公开(公告)号：US11705643B2

公开(公告)日：2023-07-18

申请号：US17530425

申请日：2021-11-18

Applicant: Shanghai AVIC OPTO Electronics Co., Ltd. ,  Shanghai Tianma Micro-Electronics Co., Ltd.

Inventor： Kerui Xi ,  Xuhui Peng ,  Feng Qin ,  Tingting Cui ,  Zhenyu Jia

IPC: H01Q3/36 ,  H01Q21/06 ,  H01Q1/38 ,  H01Q1/42

CPC classification number: H01Q21/065 ,  H01Q1/38 ,  H01Q1/422 ,  H01Q3/36

Abstract: Disclosed antenna unit includes first substrate and second substrate opposite to each other, phase shifting units and driver circuit. Region facing the first substrate and the second substrate form phase shifting region. In first direction, the first substrate formed with first step region, and used for connecting radio-frequency signal terminal; in second direction, the second substrate formed with second step region, and included angle between the first direction and the second direction greater than or equal to 0° and smaller than 180°. At least part of the first step region does not overlap at least part of the second step region. Phase shifting units used for radiating radio-frequency signal and distributed in phase shifting region, each phase shifting unit. At least part of the driver circuit disposed in the second step region and the driver circuit electrically connected to each phase shifting unit to adjust radio-frequency signal.

公开(公告)号：US11660597B2

公开(公告)日：2023-05-30

申请号：US17231842

申请日：2021-04-15

Applicant: Shanghai AVIC OPTO Electronics Co., Ltd.

Inventor： Baiquan Lin ,  Kerui Xi ,  Zhenyu Jia ,  Junting Ouyang ,  Feng Qin ,  Xuhui Peng

IPC: G01N21/01 ,  B01L3/00 ,  G01N21/59

CPC classification number: B01L3/502715 ,  G01N21/01 ,  G01N21/59 ,  H10K65/00 ,  B01L2300/0663

Abstract: A microfluidic device includes: first substrate, microfluidic channel layer, and second substrate; the first substrate includes light source layer including a plurality of light source structures, the light source structure includes first electrode, second electrode, and an electroluminescence module, and when being turned on, emits light passing through the microfluidic channel layer and irradiating the second substrate; the second substrate includes photoelectric detection layer including a plurality of photoelectric detection structures and driving electrode layer including a plurality of driving electrodes and a plurality of driving circuits, the photoelectric detection structure includes third electrode, fourth electrode, and photoelectric conversion module arranged therebetween, and when being turned on, generates an electrical signal according to an incident light signal; the driving circuit is configured to apply a voltage to each driving electrode such that a droplet moves in a microfluidic channel of the microfluidic channel layer.

公开(公告)号：US11380644B2

公开(公告)日：2022-07-05

申请号：US16917155

申请日：2020-06-30

Applicant: Shanghai Tianma Micro-Electronics Co., Ltd. ,  Shanghai AVIC OPTO Electronics Co., Ltd.

Inventor： Feng Qin ,  Kerui Xi ,  Tingting Cui ,  Jie Zhang ,  Xuhui Peng

IPC: H01L21/56 ,  H01L23/00 ,  H01L23/31

Abstract: Provided are a semiconductor package and a method for fabricating the semiconductor package. The method includes followings steps: a first workpiece is provided, where the first workpiece includes a first substrate and multiple first rewiring structures arranged on the first substrate at intervals, and each first rewiring structure includes at least two first rewiring layers; an encapsulation layer is formed on the first rewiring structures, where the encapsulation layer is provided with multiple first through holes, and the first through holes exposes one first rewiring layer; at least two second rewiring layers are disposed on a side of the encapsulation layer facing away from the first rewiring layer; multiple semiconductor elements are provided, where the semiconductor elements are arranged on a side of the first rewiring structures facing away from the encapsulation layer, where the first rewiring layers are electrically connected to pins of the semiconductor elements.