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公开(公告)号：US11548781B2
公开(公告)日：2023-01-10
申请号：US16759659
申请日：2018-11-16
Applicant: Sciosense B.V.
Inventor： Casper Van Der Avoort , Willem Frederik Adrianus Besling , Remco Henricus Wilhelmus Pijnenburg , Olaf Wunnicke , Coen Tak
Abstract: A die attachment to a support is disclosed. In an embodiment, a semiconductor package includes a support and a die attached to the support by an adhesive on a backside of the die, wherein the die includes a capacitive pressure sensor integrated on a CMOS read-out circuit, and wherein the adhesive covers only a part of the backside of the die.
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公开(公告)号：US20220260446A1
公开(公告)日：2022-08-18
申请号：US17597672
申请日：2020-07-22
Applicant: Sciosense B.V.
Inventor： Willem Frederik Adrianus Besling , Anderson Pires Singulani , Coenraad Cornelis Tak , Casper Van Der Avoort
Abstract: In an embodiment a sensor arrangement includes a sensor die having a contact area, a suspended area and a sensitive element located in the suspended area, an interposer including at least two vias connecting a first side of the interposer to a second side of the interposer and a support mechanically and electrically connecting the contact area of the sensor die to the first side of the interposer, the support including at least two contact joints.
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公开(公告)号：US11248976B2
公开(公告)日：2022-02-15
申请号：US16758680
申请日：2018-11-16
Applicant: Sciosense B.V.
Inventor： Willem Frederik Adrianus Besling , Casper Van Der Avoort , Remco Henricus Wilhelmus Pijnenburg , Olaf Wunnicke , Jörg Siegert , Alessandro Faes
Abstract: Capacitive pressure sensors and other devices are disclosed. In an embodiment a semiconductor device includes a first electrode, a cavity over the first electrode and a second electrode including a suspended membrane over the cavity and electrically conductive anchor trenches laterally surrounding the cavity, wherein the anchor trenches include an inner anchor trench and an outer anchor trench, the outer anchor trench having rounded corners.
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公开(公告)号：US20210163282A1
公开(公告)日：2021-06-03
申请号：US17043397
申请日：2019-04-25
Applicant: Sciosense B.V.
Inventor： Olaf Wunnicke , Frederik Willem Maurits Vanhelmont , Willem Frederik Adrianus Besling , Remco Henricus Wilhelmus Pijnenburg , Casper Van Der Avoort , Anderson Pires Singulani , Martijn Goossens
Abstract: In an embodiment a system includes a sensor including a base having a base electrode and a first membrane suspended above the base, wherein the first membrane has a first membrane electrode, wherein the first membrane is configured to deflect with respect to the base electrode in response to an environmental condition, and wherein the sensor is configured to measure a capacitance between the base electrode and the first membrane electrode. The system further includes a first device of the system configured to generate electrical interference signals, a first electrically conductive shield layer positioned between the sensor and the first device of the system, wherein the first electrically conductive shield layer defines a plurality of first apertures extending through the first electrically conductive shield layer and a dielectric material disposed in the plurality of first apertures.
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公开(公告)号：US11454562B2
公开(公告)日：2022-09-27
申请号：US17053135
申请日：2019-04-10
Applicant: Sciosense B.V.
Inventor： Alberto Maccioni , Willem Frederik Adrianus Besling , Olaf Wunnicke , Casper Van Der Avoort , Remco Henricus Wilhelmus Pijnenburg , Anderson Pires Singulani
Abstract: A sensor arrangement and a method of operating a sensor arrangement are disclosed. In an embodiment, a sensor arrangement includes a pressure sensor realized as a capacitive pressure sensor, a capacitance-to-digital converter, a test circuit and a switching circuit coupling the capacitance-to-digital converter and the test circuit to the pressure sensor.
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Patent Agency Ranking
公开(公告)号：US11427465B2
公开(公告)日：2022-08-30
申请号：US17043397
申请日：2019-04-25
Applicant: Sciosense B.V.
Inventor： Olaf Wunnicke , Frederik Willem Maurits Vanhelmont , Willem Frederik Adrianus Besling , Remco Henricus Wilhelmus Pijnenburg , Casper Van Der Avoort , Anderson Pires Singulani , Martijn Goossens
Abstract: In an embodiment a system includes a sensor including a base having a base electrode and a first membrane suspended above the base, wherein the first membrane has a first membrane electrode, wherein the first membrane is configured to deflect with respect to the base electrode in response to an environmental condition, and wherein the sensor is configured to measure a capacitance between the base electrode and the first membrane electrode. The system further includes a first device of the system configured to generate electrical interference signals, a first electrically conductive shield layer positioned between the sensor and the first device of the system, wherein the first electrically conductive shield layer defines a plurality of first apertures extending through the first electrically conductive shield layer and a dielectric material disposed in the plurality of first apertures.
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公开(公告)号：US11001495B2
公开(公告)日：2021-05-11
申请号：US16312002
申请日：2017-06-14
Applicant: Sciosense B.V.
Inventor： Willem Frederik Adrianus Besling , Casper Van Der Avoort , Coenraad Cornelis Tak , Remco Henricus Wilhelmus Pijnenburg , Olaf Wunnicke , Hendrik Bouman
Abstract: The sensor package comprises a carrier (1) including electric conductors (13), an ASIC device (6) and a sensor element (7), which is integrated in the ASIC device (6). A dummy die or interposer (4) is arranged between the carrier (1) and the ASIC device (6). The dummy die or interposer (4) is fastened to the carrier (1), and the ASIC device (6) is fastened to the dummy die or interposer (4).
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8.发明申请公开(公告)号：US20200348198A1
公开(公告)日：2020-11-05
申请号：US16758680
申请日：2018-11-16
Applicant: Sciosense B.V.
Inventor： Willem Frederik Adrianus Besling , Casper Van Der Avoort , Remco Henricus Wilhelmus Pijnenburg , Olaf Wunnicke , Jörg Siegert , Alessandro Faes
Abstract: Capacitive pressure sensors and other devices are disclosed. In an embodiment a semiconductor device includes a first electrode, a cavity over the first electrode and a second electrode including a suspended membrane over the cavity and electrically conductive anchor trenches laterally surrounding the cavity, wherein the anchor trenches include an inner anchor trench and an outer anchor trench, the outer anchor trench having rounded corners.
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公开(公告)号：US12180066B2
公开(公告)日：2024-12-31
申请号：US17228248
申请日：2021-04-12
Applicant: Sciosense B.V.
Inventor： Willem Frederik Adrianus Besling , Casper Van Der Avoort , Coenraad Cornelis Tak , Remco Henricus Wilhelmus Pijnenburg , Olaf Wunnicke , Hendrik Bouman
Abstract: A sensor package and a method for producing a sensor package are disclosed. In an embodiment a method for producing a sensor package includes providing a carrier including electric conductors, fastening a dummy die or interposer to the carrier, providing an ASIC device including an integrated sensor element and fastening the ASIC device to the dummy die or interposer.
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公开(公告)号：US11366031B2
公开(公告)日：2022-06-21
申请号：US16337554
申请日：2017-10-02
Applicant: Sciosense B.V.
Inventor： Willem Frederik Adrianus Besling , Casper Van Der Avoort , Coenraad Cornelis Tak , Remco Henricus Wilhelmus Pijnenburg , Olaf Wunnicke , Martijn Goossens
Abstract: In an embodiment, a semiconductor device includes a substrate body, an environmental sensor, a cap body and a volume of gas, wherein the environmental sensor and the volume of gas are arranged between the substrate body and the cap body in a vertical direction which is perpendicular to a main plane of extension of the substrate body, wherein at least one channel between the substrate body and the cap body connects the volume of gas with an environment of the semiconductor device such that the channel is permeable for gases, and wherein a thickness of the substrate body amounts to at least 80% of a thickness of the cap body and at most 120% of the thickness of the cap body.
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