公开(公告)号：US20220254827A1

公开(公告)日：2022-08-11

申请号：US17731022

申请日：2022-04-27

Applicant: Samsung Electronics Co., Ltd.

Inventor： YONGHOE CHO ,  CHUNGSUN LEE ,  YOONHA JUNG ,  CHAJEA JO

IPC: H01L27/146 ,  H01L23/00 ,  H01L23/48 ,  H01L21/683

Abstract: Disclosed are a semiconductor package and a method of fabricating the same. The semiconductor package may include a semiconductor chip structure, a transparent substrate disposed on the semiconductor chip structure, a dam placed on an edge of the semiconductor chip structure and between the semiconductor chip structure and the transparent substrate, and an adhesive layer interposed between the dam and the semiconductor chip structure. The semiconductor chip structure may include an image sensor chip and a logic chip, which are in contact with each other, and the image sensor chip may be closer to the transparent substrate than the logic chip.