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公开(公告)号：US20210118848A1
公开(公告)日：2021-04-22
申请号：US16883153
申请日：2020-05-26
Applicant: Samsung Electronics Co., Ltd.
Inventor： Ae-Nee JANG , Kyung Suk OH , Eunseok SONG , Seung-Yong CHA
IPC: H01L25/065 , H01L25/18
Abstract: A system-in-package module includes a substrate, an application specific integrated circuit (ASIC) chip on the substrate, first wafer level package (WLP) memories on the substrate spaced apart from the ASIC chip in a first direction parallel to an upper surface of the substrate, and second WLP memories on the substrate spaced apart from the ASIC chip in a direction opposite to the first direction.
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