SEMICONDUCTOR PACKAGE INCLUDING SEMICONDUCTOR CHIP

    公开(公告)号:US20190244932A1

    公开(公告)日:2019-08-08

    申请号:US15995176

    申请日:2018-06-01

    Abstract: A semiconductor package includes a first semiconductor chip disposed on a substrate. A first upward pad is disposed on an upper surface of the first semiconductor chip. A second semiconductor chip is arranged with an offset above the first semiconductor chip. A first downward pad is disposed on a lower surface of the second semiconductor chip. A first bonding wire connects the first upward pad and the substrate. A first inter-chip connector is interposed between the first upward pad and the first downward pad. A side surface of the second semiconductor chip is arranged above the first upward pad.

    CACHE MEMORY SYSTEM FOR TILE BASED RENDERING AND CACHING METHOD THEREOF
    15.
    发明申请
    CACHE MEMORY SYSTEM FOR TILE BASED RENDERING AND CACHING METHOD THEREOF 有权
    用于基于层次渲染的缓存存储器系统及其缓存方法

    公开(公告)号:US20130097386A1

    公开(公告)日:2013-04-18

    申请号:US13652894

    申请日:2012-10-16

    CPC classification number: G06F12/0864 G06F12/126 G06T1/60 Y02D10/13

    Abstract: A cache memory system and a caching method for a tile-based rendering may be provided. Each of cache lines in the cache memory system may include delayed-replacement information. The delayed-replacement information may indicate whether texture data referred to at a position of an edge of a tile is included in a cache line. When a cache line corresponding to an access-requested address is absent in the cache memory system, the cache memory system may select and remove a cache line to be removed from an associative cache unit, based on delayed-replacement information.

    Abstract translation: 可以提供用于基于瓦片的呈现的高速缓冲存储器系统和缓存方法。 缓存存储器系统中的每个高速缓存行可以包括延迟替换信息。 延迟替换信息可以指示在高速缓存行中是否包括在瓦片的边缘的位置处引用的纹理数据。 当高速缓冲存储器系统中不存在对应于访问请求地址的高速缓存行时,高速缓冲存储器系统可以基于延迟替换信息来从关联高速缓存单元中选择和移除要移除的高速缓存行。

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