公开(公告)号：US10811609B2

公开(公告)日：2020-10-20

申请号：US16468080

申请日：2017-09-06

Applicant: Sharp Kabushiki Kaisha

Inventor： Mayuko Sakamoto ,  Tetsunori Tanaka

IPC: H01L21/00 ,  H01L51/00 ,  H01L27/32 ,  H01L51/52 ,  H01L51/56 ,  H01L27/12

Abstract: A manufacturing method of a display device includes a layering process including steps of forming a PI layer on a carrier glass substrate, forming a base coat layer to cover the PI layer, and forming a TFT layer and a light-emitting element layer on the base coat layer, an exposing process including a step of exposing an end surface of the PI layer, and a peeling process including a step of peeling the carrier glass substrate from the PI layer by irradiating the lower face of the PI layer with a laser light beam.

公开(公告)号：US12279513B2

公开(公告)日：2025-04-15

申请号：US17598802

申请日：2020-03-25

Applicant: SHARP KABUSHIKI KAISHA

Inventor： Yu Yamane ,  Mayuko Sakamoto ,  Tokio Taguchi

IPC: H10K77/10 ,  B32B7/12 ,  B32B15/08 ,  B32B27/32 ,  B32B27/34 ,  B32B27/36 ,  H10K59/40 ,  H10K102/00

Abstract: A foldable display, includes a display layer with flexibility including a first display region, a second display region, and a third display region located between the first display region and the second display region; a cover with flexibility configured to cover the display layer; a first support substrate with inflexibility configured to support the first display region; a second support substrate with inflexibility configured to support the second display region; a bending part capable of bending including the third display region; and a shock absorbing layer provided between the display layer and the first support substrate and between the display layer and the second support substrate.

公开(公告)号：US11551975B2

公开(公告)日：2023-01-10

申请号：US17276379

申请日：2018-09-28

Applicant: SHARP KABUSHIKI KAISHA

Inventor： Mayuko Sakamoto

IPC: H01L21/00 ,  H01L21/78 ,  H01L27/12

Abstract: A method for manufacturing an electronic device includes the following: forming an island-shaped peeling layer onto a substrate; stacking a resin layer all over the peeling layer; forming a barrier layer over the resin layer; forming an electronic-circuit layer onto the upper surface of the barrier layer; and peeling off the resin layer from the substrate and the peeling layer.