公开(公告)号：US20210217559A1

公开(公告)日：2021-07-15

申请号：US16912025

申请日：2020-06-25

Applicant: SAMSUNG ELECTRO-MECHANICS CO., LTD.

Inventor： Hyun Tae Kim ,  Beom Seock Oh ,  Tai Won Choi ,  Woo Soon Whang ,  Byoung Woo Kim ,  Yong Won Seo

IPC: H01G4/232 ,  H05K1/18

Abstract: A multilayer electronic component includes: a body including a dielectric layer and an internal electrode alternately disposed with the dielectric layer; and an external electrode including an electrode layer disposed on the body and an Sn plating layer disposed on the electrode layer. A thickness of the body is defined as Tb, a thickness of the Sn plating layer is defined as Ts, Tb is 0.22 mm or less, and Ts is 4.5 μm or more.

公开(公告)号：US10593473B2

公开(公告)日：2020-03-17

申请号：US15707618

申请日：2017-09-18

Applicant: SAMSUNG ELECTRO-MECHANICS CO., LTD.

Inventor： Min Cheol Park ,  Kyo Kwang Lee ,  Young Ghyu Ahn ,  Hyun Tae Kim ,  Sang Soo Park

IPC: H01G2/06 ,  H05K1/11 ,  H01G4/012 ,  H01G4/232 ,  H01G4/005 ,  H01G4/30 ,  H05K1/16 ,  H05K3/34

Abstract: A multilayer ceramic capacitor may include: a ceramic body including a plurality of dielectric layers; first and second internal electrodes disposed in the ceramic body, the first internal electrode having first and second lead portions exposed to a first surface of the ceramic body in a width direction, and the second internal electrode having a third lead portion exposed to the first surface of the ceramic body in the width direction; first to third external electrodes disposed on the first surface of the ceramic body in the width direction to be connected to the first to third lead portions, respectively; and an insulation layer disposed on the first surface of the ceramic body in the width direction. Each of the first and second lead portions may be spaced apart from the third lead portion by a predetermined distance.