公开(公告)号：US11289346B2

公开(公告)日：2022-03-29

申请号：US16919433

申请日：2020-07-02

Applicant: Siliconware Precision Industries Co., Ltd.

Inventor： Chen-Yu Huang ,  Chee-Key Chung ,  Chang-Fu Lin ,  Kong-Toon Ng ,  Rui-Feng Tai ,  Bo-Hao Ma

IPC: H01L21/44 ,  H01L21/56 ,  H01L23/31 ,  H01L23/522 ,  H01L25/065 ,  H01L23/00 ,  H01L25/16 ,  H01L23/48 ,  H01L23/538 ,  H01L21/48 ,  H01L21/683 ,  H01L21/3105

Abstract: An electronic package and a method for fabricating the same are provided. The method includes: forming a circuit structure on an encapsulant; embedding a first electronic component and a plurality of conductive posts in the encapsulant; and disposing a second electronic component on the circuit structure. Since the first and second electronic components are arranged on opposite sides of the circuit structure, the electronic package can provide multi-function and high efficiency.

公开(公告)号：US11164755B1

公开(公告)日：2021-11-02

申请号：US16895461

申请日：2020-06-08

Applicant: SILICONWARE PRECISION INDUSTRIES CO., LTD.

Inventor： Yung-Ta Li ,  Yi-Chian Liao ,  Kong-Toon Ng ,  Chang-Fu Lin

IPC: H01L21/56 ,  H01L23/31 ,  H01L21/78 ,  H01L25/065 ,  H01L23/00

Abstract: An electronic package and a method for fabricating the same are provided. The electronic package includes a stepped recess formed at a peripheral portion of a packaging module to release stress of the electronic package.

公开(公告)号：US20200335447A1

公开(公告)日：2020-10-22

申请号：US16919433

申请日：2020-07-02

Applicant: Siliconware Precision Industries Co., Ltd.

Inventor： Chen-Yu Huang ,  Chee-Key Chung ,  Chang-Fu Lin ,  Kong-Toon Ng ,  Rui-Feng Tai ,  Bo-Hao Ma

IPC: H01L23/538 ,  H01L23/31 ,  H01L23/522 ,  H01L25/065 ,  H01L23/00 ,  H01L25/16 ,  H01L23/48

Abstract: An electronic package and a method for fabricating the same are provided. The method includes: forming a circuit structure on an encapsulant; embedding a first electronic component and a plurality of conductive posts in the encapsulant; and disposing a second electronic component on the circuit structure. Since the first and second electronic components are arranged on opposite sides of the circuit structure, the electronic package can provide multi-function and high efficiency.