公开(公告)号：US20220059444A1

公开(公告)日：2022-02-24

申请号：US17206291

申请日：2021-03-19

Applicant: Samsung Electronics Co., Ltd.

Inventor： JONGYOUN KIM ,  EUNGKYU KIM ,  GWANGJAE JEON

IPC: H01L23/498 ,  H01L23/00 ,  H01L21/48

Abstract: Disclosed are semiconductor packages and methods of fabricating the same. The semiconductor package comprises a redistribution substrate including dielectric and redistribution patterns, a first substrate pad on the redistribution substrate and penetrating the dielectric pattern to be coupled to the redistribution pattern, a second substrate pad the redistribution substrate and spaced apart from the first substrate pad, a semiconductor chip on the redistribution substrate, a first connection terminal connecting the first substrate pad to one of chip pads of the semiconductor chip, and a second connection terminal connecting the second substrate pad to another one of the chip pads of the semiconductor chip. A top surface of the second substrate pad is located at a higher level than that of a top surface of the first substrate pad. A width of the second substrate pad is less than that of the first substrate pad.