公开(公告)号：US20220415802A1

公开(公告)日：2022-12-29

申请号：US17683774

申请日：2022-03-01

Applicant: Samsung Electronics Co., Ltd.

Inventor： Dongkyu KIM ,  Seokkyu CHOI ,  Minjung KIM ,  Seokhyun LEE

IPC: H01L23/538 ,  H01L23/66 ,  H01L23/31 ,  H01L23/498 ,  H01L23/00

Abstract: A semiconductor package includes a redistribution substrate including a first surface and a second surface that are opposite to each other, an antenna substrate on the first surface and including a first insulating portion and antenna patterns on a top surface of the first insulating portion, and a first semiconductor chip on the second surface. The redistribution substrate includes a second insulating portion, and a redistribution pattern in the second insulating portion. The redistribution pattern includes an interconnection portion extending parallel to a top surface of the second insulating portion, and a via portion protruding from the interconnection portion toward the first surface. A width of the via portion decreases as a height in a direction from the second surface toward the first surface increases. The active surface of the first semiconductor chip is adjacent to the second surface.