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    ATHERMAL WAVEGUIDE AND METHOD OF MANUFACTURING THE SAME
    1.
    发明申请
    ATHERMAL WAVEGUIDE AND METHOD OF MANUFACTURING THE SAME 审中-公开
    高温波及其制造方法

    公开(公告)号：US20140212104A1

    公开(公告)日：2014-07-31

    申请号：US13950659

    申请日：2013-07-25

    申请人： Samsung Electronics Co., Ltd.

    发明人： Seong-ho CHO ,  Rakib Uddin MOHAMMAD

    IPC分类号： G02B6/136

    CPC分类号： G02B6/136 ,  G02B6/12028 ,  G02B6/1203 ,  G02B6/122 ,  G02B6/1221 ,  G02B2006/12097

    摘要： Provided are an athermal waveguide and a method of manufacturing the same. The athermal waveguide includes: a substrate having a protruded region; a first material layer formed on the protruded region to counteract thermal expansion; and a second material layer formed on the first material layer a position corresponding to the protruded region and formed of a same base material as the protruded region.

    摘要翻译： 提供一种无热波导及其制造方法。 该无热波导包括：具有突出区域的基板; 形成在突出区域上以抵抗热膨胀的第一材料层; 以及第二材料层，其在所述第一材料层上形成与所述突出区域对应的位置，并由与所述突出区域相同的基材形成。

    METHOD OF FABRICATING OPTOELECTRONIC INTEGRATED CIRCUIT SUBSTRATE
    3.
    发明申请
    METHOD OF FABRICATING OPTOELECTRONIC INTEGRATED CIRCUIT SUBSTRATE 有权
    制造光电集成电路基板的方法

    公开(公告)号：US20140141546A1

    公开(公告)日：2014-05-22

    申请号：US13868497

    申请日：2013-04-23

    申请人： SAMSUNG ELECTRONICS CO., LTD.

    发明人： Seong-ho CHO

    IPC分类号： H01L21/762

    CPC分类号： H01L21/762 ,  G02B6/13 ,  G02B6/136 ,  H01L21/76229

    摘要： A method of fabricating an optoelectronic integrated circuit substrate includes defining a photonic device region on a first substrate, the photonic device region having a photonic device formed thereon, forming a trench in the photonic device region on a top surface of the first substrate, the trench having a first depth, filling the trench with a dielectric, bonding a second substrate on the first substrate to cover the trench, and thinning the second substrate to a first thickness.

    摘要翻译： 制造光电子集成电路衬底的方法包括在第一衬底上限定光子器件区域，所述光子器件区域具有形成在其上的光子器件，在第一衬底的顶表面上的光子器件区域中形成沟槽，沟槽 具有第一深度，用电介质填充所述沟槽，将所述第一衬底上的第二衬底接合以覆盖所述沟槽，以及将所述第二衬底减薄到第一厚度。

    MULTICHIP PACKAGE HAVING OPTICAL INTERCONNECTION
    5.
    发明申请
    MULTICHIP PACKAGE HAVING OPTICAL INTERCONNECTION 审中-公开
    具有光学互连的多媒体包

    公开(公告)号：US20140140658A1

    公开(公告)日：2014-05-22

    申请号：US14059874

    申请日：2013-10-22

    申请人： SAMSUNG ELECTRONICS CO., LTD.

    发明人： Seong-ho CHO

    IPC分类号： G02B6/12

    CPC分类号： G02B6/12004 ,  G02B6/12002 ,  G02B6/4214 ,  G02B6/43

    摘要： A multichip package that includes a first optoelectronic chip including, a first substrate having a first surface; a first optical device disposed on the first surface; a first waveguide transmitting light from the first optical device in a direction parallel to the first surface; and a first mirror reflecting light from the first waveguide in an upward direction; and a second optoelectronic chip stacked on the first optoelectronic chip including, a second substrate having a second surface facing the first surface; a second mirror disposed on the second surface, the second mirror facing the first mirror to optically interconnect to the first optoelectronic chip, the second mirror reflecting light received from the first mirror in a direction parallel to the second surface, a second waveguide transmitting light received by the second mirror, and a second optical device to which light from the second waveguide is incident.

    摘要翻译： 一种多芯片封装，包括第一光电芯片，其包括具有第一表面的第一基板; 设置在第一表面上的第一光学装置; 第一波导，在与第一表面平行的方向上从第一光学器件传输光; 以及在向上方向上反射来自第一波导的光的第一镜; 以及堆叠在所述第一光电子芯片上的第二光电芯片，包括具有面向所述第一表面的第二表面的第二基板; 第二反射镜，设置在所述第二表面上，所述第二镜面向所述第一反射镜以光学地互连到所述第一光电芯片，所述第二反射镜在平行于所述第二表面的方向上反射从所述第一反射镜接收的光;第二波导， 以及第二光学装置，来自第二波导的光入射到该第二光学装置。

    OPTOELECTRONIC CHIPS INCLUDING COUPLER REGION AND METHODS OF MANUFACTURING THE SAME
    6.
    发明申请
    OPTOELECTRONIC CHIPS INCLUDING COUPLER REGION AND METHODS OF MANUFACTURING THE SAME 有权
    光耦合器包括耦合器区域及其制造方法

    公开(公告)号：US20130163919A1

    公开(公告)日：2013-06-27

    申请号：US13768204

    申请日：2013-02-15

    申请人： Samsung Electronics Co., Ltd.

    发明人： Seong-ho CHO

    IPC分类号： G02B6/12 ,  H01L21/82

    CPC分类号： G02B6/12 ,  G02B6/1347 ,  G02B6/4214 ,  G02B2006/12104 ,  H01L21/82

    摘要： An optoelectronic chip, and/or a method of manufacturing the same, include a substrate; a coupler region surrounded by the substrate. The coupler region includes a total reflection surface. The total reflection surface is configured to totally reflect a first light incident through a surface of the substrate such that the reflected first light travels within the substrate, or the total reflection surface is configured to totally reflect a second light guided in the substrate and incident on the total reflecting surface such that the reflected second light travels through the surface of the substrate.

    摘要翻译： 光电子芯片和/或其制造方法包括：基板; 由衬底包围的耦合器区域。 耦合器区域包括全反射面。 全反射面被配置为完全反射通过基板的表面入射的第一光，使得反射的第一光在基板内行进，或者全反射表面被配置为完全反射在基板中引导的第二光并入射到 全反射表面使得反射的第二光穿过基板的表面。

    TRANSISTORS, METHODS OF MANUFACTURING THE SAME, AND ELECTRONIC DEVICES INCLUDING THE TRANSISTORS
    7.
    发明申请
    TRANSISTORS, METHODS OF MANUFACTURING THE SAME, AND ELECTRONIC DEVICES INCLUDING THE TRANSISTORS 审中-公开
    晶体管，其制造方法以及包括晶体管的电子器件

    公开(公告)号：US20150060990A1

    公开(公告)日：2015-03-05

    申请号：US14206025

    申请日：2014-03-12

    申请人： Samsung Electronics Co., Ltd.

    发明人： Sun-jae KIM ,  Tae-sang KIM ,  Myung-kwan RYU ,  Joon-seok PARK ,  Seok-jun SEO ,  Kyoung-seok SON ,  Seong-ho CHO

    IPC分类号： H01L29/786 ,  H01L27/12 ,  H01L29/10

    CPC分类号： H01L29/7869 ,  H01L29/1033 ,  H01L29/66969 ,  H01L29/78696

    摘要： Provided are transistors, methods of manufacturing the same, and electronic devices including the transistors. A transistor includes a channel layer having a multi-layer structure having first and second layers, the first and second semiconductor layers including a plurality of elements having respective concentrations, and the first layer is disposed closer to a gate than the second layer. The second layer has a higher electrical resistance than the first layer as a result of a combination of the elements and of their respective concentrations. At least one of the first and second layers includes a semiconductor material including zinc, oxygen, and nitrogen. One of the first and second layers includes a semiconductor material including zinc fluoronitride. An oxygen content of the second layer is higher than an oxygen content of the first layer. A fluorine content of the second layer is higher than a fluorine content of the first layer.

    摘要翻译： 提供了晶体管，其制造方法和包括晶体管的电子器件。 晶体管包括具有第一和第二层的多层结构的沟道层，第一和第二半导体层包括具有各自浓度的多个元件，第一层被设置成比第二层更靠近栅极。 由于元素和它们各自的浓度的组合，第二层具有比第一层更高的电阻。 第一层和第二层中的至少一层包括包含锌，氧和氮的半导体材料。 第一层和第二层之一包括包含氟化氮锌的半导体材料。 第二层的氧含量高于第一层的氧含量。 第二层的氟含量高于第一层的氟含量。

    ATHERMAL OPTICAL MODULATOR AND METHOD OF MANUFACTURING THE SAME
    8.
    发明申请
    ATHERMAL OPTICAL MODULATOR AND METHOD OF MANUFACTURING THE SAME 有权
    高温光学调制器及其制造方法

    公开(公告)号：US20140307300A1

    公开(公告)日：2014-10-16

    申请号：US13973521

    申请日：2013-08-22

    申请人： Samsung Electronics Co., Ltd.

    发明人： Moon-seung YANG ,  Seong-ho CHO ,  Rakib Uddin MOHAMMAD

    IPC分类号： G02F1/025 ,  H01L31/0236

    CPC分类号： G02F1/025 ,  G02F2203/60 ,  Y02E10/50

    摘要： An athermal optical modulator includes a waveguide, a ring resonator configured to receive light input from the waveguide and output modulated light to the waveguide, the ring resonator including a ridge unit located at a center of the ring resonator in a vertical section, a first contact connected to one side of the ridge unit and a second contact connected to the other side of the ridge unit, the first contact and the second contact forming paths for applying electricity to the ring resonator to form an electric field in the ring resonator, and a polymer layer covering the ridge unit.

    摘要翻译： 一种无热光调制器，包括波导，环形谐振器，其被配置为接收从波导输入的光并将调制光输出到波导，所述环形谐振器包括位于所述环形谐振器的垂直部分的中心的脊单元，所述第一接触 连接到所述脊单元的一侧，并且连接到所述脊单元的另一侧的第二触点，所述第一触点和所述第二触点形成路径用于向所述环形谐振器施加电力以在所述环形谐振器中形成电场，以及 覆盖脊单元的聚合物层。