公开(公告)号：US12125834B2

公开(公告)日：2024-10-22

申请号：US17377268

申请日：2021-07-15

申请人： SAMSUNG DISPLAY CO., LTD.

发明人： Bek Hyun Lim ,  Jung-Hwan Yi ,  Hee Keun Lee

IPC分类号： H01L29/18 ,  H01L23/00 ,  H01L25/16 ,  H01L33/00 ,  H01L27/12 ,  H01L33/62

CPC分类号： H01L25/167 ,  H01L24/95 ,  H01L27/124 ,  H01L33/62 ,  H01L2224/95102 ,  H01L2224/95145 ,  H01L2924/12041

摘要： A display device includes a first substrate; a first conductive pattern, a first voltage line and a second voltage line on the first substrate; an insulating layer on the first conductive pattern and the second voltage line; a plurality of first light-emitting elements on the insulating layer; a first electrode on the insulating layer and connected to the first conductive pattern, the first electrode overlapping the first voltage line; and a second electrode on the insulating layer and connected to the second voltage line, wherein the plurality of first light-emitting elements are in contact with the first electrode and the second electrode, and wherein a part of an upper surface of the first electrode that overlaps the first conductive pattern and a part of the upper surface of the first electrode that overlaps the first voltage line are located on the same plane.

公开(公告)号：US12113039B2

公开(公告)日：2024-10-08

申请号：US17245397

申请日：2021-04-30

申请人： ALPHA ASSEMBLY SOLUTIONS INC.

发明人： Shamik Ghoshal ,  Nirmalya Kumar Chaki ,  Poulami Sengupta Roy ,  Siuli Sarkar ,  Anubhav Rustogi

IPC分类号： H01L23/00 ,  B22F1/052 ,  B22F1/102 ,  B22F1/107 ,  B22F1/17 ,  B22F7/04 ,  B23K1/00 ,  B23K35/02 ,  B23K35/30 ,  B23K35/36 ,  B23K35/365 ,  B23K101/40 ,  B23K103/00 ,  H01B1/22 ,  H01L25/00 ,  H05K3/32 ,  H10K50/842

CPC分类号： H01L24/29 ,  B22F1/052 ,  B22F1/102 ,  B22F1/107 ,  B22F1/17 ,  B22F7/04 ,  B23K1/0016 ,  B23K35/025 ,  B23K35/3006 ,  B23K35/3601 ,  B23K35/3613 ,  B23K35/3618 ,  B23K35/365 ,  H01B1/22 ,  H01L24/11 ,  H01L24/13 ,  H01L24/27 ,  H01L24/32 ,  H01L24/81 ,  H01L24/83 ,  B22F2007/047 ,  B22F2301/255 ,  B22F2302/45 ,  B23K2101/40 ,  B23K2103/56 ,  H01L24/16 ,  H01L24/48 ,  H01L24/73 ,  H01L24/92 ,  H01L25/50 ,  H01L2224/0401 ,  H01L2224/04026 ,  H01L2224/05155 ,  H01L2224/05644 ,  H01L2224/11003 ,  H01L2224/1132 ,  H01L2224/11334 ,  H01L2224/131 ,  H01L2224/13339 ,  H01L2224/13347 ,  H01L2224/13355 ,  H01L2224/13387 ,  H01L2224/1339 ,  H01L2224/13439 ,  H01L2224/1349 ,  H01L2224/13499 ,  H01L2224/16227 ,  H01L2224/27003 ,  H01L2224/271 ,  H01L2224/27332 ,  H01L2224/27436 ,  H01L2224/27505 ,  H01L2224/2929 ,  H01L2224/29339 ,  H01L2224/29347 ,  H01L2224/29355 ,  H01L2224/29387 ,  H01L2224/2939 ,  H01L2224/29439 ,  H01L2224/2949 ,  H01L2224/29499 ,  H01L2224/32145 ,  H01L2224/32146 ,  H01L2224/32225 ,  H01L2224/32245 ,  H01L2224/48227 ,  H01L2224/48247 ,  H01L2224/73265 ,  H01L2224/81075 ,  H01L2224/81192 ,  H01L2224/81203 ,  H01L2224/8121 ,  H01L2224/8184 ,  H01L2224/81948 ,  H01L2224/83075 ,  H01L2224/83191 ,  H01L2224/83192 ,  H01L2224/83203 ,  H01L2224/8321 ,  H01L2224/83439 ,  H01L2224/83447 ,  H01L2224/8384 ,  H01L2224/83948 ,  H01L2224/92247 ,  H01L2224/94 ,  H01L2924/00014 ,  H01L2924/0665 ,  H01L2924/12041 ,  H01L2924/12044 ,  H01L2924/1461 ,  H01L2924/20102 ,  H01L2924/20103 ,  H01L2924/20104 ,  H01L2924/20105 ,  H01L2924/20106 ,  H01L2924/20107 ,  H01L2924/20108 ,  H01L2924/20109 ,  H01L2924/2011 ,  H01L2924/206 ,  H01L2924/2064 ,  H05K3/321 ,  H10K50/8426 ,  H01L2224/83203 ,  H01L2924/00012 ,  H01L2224/94 ,  H01L2224/83 ,  H01L2224/29339 ,  H01L2924/0105 ,  H01L2224/29339 ,  H01L2924/01046 ,  H01L2224/29339 ,  H01L2924/01047 ,  H01L2224/29339 ,  H01L2924/01029 ,  H01L2224/29339 ,  H01L2924/01028 ,  H01L2224/29439 ,  H01L2924/00014 ,  H01L2224/29355 ,  H01L2924/00014 ,  H01L2224/29347 ,  H01L2924/01028 ,  H01L2224/29347 ,  H01L2924/01028 ,  H01L2924/0103 ,  H01L2224/29387 ,  H01L2924/0493 ,  H01L2924/01004 ,  H01L2224/2949 ,  H01L2924/00012 ,  H01L2224/2939 ,  H01L2924/0665 ,  H01L2224/271 ,  H01L2924/00014 ,  H01L2224/27436 ,  H01L2924/00014 ,  H01L2224/94 ,  H01L2224/27 ,  H01L2224/05155 ,  H01L2924/00014 ,  H01L2224/05644 ,  H01L2924/00014 ,  H01L2224/83439 ,  H01L2924/00014 ,  H01L2224/83447 ,  H01L2924/01074 ,  H01L2224/8321 ,  H01L2924/00014 ,  H01L2224/81203 ,  H01L2924/00012 ,  H01L2224/94 ,  H01L2224/81 ,  H01L2224/13339 ,  H01L2924/0105 ,  H01L2224/13339 ,  H01L2924/01046 ,  H01L2224/13339 ,  H01L2924/01047 ,  H01L2224/13339 ,  H01L2924/01029 ,  H01L2224/13339 ,  H01L2924/01028 ,  H01L2224/13439 ,  H01L2924/00014 ,  H01L2224/13355 ,  H01L2924/00014 ,  H01L2224/13347 ,  H01L2924/01028 ,  H01L2224/13347 ,  H01L2924/01028 ,  H01L2924/0103 ,  H01L2224/13387 ,  H01L2924/0493 ,  H01L2924/01004 ,  H01L2224/1349 ,  H01L2924/00012 ,  H01L2224/1339 ,  H01L2924/0665 ,  H01L2224/131 ,  H01L2924/00014 ,  H01L2224/11436 ,  H01L2924/00014 ,  H01L2224/94 ,  H01L2224/11 ,  H01L2224/8121 ,  H01L2924/00014 ,  H01L2924/00014 ,  H01L2224/45099 ,  H01L2224/1132 ,  H01L2924/00014 ,  H01L2224/73265 ,  H01L2224/32225 ,  H01L2224/48227 ,  H01L2924/00012 ,  H01L2224/73265 ,  H01L2224/32245 ,  H01L2224/48247 ,  H01L2924/00012 ,  H01L2224/73265 ,  H01L2224/32145 ,  H01L2224/48247 ,  H01L2924/00 ,  H01L2224/73265 ,  H01L2224/32145 ,  H01L2224/48227 ,  H01L2924/00 ,  H01L2224/92247 ,  H01L2224/73265 ,  H01L2224/32225 ,  H01L2224/48227 ,  H01L2924/00 ,  H01L2224/92247 ,  H01L2224/73265 ,  H01L2224/32245 ,  H01L2224/48247 ,  H01L2924/00

摘要： A sintering powder comprising:



a first type of metal particles having a mean longest dimension of from 100 nm to 50 μm.

公开(公告)号：US12094864B2

公开(公告)日：2024-09-17

申请号：US18315758

申请日：2023-05-11

申请人： Apple Inc.

发明人： Andreas Bibl ,  Charles R. Griggs

IPC分类号： H01L25/16 ,  H01L23/00 ,  H01L25/075 ,  H01L27/02 ,  H01L27/12 ,  H01L33/00 ,  H01L33/06 ,  H01L33/08 ,  H01L33/20 ,  H01L33/30 ,  H01L33/44 ,  H01L33/48 ,  H01L33/52 ,  H01L33/54 ,  H01L33/56 ,  H01L33/60 ,  H01L33/62

CPC分类号： H01L25/167 ,  H01L24/95 ,  H01L25/0753 ,  H01L25/165 ,  H01L27/0203 ,  H01L27/124 ,  H01L27/1244 ,  H01L33/0008 ,  H01L33/06 ,  H01L33/08 ,  H01L33/20 ,  H01L33/30 ,  H01L33/44 ,  H01L33/486 ,  H01L33/52 ,  H01L33/54 ,  H01L33/56 ,  H01L33/60 ,  H01L33/62 ,  H01L2924/0002 ,  H01L2924/12041 ,  H01L2924/12042 ,  H01L2924/12044 ,  H01L2933/0025 ,  H01L2933/0033 ,  H01L2933/005 ,  H01L2933/0066 ,  H01L2924/0002 ,  H01L2924/00 ,  H01L2924/12041 ,  H01L2924/00 ,  H01L2924/12042 ,  H01L2924/00 ,  H01L2924/12044 ,  H01L2924/00

摘要： Light emitting devices and methods of integrating micro LED devices into light emitting device are described. In an embodiment a light emitting device includes a reflective bank structure within a bank layer, and a conductive line atop the bank layer and elevated above the reflective bank structure. A micro LED device is within the reflective bank structure and a passivation layer is over the bank layer and laterally around the micro LED device within the reflective bank structure. A portion of the micro LED device and a conductive line atop the bank layer protrude above a top surface of the passivation layer.

公开(公告)号：US20240304611A1

公开(公告)日：2024-09-12

申请号：US18440172

申请日：2024-02-13

申请人： SEMICONDUCTOR ENERGY LABORATORY CO., LTD.

发明人： Shunpei YAMAZAKI ,  Koji KUSUNOKI ,  Shingo EGUCHI ,  Takayuki IKEDA

IPC分类号： H01L25/18 ,  G06F3/044 ,  H01L23/00 ,  H01L25/00 ,  H01L25/065 ,  H01L25/16 ,  H01L27/12 ,  H01L27/15 ,  H01L33/00

CPC分类号： H01L25/18 ,  G06F3/044 ,  H01L24/94 ,  H01L25/0657 ,  H01L25/167 ,  H01L25/50 ,  H01L33/0093 ,  G06F2203/04103 ,  H01L24/16 ,  H01L27/1225 ,  H01L27/156 ,  H01L2224/16145 ,  H01L2225/06513 ,  H01L2924/12041

摘要： A display device with high resolution is provided. A display device with high display quality is provided. The display device includes a substrate, an insulating layer, a plurality of transistors, and a plurality of light-emitting diodes. The plurality of light-emitting diodes are provided in a matrix over the substrate. Each of the plurality of transistors is electrically connected to at least one of the plurality of light-emitting diodes. The plurality of light-emitting diodes are positioned closer to the substrate than the plurality of transistors are. The plurality of light-emitting diodes emit light toward the substrate. Each of the plurality of transistors includes a metal oxide layer and a gate electrode. The metal oxide layer includes a channel formation region. The top surface of the gate electrode is substantially level with the top surface of the insulating layer.

公开(公告)号：US12087743B2

公开(公告)日：2024-09-10

申请号：US17621060

申请日：2020-07-30

申请人： OSRAM Opto Semiconductors GmbH

发明人： Andreas Dobner ,  Hubert Halbritter

IPC分类号： B60Q3/208 ,  B32B17/10 ,  B60J1/00 ,  B60Q1/24 ,  B60Q1/50 ,  H01L25/075 ,  H01L25/16 ,  H01L23/00 ,  H01L33/62

CPC分类号： H01L25/0753 ,  B32B17/10036 ,  B32B17/10477 ,  B32B17/10504 ,  B32B17/10513 ,  B60J1/001 ,  B60Q1/247 ,  B60Q1/50 ,  B60Q1/5035 ,  B60Q1/507 ,  B60Q1/543 ,  B60Q3/208 ,  H01L25/167 ,  B32B2307/412 ,  B32B2605/006 ,  H01L24/05 ,  H01L24/08 ,  H01L33/62 ,  H01L2224/05573 ,  H01L2224/05647 ,  H01L2224/05686 ,  H01L2224/08145 ,  H01L2224/08225 ,  H01L2924/0549 ,  H01L2924/12041

摘要： A light-emitting window element includes a transparent first carrier layer, a transparent second carrier layer, a substrate with a plurality of light-emitting semiconductor chips arranged thereon, and an optical layer having an adjustable transparency. The substrate with the plurality of light-emitting semiconductor chips and the optical layer are arranged between the first and second carrier layers, and the first and second carrier layers, the substrate with the plurality of light-emitting semiconductor chips and the optical layer form a laminate composite.

公开(公告)号：US20240274773A1

公开(公告)日：2024-08-15

申请号：US18642363

申请日：2024-04-22

申请人： SAMSUNG ELECTRONICS CO., LTD.

发明人： Changjoon LEE ,  Kyungwoon JANG

IPC分类号： H01L33/62 ,  H01L23/00 ,  H01L25/075

CPC分类号： H01L33/62 ,  H01L24/29 ,  H01L24/32 ,  H01L24/83 ,  H01L25/0753 ,  H01L2224/29028 ,  H01L2224/32225 ,  H01L2224/83203 ,  H01L2924/12041 ,  H01L2933/0066

摘要： A display panel manufacturing method includes: putting a first substrate into a liquid; putting a plurality of light emitting diodes into the liquid in which the first substrate is put; performing fluidic self-assembly to attach the plurality of light emitting diodes to the first substrate; transferring the plurality of light emitting diodes attached to the first substrate to a second substrate; and thermally compressing the plurality of light emitting diodes transferred to the second substrate onto the second substrate.

公开(公告)号：US20240258465A1

公开(公告)日：2024-08-01

申请号：US18221984

申请日：2023-07-14

申请人： LG Display Co., Ltd.

发明人： Minjae KANG ,  Dongseok LEE ,  Jusang RHIM ,  Sunghwan YOON ,  Yuseop SHIN ,  Rokhee LEE

IPC分类号： H01L33/40 ,  G09G3/32 ,  H01L23/00 ,  H01L25/16 ,  H01L33/48 ,  H01L33/62

CPC分类号： H01L33/40 ,  G09G3/32 ,  H01L24/24 ,  H01L25/167 ,  H01L33/483 ,  H01L33/62 ,  G09G2300/0842 ,  H01L33/20 ,  H01L2224/24051 ,  H01L2224/24145 ,  H01L2224/245 ,  H01L2924/0549 ,  H01L2924/12041 ,  H01L2933/0066

摘要： A display device includes a base substrate including a display area and a circuit area; a planarization layer disposed on the base substrate; a plurality of debossing grooves defined in the planarization layer and disposed on the display area of the base substrate; at least one light-emitting element aligned with and received in each of the debossing grooves, wherein the light-emitting element includes a first semiconductor layer, an active layer, a second semiconductor layer, and a first electrode contacting the first semiconductor layer; a second electrode line contacting the second semiconductor layer of the light-emitting element; and a first electrode line electrically connected to the first electrode.

公开(公告)号：US20240258294A1

公开(公告)日：2024-08-01

申请号：US18599167

申请日：2024-03-07

申请人： Jade Bird Display (Shanghai) Limited

发明人： Qunchao Xu ,  Huiwen Xu ,  Qiming Li

IPC分类号： H01L25/16 ,  H01L23/00 ,  H01L33/30 ,  H01L33/32 ,  H01L33/40 ,  H01L33/58 ,  H01L33/60 ,  H01L33/62

CPC分类号： H01L25/167 ,  H01L24/32 ,  H01L24/33 ,  H01L24/73 ,  H01L33/405 ,  H01L33/58 ,  H01L33/60 ,  H01L33/62 ,  H01L33/30 ,  H01L33/32 ,  H01L2224/29144 ,  H01L2224/29188 ,  H01L2224/2919 ,  H01L2224/29582 ,  H01L2224/29669 ,  H01L2224/29671 ,  H01L2224/32145 ,  H01L2224/33181 ,  H01L2224/73217 ,  H01L2224/73267 ,  H01L2924/12041 ,  H01L2924/1426

摘要： A micro multi-color LED device includes two or more LED structures for emitting a range of colors. The two or more LED structures are vertically stacked to combine light from the two more LED structures. Light from the micro multi-color LED device is emitted horizontally from each of the LED structures and reflected upward via some reflective structures. In some embodiments, each LED structure is connected to a pixel driver and/or a common electrode. The LED structures are bonded together through bonding layers. In some embodiments, planarization layers enclose each of the LED structures or the micro multi-color LED device. In some embodiments, one or more of reflective layers, refractive layers, micro-lenses, spacers, and reflective cup structures are implemented in the device to improve the LED emission efficiency. A display panel comprising an array of the micro tri-color LED devices has a high resolution and a high illumination brightness.

公开(公告)号：US20240241231A1

公开(公告)日：2024-07-18

申请号：US18391655

申请日：2023-12-21

申请人： Meta Platforms Technologies, LLC

发明人： Jack Diepen Mumbo ,  Rajendra D. Pendse ,  Alexandra Gualdino ,  Jaspreet Singh Gandhi ,  Jeremiah Nyaribo ,  Harish Venkataraman ,  Gregory Cohoon

IPC分类号： G01S7/4865 ,  G01S7/481 ,  G01S17/10 ,  H01L23/00 ,  H01L31/107

CPC分类号： G01S7/4865 ,  G01S7/4811 ,  G01S17/10 ,  H01L24/16 ,  H01L24/48 ,  H01L24/73 ,  H01L31/107 ,  H01L2224/16225 ,  H01L2224/48225 ,  H01L2224/73207 ,  H01L2924/12041

摘要： A time-of-flight (ToF) module includes a light source, a driver module, and a light sensor. The driver module includes electrical circuitry configured to selectively drive the light source to emit pulsed illumination light. The light sensor is configured to sense returning light reflected from a target. At least one of the light source, driver module, and light sensor is stacked on another to reduce a footprint of the ToF module.

公开(公告)号：US20240178208A1

公开(公告)日：2024-05-30

申请号：US18192645

申请日：2023-03-30

申请人： TCL CHINA STAR OPTOELECTRONICS TECHNOLOGY CO., LTD.

发明人： Hongzhao DENG

IPC分类号： H01L25/16 ,  H01L23/00

CPC分类号： H01L25/167 ,  H01L24/11 ,  H01L24/13 ,  H01L24/81 ,  H01L24/16 ,  H01L2224/11003 ,  H01L2224/1111 ,  H01L2224/13016 ,  H01L2224/13111 ,  H01L2224/16145 ,  H01L2224/81024 ,  H01L2224/81815 ,  H01L2924/12041

摘要： A manufacturing method of a light-emitting substrate and a display device are provided. The manufacturing method includes: providing a substrate provided with a plurality of electrodes, forming a patterned photoresist layer including openings exposing the electrodes on a surface of the substrate, forming connecting parts in the openings, removing the patterned photoresist layer, and bonding a plurality of light-emitting elements on the connecting parts, wherein slope angles of a plurality of connecting part sidewalls of the connecting parts are ranged between 40° and 140°. The method could improve a yield rate of light-emitting elements bonded to electrodes through connecting parts.