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    ELECTRONIC ASSEMBLY FOR MOUNTING ON ELECTRONIC BOARD
    2.
    发明申请
    ELECTRONIC ASSEMBLY FOR MOUNTING ON ELECTRONIC BOARD 有权
    用于安装在电子板上的电子总成

    公开(公告)号：US20140312484A1

    公开(公告)日：2014-10-23

    申请号：US14258818

    申请日：2014-04-22

    Applicant: STMicroelectronics S.r.l.

    Inventor： Pierangelo MAGNI ,  Giuseppe GATTAVARI ,  Mark Andrew SHAW

    IPC: H01L23/34 ,  H01L23/00

    CPC classification number: H01L23/34 ,  H01L23/3107 ,  H01L23/49541 ,  H01L24/80 ,  H01L2224/48091 ,  H01L2224/48227 ,  H01L2224/48245 ,  H01L2224/48247 ,  H01L2924/12042 ,  H01L2924/181 ,  H05K1/183 ,  H05K3/306 ,  H01L2924/00 ,  H01L2924/00014 ,  H01L2924/00012

    Abstract: An embodiment of an electronic assembly for mounting on an electronic board includes a plurality of electric contact regions exposed on a mounting surface of the electronic board. The electronic assembly includes a chip of semiconductor material in which at least one electronic component is integrated, at least one support element including a first main surface and a second main surface opposite to the first main surface, the chip being enclosed by the at least one support element, a heat dissipation plate thermally coupled to said chip to dissipate the heat produced by it, exposed on the first main surface of the support element, a plurality of contact elements, each electrically coupled to a respective electric terminal of the electronic component integrated in the chip, exposed on the same first main surface of which is exposed to the dissipation plate. Also included are a plurality of electric connection elements, each adapted to electrically intercouple a respective contact element of the electronic assembly with a corresponding electric contact region of the electronic board, in such a way that the second main surface of the at least one support element faces the mounting surface of the electronic board.

    Abstract translation: 用于安装在电子板上的电子组件的实施例包括暴露在电子板的安装表面上的多个电接触区域。 电子组件包括其中集成有至少一个电子部件的半导体材料芯片，包括第一主表面和与第一主表面相对的第二主表面的至少一个支撑元件，芯片被至少一个 支撑元件，热耦合到所述芯片以散发由其产生的热量的散热板，暴露在支撑元件的第一主表面上，多个接触元件，每个接触元件电耦合到电子元件的相应电气端子集成 在芯片中，暴露在与其散开板相同的第一主表面上。 还包括多个电连接元件，每个电连接元件适于将电子组件的相应接触元件与电子板的对应电接触区域电相互耦合，使得至少一个支撑元件的第二主表面 面向电子板的安装表面。

    PROCESS FOR MANUFACTURING ELECTROACOUSTIC MODULES
    3.
    发明申请
    PROCESS FOR MANUFACTURING ELECTROACOUSTIC MODULES 有权

    公开(公告)号：US20230028024A1

    公开(公告)日：2023-01-26

    申请号：US17866257

    申请日：2022-07-15

    Applicant: STMICROELECTRONICS S.r.l.

    Inventor： Mark Andrew SHAW ,  Marco DEL SARTO

    IPC: H01L21/78 ,  H01L21/308 ,  H01L21/48 ,  H01L21/768 ,  H01L23/00

    Abstract: A process for manufacturing electroacoustic modules including: forming an assembly with a redistribution structure and a plurality of dice arranged in a dielectric region; forming a wafer with a semiconductor body and a plurality of respective unit portions laterally staggered, each of which includes a respective supporting region, set in contact with the semiconductor body, and a number of actuators; reducing the thickness of the semiconductor body and then selectively removing portions of the semiconductor body so as to singulate, starting from the wafer, a plurality of transduction structures, each including a semiconductor substrate, which contacts a corresponding supporting region and is traversed by cavities delimited by portions of the supporting region that form membranes mechanically coupled to the actuators; and then coupling the transduction structures to the redistribution structure of the assembly.

    OPTICAL WAVEGUIDE, CORRESPONDING COUPLING ARRANGEMENT, APPARATUS AND METHOD
    4.
    发明申请
    OPTICAL WAVEGUIDE, CORRESPONDING COUPLING ARRANGEMENT, APPARATUS AND METHOD 审中-公开

    公开(公告)号：US20180275342A1

    公开(公告)日：2018-09-27

    申请号：US15921374

    申请日：2018-03-14

    Applicant: STMICROELECTRONICS S.R.L.

    Inventor： Mark Andrew SHAW

    IPC: G02B6/125 ,  G02B6/30 ,  G02B6/136

    CPC classification number: G02B6/125 ,  G02B6/136 ,  G02B6/2821 ,  G02B6/2852 ,  G02B6/30 ,  G02B2006/12061

    Abstract: An optical waveguide includes a glass waveguide body and a waveguide core through which optical radiation propagates. The waveguide core includes: a body portion extending within the waveguide body, a coupling portion extending at the surface of the waveguide body, and an S-bent intermediate portion coupling the body portion and the coupling portion. An optical coupling arrangement (e.g., for coupling one or more optical fibers to a silicon photonics device) includes one such optical waveguide and a second optical waveguide including a respective waveguide body and one or more waveguide members. The second optical waveguide is coupled with the first optical waveguide with the waveguide member(s) facing the coupling portion of the first optical waveguide.

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