公开(公告)号：US20220367403A1

公开(公告)日：2022-11-17

申请号：US17711359

申请日：2022-04-01

Applicant: Samsung Electronics Co., Ltd.

Inventor： Seokhyun LEE ,  Dongkyu KIM ,  Kyounglim SUK ,  Hyeonjeong HWANG

IPC: H01L23/00 ,  H01L23/367 ,  H01L23/31 ,  H01L23/538 ,  H01L25/10 ,  H01L21/48 ,  H01L21/56

Abstract: A semiconductor package includes a redistribution substrate including a conductive structure having a lower conductive pattern and a redistribution structure electrically connected to the lower conductive pattern, on the lower conductive pattern, an insulating structure covering at least a side surface of the redistribution structure, and a protective layer between the lower conductive pattern and the insulating structure, a semiconductor chip on the redistribution substrate, and a lower connection pattern below the redistribution substrate and electrically connected to the lower conductive pattern. The protective layer includes a first portion in contact with at least a portion of an upper surface of the lower conductive pattern, and a second portion in contact with at least a portion of a side surface of the lower conductive pattern.