公开(公告)号：US20140217606A1

公开(公告)日：2014-08-07

申请号：US14173888

申请日：2014-02-06

Applicant: Samsung Electronics Co., Ltd.

Inventor： Seong-ho CHO

IPC: H01L23/522

CPC classification number: H01L23/5226 ,  H01L24/18 ,  H01L27/14618 ,  H01L2924/12041 ,  H01L2924/12042 ,  H01L2924/00

Abstract: A three-dimensional monolithic electronic-photonic integrated circuit and a method of manufacturing the same. The electronic-photonic integrated circuit may include a photonic element formed in a sealed space of a substrate and an electronic element formed on the substrate. The substrate may include a first substrate and a second substrate that are bonded to each other. The first substrate having a first trench corresponding to the sealed space formed therein, a first surface of the second substrate having the photonic element formed thereon, and the sealed space defined by a space formed inside the first trench that is sealed by the first surface of the second substrate.

Abstract translation: 一种三维单片电子光子集成电路及其制造方法。 电子光子集成电路可以包括形成在基板的密封空间中的光子元件和形成在基板上的电子元件。 衬底可以包括彼此结合的第一衬底和第二衬底。 第一衬底具有对应于其中形成的密封空间的第一沟槽，第二衬底的具有形成在其上的光子元件的第一表面，以及由形成在第一沟槽内部的空间限定的密封空间，该空间由第一沟槽的第一表面 第二基板。