公开(公告)号：US20210229981A1

公开(公告)日：2021-07-29

申请号：US17228248

申请日：2021-04-12

Applicant: Sciosense B.V.

Inventor： Willem Frederik Adrianus Besling ,  Casper Van Der Avoort ,  Coenraad Cornelis Tak ,  Remco Henricus Wilhelmus Pijnenburg ,  Olaf Wunnicke ,  Hendrik Bouman

IPC: B81B7/00 ,  B81C1/00 ,  G01D11/24

Abstract: A sensor package and a method for producing a sensor package are disclosed. In an embodiment a method for producing a sensor package includes providing a carrier including electric conductors, fastening a dummy die or interposer to the carrier, providing an ASIC device including an integrated sensor element and fastening the ASIC device to the dummy die or interposer.