公开(公告)号：US11626355B2

公开(公告)日：2023-04-11

申请号：US17470269

申请日：2021-09-09

Applicant: STMICROELECTRONICS S.R.L.

Inventor： Fulvio Vittorio Fontana ,  Giovanni Graziosi ,  Michele Derai

IPC: H01L23/495 ,  H01L23/00 ,  H01L21/48

Abstract: Methods of forming a semiconductor device comprising a lead-frame having a die pad having at least one electrically conductive die pad area and an insulating layer applied onto the electrically conductive die pad area. An electrically conductive layer is applied onto the insulating layer with one or more semiconductor dice coupled, for instance adhesively, to the electrically conductive layer. The electrically conductive die pad area, the electrically conductive layer and the insulating layer sandwiched therebetween form at least one capacitor integrated in the device. The electrically conductive die pad area comprises a sculptured structure with valleys and peaks therein; the electrically conductive layer comprises electrically conductive filling material extending into the valleys in the sculptured structure of the electrically conductive die pad area.

公开(公告)号：US11133242B2

公开(公告)日：2021-09-28

申请号：US17015619

申请日：2020-09-09

Applicant: STMICROELECTRONICS S.R.L.

Inventor： Michele Derai ,  Federico Giovanni Ziglioli

IPC: H01L23/495 ,  H01L23/31 ,  H01L23/00 ,  H01L21/56

Abstract: A method of manufacturing semiconductor devices such as integrated circuits comprises: providing one or more semiconductor chips having first and second opposed surfaces, coupling the semiconductor chip or chips with a support substrate with the second surface towards the support substrate, embedding the semiconductor chip or chips coupled with the support substrate in electrically-insulating packaging material by providing in the packaging material electrically-conductive passageways. The electrically-conductive passageways comprise: electrically-conductive chip passageways towards the first surface of the at least one semiconductor chip, and/or electrically-conductive substrate passageways towards the support substrate.

公开(公告)号：US10818578B2

公开(公告)日：2020-10-27

申请号：US16151748

申请日：2018-10-04

Applicant: STMICROELECTRONICS S.R.L.

Inventor： Michele Derai ,  Federico Giovanni Ziglioli

IPC: H01L23/495 ,  H01L23/31 ,  H01L23/00 ,  H01L21/56

Abstract: A method of manufacturing semiconductor devices such as integrated circuits comprises: providing one or more semiconductor chips having first and second opposed surfaces, coupling the semiconductor chip or chips with a support substrate with the second surface towards the support substrate, embedding the semiconductor chip or chips coupled with the support substrate in electrically-insulating packaging material by providing in the packaging material electrically-conductive passageways. The electrically-conductive passageways comprise: electrically-conductive chip passageways towards the first surface of the at least one semiconductor chip, and/or electrically-conductive substrate passageways towards the support substrate.