公开(公告)号：US10283382B2

公开(公告)日：2019-05-07

申请号：US15672623

申请日：2017-08-09

Applicant: SAMSUNG ELECTRONICS CO., LTD.

Inventor： Young Jin Noh ,  Kyung Sun Kim ,  Seung Bo Shim ,  Yong Woo Lee ,  Ji Soo Im ,  Won Young Choi

IPC: H01L21/3065 ,  H01L21/67 ,  C23C16/458 ,  H01J37/32 ,  C23C16/509 ,  H01L21/683 ,  H01L21/687

Abstract: A plasma processing apparatus including an electrostatic chuck supporting a wafer; a focus ring disposed to surround an outer circumferential surface of the wafer; an insulation ring disposed to surround an outer circumferential surface of the focus ring; and an edge ring supporting lower portions of the focus ring and the insulation ring, the edge ring being spaced apart from the electrostatic chuck and surrounding an outer circumferential surface of the electrostatic chuck; wherein the edge ring includes a flow channel containing a fluid therein.