J14/0209 ,  Y10T29/49002

Abstract: An optoelectronic device may include a package having a component for sending/receiving optical signals along a first direction, and a chip of semiconductor material housed within the package. The chip may have a main surface and a portion exposed on the main surface for sending/receiving the optical signals along a second direction different from the first direction. The optoelectronic device may further include a component for deflecting the optical signals between the first direction and the second direction, the component being mounted on the main surface..

公开(公告)号：US20180188368A1

公开(公告)日：2018-07-05

申请号：US15687033

申请日：2017-08-25

Applicant: STMicroelectronics S.r.l.

Inventor： Maurizio Zuffada ,  Angelo Dati ,  Salvatore Mario Rotolo ,  Melchiorre Bruccoleri ,  Antonio Fincato

IPC: G01S17/02 ,  G01S17/93 ,  G01S7/486

CPC classification number: G01S17/026 ,  G01S7/4863 ,  G01S7/4865 ,  G01S7/4868 ,  G01S7/487 ,  G01S17/102 ,  G01S17/936

Abstract: A system for detecting objects, for driver assistance equipment in motor vehicles for example, includes a transmitter for transmitting towards an object an optical signal having a signal energy. The optical signal transmitted includes at least one encoded pulse sequence with the signal energy distributed over the pulse sequence. A receiver receives an echo signal resulting from reflection of the optical signal at the object with the time delay of the echo signal is indicative of the distance to the object.

公开(公告)号：US09391708B2

公开(公告)日：2016-07-12

申请号：US14714582

申请日：2015-05-18

Applicant: STMICROELECTRONICS S.r.l.

Inventor： Antonio Fincato ,  Salvatore Mario Rotolo ,  Enrico Stefano Temporiti Milani ,  Maurizio Zuffada

IPC: H04B10/00 ,  H04B10/40 ,  H04B10/70 ,  H04B10/50 ,  H05K3/30 ,  H04B10/80

CPC classification number: H04B10/40 ,  H04B10/503 ,  H04B10/70 ,  H04B10/801 ,  H05K3/30 ,  Y10T29/49131

Abstract: An intra-board chip-to-chip optical communications system has a high bit rate and high data throughput based on the use of a silicon photonic interposer. The system includes a multi-substrate electro-optical structure for communications with CMOS and/or BiCMOS IC chips of a PCB. The structure includes a multi-chip module primary substrate mounted over the supporting PCB. The multi-chip module primary substrate implements high frequency electrical interconnections between transceiver circuit chips, mounted on the silicon photonic interposer, and the IC chips.

Abstract translation: 基于硅光子插入器的使用，板内芯片到芯片的光通信系统具有高比特率和高数据吞吐量。 该系统包括用于与PCB的CMOS和/或BiCMOS IC芯片通信的多基板电光结构。 该结构包括安装在支撑PCB上的多芯片模块主要基板。 多芯片模块主要基板在安装在硅光子插入器上的收发器电路芯片和IC芯片之间实现高频电互连。

公开(公告)号：US20150341119A1

公开(公告)日：2015-11-26

申请号：US14714582

申请日：2015-05-18

Applicant: STMICROELECTRONICS S.r.l.

Inventor： Antonio FINCATO ,  Salvatore Mario Rotolo ,  Enrico Stefano Temporiti Milani ,  Maurizio Zuffada

IPC: H04B10/40 ,  H04B10/50 ,  H05K3/30 ,  H04B10/70

CPC classification number: H04B10/40 ,  H04B10/503 ,  H04B10/70 ,  H04B10/801 ,  H05K3/30 ,  Y10T29/49131

Abstract: An intra-board chip-to-chip optical communications system has a high bit rate and high data throughput based on the use of a silicon photonic interposer. The system includes a multi-substrate electro-optical structure for communications with CMOS and/or BiCMOS IC chips of a PCB. The structure includes a multi-chip module primary substrate mounted over the supporting PCB. The multi-chip module primary substrate implements high frequency electrical interconnections between transceiver circuit chips, mounted on the silicon photonic interposer, and the IC chips.

Abstract translation: 基于硅光子插入器的使用，片内芯片到芯片的光通信系统具有高比特率和高数据吞吐量。 该系统包括用于与PCB的CMOS和/或BiCMOS IC芯片通信的多基板电光结构。 该结构包括安装在支撑PCB上的多芯片模块主要基板。 多芯片模块主要基板在安装在硅光子插入器上的收发器电路芯片和IC芯片之间实现高频电互连。