SERIALLY ARRANGED PRINTED CIRCUIT BOARD
    12.
    发明申请
    SERIALLY ARRANGED PRINTED CIRCUIT BOARD 审中-公开
    系列印刷电路板

    公开(公告)号:US20140016280A1

    公开(公告)日:2014-01-16

    申请号:US13940428

    申请日:2013-07-12

    Abstract: The present general inventive concept provides a serially arranged printed circuit board including a printed circuit board body and a connector connected to the printed circuit board body configured to exchange a signal with an external device. The printed circuit board body includes a plurality of semiconductor device areas, on which a plurality of semiconductor devices is formed, and a dummy area including a plurality of conductive patterns electrically connecting the connector with the plurality of semiconductor device areas, respectively. Each of the plurality of conductive patterns is formed in two or more multiple layers.

    Abstract translation: 本发明的总体构思提供了一种串行布置的印刷电路板,其包括印刷电路板主体和连接到印刷电路板主体的连接器,其被配置为与外部设备交换信号。 印刷电路板主体包括分别形成有多个半导体器件的多个半导体器件区域和包括分别将连接器与多个半导体器件区域电连接的多个导电图案的虚拟区域。 多个导电图案中的每一个形成为两层以上。

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