公开(公告)号：US11127609B2

公开(公告)日：2021-09-21

申请号：US16791996

申请日：2020-02-14

申请人： SAMSUNG ELECTRONICS CO., LTD.

发明人： Doo Jin Kim ,  Young Sik Kim

IPC分类号： H01L21/677 ,  H01L21/67

摘要： A collet apparatus is provided including a body. A first adsorption unit is connected to the body. A second adsorption unit is connected to the first adsorption unit. The second adsorption unit adsorbs a semiconductor chip. An illumination unit is disposed inside the body, and provides a light to the semiconductor chip adsorbed onto the second adsorption unit to examine the semiconductor chip.

公开(公告)号：US20190244932A1

公开(公告)日：2019-08-08

申请号：US15995176

申请日：2018-06-01

申请人： SAMSUNG ELECTRONICS CO., LTD.

发明人： Doo Jin Kim ,  Young Sik Kim

IPC分类号： H01L25/065 ,  H01L23/538 ,  H01L23/498

摘要： A semiconductor package includes a first semiconductor chip disposed on a substrate. A first upward pad is disposed on an upper surface of the first semiconductor chip. A second semiconductor chip is arranged with an offset above the first semiconductor chip. A first downward pad is disposed on a lower surface of the second semiconductor chip. A first bonding wire connects the first upward pad and the substrate. A first inter-chip connector is interposed between the first upward pad and the first downward pad. A side surface of the second semiconductor chip is arranged above the first upward pad.

公开(公告)号：US10714453B2

公开(公告)日：2020-07-14

申请号：US15995176

申请日：2018-06-01

申请人： SAMSUNG ELECTRONICS CO., LTD.

发明人： Doo Jin Kim ,  Young Sik Kim

IPC分类号： H01L25/065 ,  H01L23/498 ,  H01L23/538

摘要： A semiconductor package includes a first semiconductor chip disposed on a substrate. A first upward pad is disposed on an upper surface of the first semiconductor chip. A second semiconductor chip is arranged with an offset above the first semiconductor chip. A first downward pad is disposed on a lower surface of the second semiconductor chip. A first bonding wire connects the first upward pad and the substrate. A first inter-chip connector is interposed between the first upward pad and the first downward pad. A side surface of the second semiconductor chip is arranged above the first upward pad.

公开(公告)号：US08672210B2

公开(公告)日：2014-03-18

申请号：US13728316

申请日：2012-12-27

申请人： Samsung Electronics Co., Ltd.

发明人： Young Sik Kim ,  Doo Jin Kim ,  Sung Bok Hong ,  Ki Taik Oh

IPC分类号： B23K37/00

CPC分类号： H01L21/67138 ,  B23K20/005 ,  H01L24/78 ,  H01L2224/45015 ,  H01L2224/45144 ,  H01L2224/78308 ,  H01L2924/00014 ,  H01L2224/48 ,  H01L2924/00 ,  H01L2924/00015

摘要： A capillary exchange system of a semiconductor wire bonding includes a wire bond unit having a chuck that includes a holding portion for holding a capillary for semiconductor wire bonding, a holding release guide unit for mechanically acting on the chuck of the wire bond unit to allow the capillary to be held by the holding portion or released from the holding portion, and a capillary exchange unit for separating the capillary from the chuck of the wire bond unit and installing a new capillary in the chuck in cooperation with the holding release guide unit.

摘要翻译： 半导体引线接合的毛细管交换系统包括具有卡盘的引线接合单元，该卡盘包括用于保持用于半导体引线接合的毛细管的保持部分，用于机械地作用在引线接合单元的卡盘上的保持释放引导单元， 由保持部保持的毛细管或从保持部分释放的毛细管，以及毛细管交换单元，用于将毛细管与线接合单元的卡盘分离，并与保持释放引导单元配合地将新的毛细管安装在卡盘中。