公开(公告)号：US20220346657A1

公开(公告)日：2022-11-03

申请号：US17471862

申请日：2021-09-10

Applicant: SAMSUNG ELECTRONICS CO., LTD.

Inventor： Yongjoo Kwon ,  Kyoungjun Kim ,  Joonhyung Lee ,  Yeolho Lee ,  Seolyoung Choi

IPC: A61B5/024 ,  H05B47/155 ,  G01J1/42 ,  A61B5/026 ,  A61B5/00

Abstract: Provided is an apparatus configured to detect a light signal, the apparatus including a light source configured to radiate light toward an object, a light receiver configured to receive an ambient light and a transmitted light corresponding to the light radiated toward the object from the light source, at least one processor configured to control the light source to be turned off such that a first output signal is generated by the light receiver and control the light source to be turned on such that a second output signal is generated by the light receiver, and an operator configured to generate a transmitted light signal from which noise is removed by differentially operating the second output signal from the first output signal.

公开(公告)号：US20220320397A1

公开(公告)日：2022-10-06

申请号：US17569323

申请日：2022-01-05

Applicant: Samsung Electronics Co., Ltd.

Inventor： Junghun Lee ,  Kyoungjun Kim ,  Seolyoung Choi

IPC: H01L33/62 ,  H01L33/60 ,  H01L33/56

Abstract: A semiconductor light emitting device package, includes: a ceramic substrate having first and second electrode structures; a light emitting diode chip mounted on the ceramic substrate, electrically connected to the first and second electrode structures, and configured to emit ultraviolet light; a sidewall structure disposed on the ceramic substrate, providing a cavity surrounding the light emitting diode chip, and including an alloy having a thermal expansion coefficient in a range of 2 to 10 ppm/° C. and a Young's modulus in a range of 100 to 300 Gpa; and a glass cover disposed on the sidewall structure to seal the cavity.