公开(公告)号：US20190237688A1

公开(公告)日：2019-08-01

申请号：US16248974

申请日：2019-01-16

Applicant: Samsung Display Co., Ltd.

Inventor： Heekyun SHIN ,  Taewook KANG ,  Seungjun MOON ,  Woojin CHO ,  Jeongmin PARK

IPC: H01L51/00 ,  H01L27/32 ,  H01L51/56 ,  C09J5/00 ,  C09J7/38 ,  C09J7/20 ,  C09J7/22

CPC classification number: H01L51/0097 ,  C09J5/00 ,  C09J7/20 ,  C09J7/22 ,  C09J7/38 ,  C09J2203/326 ,  C09J2400/123 ,  H01L27/3244 ,  H01L51/003 ,  H01L51/56 ,  H01L2227/326 ,  H01L2251/301 ,  H01L2251/5338

Abstract: A method of manufacturing a flexible display device includes forming a graphene adhesive layer on a carrier substrate, forming a flexible substrate on the graphene adhesive layer, forming a first barrier layer on the flexible substrate, forming a display element part on the first barrier layer, forming a protective film on the display element part, separating the flexible substrate from the carrier substrate, removing a remaining portion of the graphene adhesive layer from a surface of the flexible substrate, and forming a second barrier layer on the surface of the flexible substrate, after removing the remaining portion of the graphene adhesive layer from the surface of the flexible substrate.

公开(公告)号：US20190165272A1

公开(公告)日：2019-05-30

申请号：US16128711

申请日：2018-09-12

Applicant: Samsung Display Co., Ltd.

Inventor： Byunghoon KANG ,  Seungjun MOON ,  Heekyun SHIN ,  Minwoo LEE ,  Woojin CHO

IPC: H01L51/00 ,  H01L27/32 ,  H01L51/52 ,  H01L51/56 ,  B32B43/00

Abstract: A method of manufacturing a flexible display apparatus includes forming a flexible substrate on a carrier substrate, forming a display on a central portion of the flexible substrate, forming a protection layer covering the display, within an area of the flexible substrate, such that an edge portion of the flexible substrate is exposed outside of the protection layer, cutting a first edge portion of the flexible substrate that is exposed outside of the protection layer, except for a second remaining portion of the flexible substrate that is exposed outside of the protection layer, applying suction to the second portion of the flexible substrate, and separating the carrier substrate from the flexible substrate.