公开(公告)号：US20230028024A1

公开(公告)日：2023-01-26

申请号：US17866257

申请日：2022-07-15

Applicant: STMICROELECTRONICS S.r.l.

Inventor： Mark Andrew SHAW ,  Marco DEL SARTO

IPC: H01L21/78 ,  H01L21/308 ,  H01L21/48 ,  H01L21/768 ,  H01L23/00

Abstract: A process for manufacturing electroacoustic modules including: forming an assembly with a redistribution structure and a plurality of dice arranged in a dielectric region; forming a wafer with a semiconductor body and a plurality of respective unit portions laterally staggered, each of which includes a respective supporting region, set in contact with the semiconductor body, and a number of actuators; reducing the thickness of the semiconductor body and then selectively removing portions of the semiconductor body so as to singulate, starting from the wafer, a plurality of transduction structures, each including a semiconductor substrate, which contacts a corresponding supporting region and is traversed by cavities delimited by portions of the supporting region that form membranes mechanically coupled to the actuators; and then coupling the transduction structures to the redistribution structure of the assembly.

公开(公告)号：US20220306456A1

公开(公告)日：2022-09-29

申请号：US17839131

申请日：2022-06-13

Applicant: STMICROELECTRONICS S.r.l.

Inventor： Fabio QUAGLIA ,  Marco FERRERA ,  Marco DEL SARTO

IPC: B81B7/00 ,  B81C1/00

Abstract: A process for manufacturing MEMS devices, includes forming a first assembly, which comprises: a dielectric region; a redistribution region; and a plurality of unit portions. Each unit portion of the first assembly includes: a die arranged in the dielectric region; and a plurality of first and second connection elements, which extend to opposite faces of the redistribution region and are connected together by paths that extend in the redistribution region, the first connection elements being coupled to the die. The process further includes: forming a second assembly which comprises a plurality of respective unit portions, each of which includes a semiconductor portion and third connection elements; mechanically coupling the first and second assemblies so as to connect the third connection elements to corresponding second connection elements; and then removing at least part of the semiconductor portion of each unit portion of the second assembly, thus forming corresponding membranes.

公开(公告)号：US20220238485A1

公开(公告)日：2022-07-28

申请号：US17580480

申请日：2022-01-20

Applicant: STMICROELECTRONICS S.r.l.

Inventor： Dario PACI ,  Silvia ADORNO ,  Marco DEL SARTO ,  Fabrizio CERINI ,  Alex GRITTI

IPC: H01L25/065 ,  H01L23/64 ,  H01L23/00 ,  H01L23/538

Abstract: A packaged electronic system having a support formed by an insulating organic substrate housing a buried conductive region that is floating. A first die is fixed to the support and carries, on a first main surface, a first die contact region capacitively coupled to a first portion of the buried conductive region. A second die is fixed to the support and carries, on a first main surface, a second die contact region capacitively coupled to a second portion of the buried conductive region. A packaging mass encloses the first die, the second die, the first die contact region, the second die contact region, and, at least partially, the support.

公开(公告)号：US20200262699A1

公开(公告)日：2020-08-20

申请号：US16869159

申请日：2020-05-07

Applicant: STMICROELECTRONICS S.R.L.

Inventor： Enri DUQI ,  Lorenzo BALDO ,  Marco DEL SARTO ,  Mikel AZPEITIA URQUIA

IPC: B81C1/00 ,  B81B3/00 ,  B81B7/00

Abstract: A micro-electro-mechanical device, comprising a monolithic body of semiconductor material accommodating a first buried cavity; a sensitive region facing the first buried cavity; a second cavity facing the first buried cavity; a decoupling trench extending from the monolithic body and separating the sensitive region from a peripheral portion of the monolithic body; a cap die, forming an ASIC, bonded to and facing the first face of the monolithic body; and a first gap between the cap die and the monolithic body. The device also comprises at least one spacer element between the monolithic body and the cap die; at least one stopper element between the monolithic body and the cap die; and a second gap between the stopper element and one between the monolithic body and the cap die. The second gap is smaller than the first gap.

公开(公告)号：US20200024131A1

公开(公告)日：2020-01-23

申请号：US16518865

申请日：2019-07-22

Applicant: STMICROELECTRONICS S.R.L.

Inventor： Fabio QUAGLIA ,  Marco FERRERA ,  Marco DEL SARTO

IPC: B81B7/00 ,  B81C1/00

Abstract: A process for manufacturing MEMS devices, includes forming a first assembly, which comprises: a dielectric region; a redistribution region; and a plurality of unit portions. Each unit portion of the first assembly includes: a die arranged in the dielectric region; and a plurality of first and second connection elements, which extend to opposite faces of the redistribution region and are connected together by paths that extend in the redistribution region, the first connection elements being coupled to the die. The process further includes: forming a second assembly which comprises a plurality of respective unit portions, each of which includes a semiconductor portion and third connection elements; mechanically coupling the first and second assemblies so as to connect the third connection elements to corresponding second connection elements; and then removing at least part of the semiconductor portion of each unit portion of the second assembly, thus forming corresponding membranes.