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公开(公告)号：US11313749B2
公开(公告)日：2022-04-26
申请号：US16333671
申请日：2017-10-02
Applicant: Sciosense B.V.
Inventor： Joerg Siegert , Willem Frederik Adrianus Besling , Coenraad Cornelis Tak , Martin Schrems , Franz Schrank
Abstract: In an embodiment a pressure sensor device includes a substrate body, a pressure sensor having a membrane and a cap body having at least one opening, wherein the pressure sensor is arranged between the substrate body and the cap body in a vertical direction which is perpendicular to a main plane of extension of the substrate body, and wherein the mass of the substrate body amounts to at least 80% of the mass of the cap body and at most 120% of the mass of the cap body.
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公开(公告)号：US20210359143A1
公开(公告)日：2021-11-18
申请号：US17288847
申请日：2019-10-24
Applicant: Sciosense B.V.
Inventor： Alessandro Faes , Jörg Siegert , Willem Frederik Adrianus Besling , Remco Henricus Wilhelmus Pijnenburg
IPC: H01L29/84 , H01L21/306 , H01L21/768
Abstract: In an embodiment a method includes providing a semiconductor body, forming a sacrificial layer above a surface of the semiconductor body, applying a diaphragm on the sacrificial layer and removing the sacrificial layer by introducing an etchant into openings of the diaphragm, wherein applying the diaphragm comprises applying a first layer, reducing a roughness of a surface of the first layer facing away from the semiconductor body thereby providing a processed surface, and patterning and structuring the first layer to form the openings.
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公开(公告)号：US20210190615A1
公开(公告)日：2021-06-24
申请号：US17053182
申请日：2019-04-10
Applicant: Sciosense B.V.
Inventor： Alberto Maccioni , Willem Frederik Adrianus Besling
Abstract: In an embodiment a sensor arrangement includes a pressure sensor realized as a capacitive pressure sensor, a capacitance-to-digital converter coupled to the pressure sensor and implemented as a delta-sigma analog-to-digital converter and a reference voltage generator having a control input configured to receive a control signal and an output configured to provide a reference voltage, wherein the output of the reference voltage generator is connected to an input of the capacitance-to-digital converter, wherein the reference voltage generator is configured to set a value of the reference voltage as a function of the control signal, and wherein at least two different values of the reference voltage have the same sign and different amounts.
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公开(公告)号：US10743112B2
公开(公告)日：2020-08-11
申请号：US16312058
申请日：2017-06-14
Applicant: Sciosense B.V.
Inventor： Willem Frederik Adrianus Besling
Abstract: The microphone and pressure sensor package comprises a carrier (1) with an opening (16), a microphone device (20) including a diaphragm (21) and a perforated back plate (22) arranged above the opening (16), an ASIC device (6), and a cover (9) forming a cavity (17) between the carrier (1) and the cover (9). The ASIC device (6) and the microphone device (20) are arranged in the cavity (17). A sensor element (7) provided for a pressure sensor is integrated in the ASIC device (6). The pressure outside the cavity (17) is transferred to the sensor element (7) through the opening (16), the diaphragm (21), and the back plate (22).
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公开(公告)号：US11585711B2
公开(公告)日：2023-02-21
申请号：US16958269
申请日：2019-01-10
Applicant: Sciosense B.V.
Inventor： Willem Frederik Adrianus Besling , Remco Henricus Wilhelmus Pijnenburg , Kailash Vijayakumar , Jörg Siegert , Alessandro Faes
IPC: G01L9/00
Abstract: A capacitive sensor is disclosed. In an embodiment a semiconductor device includes a die including a capacitive pressure sensor integrated on a CMOS circuit, wherein the capacitive pressure sensor includes a first electrode and a second electrode separated from one another by a cavity, the second electrode including a suspended tensile membrane, and wherein the first electrode is composed of one or more aluminum-free layers containing Ti.
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Patent Agency Ranking
6.发明申请公开(公告)号：US20230036935A1
公开(公告)日：2023-02-02
申请号：US17937123
申请日：2022-09-30
Applicant: Sciosense B.V.
Inventor： Kailash Vijayakumar , Remco Henricus Wilhelmus Pijnenburg , Willem Frederik Adrianus Besling , Sophie Guillemin , Jörg Siegert
IPC: B81C1/00
Abstract: In an embodiment, an integrated MEMS transducer device includes a substrate body having a first electrode on a substrate, an etch stop layer located on a surface of the substrate, a suspended micro-electro-mechanical systems (MEMS) diaphragm with a second electrode, an anchor structure with anchors connecting the MEMS diaphragm to the substrate body and a sacrificial layer in between the anchors of the anchor structure, the sacrificial layer including a first sub-layer of a first material, wherein the first sub-layer is arranged on the etch stop layer, a second sub-layer of a second material, wherein the second sub-layer is arranged on the first sub-layer, and wherein the first and the second material are different materials.
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公开(公告)号：US11548781B2
公开(公告)日：2023-01-10
申请号：US16759659
申请日：2018-11-16
Applicant: Sciosense B.V.
Inventor： Casper Van Der Avoort , Willem Frederik Adrianus Besling , Remco Henricus Wilhelmus Pijnenburg , Olaf Wunnicke , Coen Tak
Abstract: A die attachment to a support is disclosed. In an embodiment, a semiconductor package includes a support and a die attached to the support by an adhesive on a backside of the die, wherein the die includes a capacitive pressure sensor integrated on a CMOS read-out circuit, and wherein the adhesive covers only a part of the backside of the die.
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8.发明申请公开(公告)号：US20210387854A1
公开(公告)日：2021-12-16
申请号：US17288267
申请日：2019-11-04
Applicant: Sciosense B.V.
Inventor： Kailash Vijayakumar , Remco Henricus Wilhelmus Pijnenburg , Willem Frederik Adrianus Besling , Sophie Guillemin , Jörg Siegert
IPC: B81C1/00
Abstract: In an embodiment, a method for manufacturing a micro-electro-mechanical systems (MEMS) transducer device includes providing a substrate body with a surface, depositing an etch-stop layer (ESL) on the surface, depositing a sacrificial layer on the ESL, depositing a diaphragm layer on the sacrificial layer and removing the sacrificial layer, wherein depositing the sacrificial layer includes depositing a first sub-layer of a first material and depositing a second sub-layer of a second material, and wherein the first material and the second material are different materials.
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9.发明授权公开(公告)号：US11492251B2
公开(公告)日：2022-11-08
申请号：US17288267
申请日：2019-11-04
Applicant: Sciosense B.V.
Inventor： Kailash Vijayakumar , Remco Henricus Wilhelmus Pijnenburg , Willem Frederik Adrianus Besling , Sophie Guillemin , Jörg Siegert
IPC: B81C1/00
Abstract: In an embodiment, a method for manufacturing a micro-electro-mechanical systems (MEMS) transducer device includes providing a substrate body with a surface, depositing an etch-stop layer (ESL) on the surface, depositing a sacrificial layer on the ESL, depositing a diaphragm layer on the sacrificial layer and removing the sacrificial layer, wherein depositing the sacrificial layer includes depositing a first sub-layer of a first material and depositing a second sub-layer of a second material, and wherein the first material and the second material are different materials.
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公开(公告)号：US11448564B2
公开(公告)日：2022-09-20
申请号：US17053182
申请日：2019-04-10
Applicant: Sciosense B.V.
Inventor： Alberto Maccioni , Willem Frederik Adrianus Besling
Abstract: In an embodiment a sensor arrangement includes a pressure sensor realized as a capacitive pressure sensor, a capacitance-to-digital converter coupled to the pressure sensor and implemented as a delta-sigma analog-to-digital converter and a reference voltage generator having a control input configured to receive a control signal and an output configured to provide a reference voltage, wherein the output of the reference voltage generator is connected to an input of the capacitance-to-digital converter, wherein the reference voltage generator is configured to set a value of the reference voltage as a function of the control signal, and wherein at least two different values of the reference voltage have the same sign and different amounts.
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