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公开(公告)号：US20230011141A1
公开(公告)日：2023-01-12
申请号：US17689026
申请日：2022-03-08
Applicant: SAMSUNG ELECTRONICS CO., LTD.
Inventor： Junghun Lee , Kyoungjun Kim , Sun Kim , Seolyoung Choi
Abstract: A semiconductor light emitting device package includes a circuit board with an upper pad, a light emitting diode chip on the circuit board and having a first surface facing the circuit board and a second surface opposing the first surface, and the light emitting diode chip including a substrate, a semiconductor stack structure on the substrate that emits ultraviolet light, and electrodes connected to the semiconductor stack structure, connection bumps between the circuit board and the light emitting diode chip, the connection bumps connecting the upper pad and the electrodes, an underfill resin on the upper pad of the circuit board and covering at least a portion of a side surface of the light emitting diode chip, and a passivation layer on the light emitting diode chip and the underfill resin, the passivation layer covering the underfill resin and being spaced apart from the semiconductor stack structure.
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公开(公告)号：US11670576B2
公开(公告)日：2023-06-06
申请号：US17060248
申请日：2020-10-01
Applicant: SAMSUNG ELECTRONICS CO., LTD.
Inventor： Jongsup Song , Seolyoung Choi
IPC: H01L23/498 , H01L25/16 , H01L23/00 , H01L23/13 , H01L23/367 , H05K1/11 , H05K1/18 , H01S5/024 , H01S5/0234 , H01S5/02253
CPC classification number: H01L23/49827 , H01L23/13 , H01L23/367 , H01L23/49838 , H01L24/32 , H01L24/73 , H01L25/165 , H01L25/167 , H01S5/0234 , H01S5/02253 , H01S5/02469 , H05K1/112 , H05K1/181 , H01L2224/32227 , H01L2224/73265
Abstract: A wiring board includes: a metal plate having first and second surfaces opposite to each other, and having at least one through-hole penetrating through the first and second surfaces; at least one conductive via respectively disposed in the through-hole and spaced apart from the metal plate; an insulating structure including at least one through-insulating portion disposed between the through-hole and the conductive via, and a first insulating layer and a second insulating layer extending from the through-insulating portion and disposed in first regions surrounding the conductive via, on the first surface and the second surface, respectively; at least one first upper pad disposed on the first insulating layer and electrically connected to the conductive via; at least one first lower pad disposed on the second insulating layer and electrically connected to the conductive via; a second upper pad disposed on the first surface of the metal plate; and a second lower pad disposed on the second surface of the metal plate and electrically connected to the first upper pad through the metal plate.
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公开(公告)号：US12125954B2
公开(公告)日：2024-10-22
申请号：US17689026
申请日：2022-03-08
Applicant: SAMSUNG ELECTRONICS CO., LTD.
Inventor： Junghun Lee , Kyoungjun Kim , Sun Kim , Seolyoung Choi
CPC classification number: H01L33/56 , H01L25/13 , H01L33/06 , H01L33/32 , H01L33/44 , H01L33/486 , H01L33/62 , H01L2933/0025 , H01L2933/005
Abstract: A semiconductor light emitting device package includes a circuit board with an upper pad, a light emitting diode chip on the circuit board and having a first surface facing the circuit board and a second surface opposing the first surface, and the light emitting diode chip including a substrate, a semiconductor stack structure on the substrate that emits ultraviolet light, and electrodes connected to the semiconductor stack structure, connection bumps between the circuit board and the light emitting diode chip, the connection bumps connecting the upper pad and the electrodes, an underfill resin on the upper pad of the circuit board and covering at least a portion of a side surface of the light emitting diode chip, and a passivation layer on the light emitting diode chip and the underfill resin, the passivation layer covering the underfill resin and being spaced apart from the semiconductor stack structure.
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公开(公告)号：US20210356844A1
公开(公告)日：2021-11-18
申请号：US17118747
申请日：2020-12-11
Applicant: SAMSUNG ELECTRONICS CO., LTD.
Inventor： Jongsup Song , Seolyoung Choi
IPC: G03B15/05 , G02B5/20 , H01S5/02212 , H01S5/02253 , H01S5/42 , H04N5/225
Abstract: A light source package includes: a substrate; a first light source device disposed on the substrate, and configured to emit a light of a first wavelength; a second light source device disposed to be spaced apart from the first light source on the substrate, and configured to emit a light of a second wavelength, different from the first wavelength; and a light transmissive structure disposed above first and second light source devices, and including at least one first lens configured to increase a beam angle of the light of the first wavelength and at least one second lens configured to reduce a beam angle of the light of the second wavelength.
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公开(公告)号：US20210043614A1
公开(公告)日：2021-02-11
申请号：US16848592
申请日：2020-04-14
Applicant: SAMSUNG ELECTRONICS CO., LTD.
Inventor： Jongsup Song , Tetsuo Ariyoshi , Taehyun Lee , Seolyoung Choi
Abstract: A light emitting diode (LED) module includes a substrate, an LED package, a light sensor and a lens. The LED package includes a light emitting region and is mounted on an upper surface of the substrate. The light sensor includes a light receiving region and is mounted on the upper surface of the substrate horizontally adjacent the LED package. The lens is vertically aligned over the light emitting region of the LED package and at least partially overlaps the light receiving region of the light sensor.
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Patent Agency Ranking
公开(公告)号：US20230039410A1
公开(公告)日：2023-02-09
申请号：US17730336
申请日：2022-04-27
Applicant: SAMSUNG ELECTRONICS CO., LTD.
Inventor： Junghun Lee , Kyoungjun Kim , Sun Kim , Seolyoung Choi
Abstract: A semiconductor ultraviolet light emitting device package is provided. The semiconductor ultraviolet light emitting device package includes: a semiconductor ultraviolet light emitting device mounted on the first surface of the package substrate and configured to emit deep ultraviolet light including a wavelength in a range of 250 nm to 285 nm; a reflector disposed on the first surface of the package substrate to surround the semiconductor ultraviolet light emitting device, and including an inclined sidewall that defines an opening of the reflector, the semiconductor ultraviolet light emitting device disposed within the opening; and a light transmitting cover including a lower surface covering the opening and an upper surface opposite to the lower surface, wherein an antireflective layer is disposed on at least one from among the lower surface and the upper surface.
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公开(公告)号：US11333953B2
公开(公告)日：2022-05-17
申请号：US17118747
申请日：2020-12-11
Applicant: SAMSUNG ELECTRONICS CO., LTD.
Inventor： Jongsup Song , Seolyoung Choi
IPC: G03B15/05 , G02B5/20 , H01S5/02212 , H01S5/02253 , H04N5/225 , H01S5/42
Abstract: A light source package includes: a substrate; a first light source device disposed on the substrate, and configured to emit a light of a first wavelength; a second light source device disposed to be spaced apart from the first light source on the substrate, and configured to emit a light of a second wavelength, different from the first wavelength; and a light transmissive structure disposed above first and second light source devices, and including at least one first lens configured to increase a beam angle of the light of the first wavelength and at least one second lens configured to reduce a beam angle of the light of the second wavelength.
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公开(公告)号：US11217574B2
公开(公告)日：2022-01-04
申请号：US16848592
申请日：2020-04-14
Applicant: SAMSUNG ELECTRONICS CO., LTD.
Inventor： Jongsup Song , Tetsuo Ariyoshi , Taehyun Lee , Seolyoung Choi
Abstract: A light emitting diode (LED) module includes a substrate, an LED package, a light sensor and a lens. The LED package includes a light emitting region and is mounted on an upper surface of the substrate. The light sensor includes a light receiving region and is mounted on the upper surface of the substrate horizontally adjacent the LED package. The lens is vertically aligned over the light emitting region of the LED package and at least partially overlaps the light receiving region of the light sensor.
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公开(公告)号：US12288837B2
公开(公告)日：2025-04-29
申请号：US17569323
申请日：2022-01-05
Applicant: Samsung Electronics Co., Ltd.
Inventor： Junghun Lee , Kyoungjun Kim , Seolyoung Choi
Abstract: A semiconductor light emitting device package, includes: a ceramic substrate having first and second electrode structures; a light emitting diode chip mounted on the ceramic substrate, electrically connected to the first and second electrode structures, and configured to emit ultraviolet light; a sidewall structure disposed on the ceramic substrate, providing a cavity surrounding the light emitting diode chip, and including an alloy having a thermal expansion coefficient in a range of 2 to 10 ppm/° C. and a Young's modulus in a range of 100 to 300 Gpa; and a glass cover disposed on the sidewall structure to seal the cavity.
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公开(公告)号：US12144597B2
公开(公告)日：2024-11-19
申请号：US17471862
申请日：2021-09-10
Applicant: SAMSUNG ELECTRONICS CO., LTD.
Inventor： Yongjoo Kwon , Kyoungjun Kim , Joonhyung Lee , Yeolho Lee , Seolyoung Choi
IPC: A61B5/024 , A61B5/00 , A61B5/026 , G01J1/42 , H05B47/155
Abstract: Provided is an apparatus configured to detect a light signal, the apparatus including a light source configured to radiate light toward an object, a light receiver configured to receive an ambient light and a transmitted light corresponding to the light radiated toward the object from the light source, at least one processor configured to control the light source to be turned off such that a first output signal is generated by the light receiver and control the light source to be turned on such that a second output signal is generated by the light receiver, and an operator configured to generate a transmitted light signal from which noise is removed by differentially operating the second output signal from the first output signal.
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