公开(公告)号：US20140252444A1

公开(公告)日：2014-09-11

申请号：US14200610

申请日：2014-03-07

Applicant: SAMSUNG ELECTRONICS CO., LTD.

Inventor： Jang-Hyun YOU ,  Hyeong PARK ,  Bongtae PARK ,  Jeehoon HAN

IPC: H01L27/115

CPC classification number: H01L27/11521 ,  H01L23/528 ,  H01L23/53209 ,  H01L27/11519 ,  H01L27/11524 ,  H01L27/11548 ,  H01L29/42324 ,  H01L29/4933 ,  H01L29/513 ,  H01L29/7883 ,  H01L2924/0002 ,  H01L2924/00

Abstract: A semiconductor device includes a plurality of lines disposed on a semiconductor substrate, and remaining line patterns disposed spaced apart from the lines on extensions from the lines. The lines include first end-portions adjacent to the remaining line patterns. The remaining line patterns include second end-portions adjacent to the lines. The first end-portions and second end-portions are formed to have mirror symmetry with respect to each other.

Abstract translation: 半导体器件包括设置在半导体衬底上的多条线，以及与线路延伸线上间隔开的剩余线图案。 这些线包括与其余线图案相邻的第一端部。 剩余的线图案包括与线相邻的第二端部。 第一端部和第二端部形成为相对于彼此具有镜像对称性。