公开(公告)号：US20210343546A1

公开(公告)日：2021-11-04

申请号：US16895461

申请日：2020-06-08

Applicant: SILICONWARE PRECISION INDUSTRIES CO., LTD.

Inventor： Yung-Ta Li ,  Yi-Chian Liao ,  Kong-Toon Ng ,  Chang-Fu Lin

IPC: H01L21/56 ,  H01L23/31 ,  H01L21/78 ,  H01L25/065

Abstract: An electronic package and a method for fabricating the same are provided. The electronic package includes a stepped recess formed at a peripheral portion of a packaging module to release stress of the electronic package.

公开(公告)号：US20210296295A1

公开(公告)日：2021-09-23

申请号：US17337752

申请日：2021-06-03

Applicant: Siliconware Precision Industries Co., Ltd.

Inventor： Kong-Toon Ng ,  Hung-Ho Lee ,  Chee-Key Chung ,  Chang-Fu Lin ,  Chi-Hsin Chiu

IPC: H01L25/10 ,  H01L21/56 ,  H01L23/00 ,  H01L25/00

Abstract: An electronic package is provided, including: an encapsulation layer embedded with a first electronic component and conductive pillars; a circuit structure disposed on one surface of the encapsulation layer; a second electronic component disposed on the circuit structure; an insulation layer formed on the other surface of the encapsulation layer; and a circuit portion disposed on the insulation layer. Since the first and second electronic components are disposed on two sides of the circuit structure, respectively, the electronic package has various functions and high performance. A method for fabricating the electronic package is also provided.

公开(公告)号：US11676948B2

公开(公告)日：2023-06-13

申请号：US17337752

申请日：2021-06-03

Applicant: Siliconware Precision Industries Co., Ltd.

Inventor： Kong-Toon Ng ,  Hung-Ho Lee ,  Chee-Key Chung ,  Chang-Fu Lin ,  Chi-Hsin Chiu

IPC: H01L25/10 ,  H01L21/56 ,  H01L23/00 ,  H01L25/00

CPC classification number: H01L25/105 ,  H01L21/568 ,  H01L24/16 ,  H01L24/24 ,  H01L24/81 ,  H01L24/82 ,  H01L25/50 ,  H01L2224/16145 ,  H01L2224/24153 ,  H01L2224/73209 ,  H01L2224/82005 ,  H01L2225/1035 ,  H01L2225/1041 ,  H01L2225/1058

Abstract: An electronic package is provided, including: an encapsulation layer embedded with a first electronic component and conductive pillars; a circuit structure disposed on one surface of the encapsulation layer; a second electronic component disposed on the circuit structure; an insulation layer formed on the other surface of the encapsulation layer; and a circuit portion disposed on the insulation layer. Since the first and second electronic components are disposed on two sides of the circuit structure, respectively, the electronic package has various functions and high performance. A method for fabricating the electronic package is also provided.

公开(公告)号：US11418002B2

公开(公告)日：2022-08-16

申请号：US16669796

申请日：2019-10-31

Applicant: Siliconware Precision Industries Co., Ltd.

Inventor： Kong-Toon Ng ,  Yi-Chian Liao

IPC: G01N21/17 ,  H01S5/02234 ,  H01L23/538 ,  H01L23/00 ,  H01L21/683 ,  H01L21/48 ,  H01L21/56 ,  H01L23/31 ,  H01S5/02355 ,  H04B10/50

Abstract: An electronic package and a method for fabricating an electronic package are provided. An encapsulation layer encapsulates a first electronic component and a plurality of conductive pillars, and is defined with a reservation region and a removal region adjacent to the reservation region. A circuit structure is disposed on the encapsulation layer. The removal region and the circuit structure therewithin are removed for an optical communication element to protrude from a lateral surface of the encapsulation layer when the optical communication element is disposed on the circuit structure, so as to avoid a packaging material used in a subsequent process from being adhered to a protruding portion of the optical communication element.

公开(公告)号：US20210066883A1

公开(公告)日：2021-03-04

申请号：US16669796

申请日：2019-10-31

Applicant: Siliconware Precision Industries Co., Ltd.

Inventor： Kong-Toon Ng ,  Yi-Chian Liao

IPC: H01S5/022 ,  H01L23/31 ,  H01L23/538 ,  H01L23/00 ,  H01L21/683 ,  H01L21/48 ,  H01L21/56

Abstract: An electronic package and a method for fabricating an electronic package are provided. An encapsulation layer encapsulates a first electronic component and a plurality of conductive pillars, and is defined with a reservation region and a removal region adjacent to the reservation region. A circuit structure is disposed on the encapsulation layer. The removal region and the circuit structure therewithin are removed for an optical communication element to protrude from a lateral surface of the encapsulation layer when the optical communication element is disposed on the circuit structure, so as to avoid a packaging material used in a subsequent process from being adhered to a protruding portion of the optical communication element.

公开(公告)号：US12176327B2

公开(公告)日：2024-12-24

申请号：US18309756

申请日：2023-04-28

Applicant: SILICONWARE PRECISION INDUSTRIES CO., LTD.

Inventor： Kong-Toon Ng ,  Hung-Ho Lee ,  Chee-Key Chung ,  Chang-Fu Lin ,  Chi-Hsin Chiu

IPC: H01L25/10 ,  H01L21/56 ,  H01L23/00 ,  H01L25/00

Abstract: An electronic package is provided, including: an encapsulation layer embedded with a first electronic component and conductive pillars; a circuit structure disposed on one surface of the encapsulation layer; a second electronic component disposed on the circuit structure; an insulation layer formed on the other surface of the encapsulation layer; and a circuit portion disposed on the insulation layer. Since the first and second electronic components are disposed on two sides of the circuit structure, respectively, the electronic package has various functions and high performance. A method for fabricating the electronic package is also provided.

公开(公告)号：US11056470B2

公开(公告)日：2021-07-06

申请号：US16513124

申请日：2019-07-16

Applicant: Siliconware Precision Industries Co., Ltd.

Inventor： Kong-Toon Ng ,  Hung-Ho Lee ,  Chee-Key Chung ,  Chang-Fu Lin ,  Chi-Hsin Chiu

IPC: H01L25/10 ,  H01L21/56 ,  H01L23/00 ,  H01L25/00

Abstract: An electronic package is provided, including: an encapsulation layer embedded with a first electronic component and conductive pillars; a circuit structure disposed on one surface of the encapsulation layer; a second electronic component disposed on the circuit structure; an insulation layer formed on the other surface of the encapsulation layer; and a circuit portion disposed on the insulation layer. Since the first and second electronic components are disposed on two sides of the circuit structure, respectively, the electronic package has various functions and high performance. A method for fabricating the electronic package is also provided.

公开(公告)号：US10741500B2

公开(公告)日：2020-08-11

申请号：US15971534

申请日：2018-05-04

Applicant: Siliconware Precision Industries Co., Ltd.

Inventor： Chen-Yu Huang ,  Chee-Key Chung ,  Chang-Fu Lin ,  Kong-Toon Ng ,  Rui-Feng Tai ,  Bo-Hao Ma

IPC: H01L23/48 ,  H01L23/538 ,  H01L23/31 ,  H01L23/522 ,  H01L25/065 ,  H01L23/00 ,  H01L25/16

Abstract: An electronic package and a method for fabricating the same are provided. The method includes: forming a circuit structure on an encapsulant; embedding a first electronic component and a plurality of conductive posts in the encapsulant; and disposing a second electronic component on the circuit structure. Since the first and second electronic components are arranged on opposite sides of the circuit structure, the electronic package can provide multi-function and high efficiency.

公开(公告)号：US20190237374A1

公开(公告)日：2019-08-01

申请号：US15971534

申请日：2018-05-04

Applicant: Siliconware Precision Industries Co., Ltd.

Inventor： Chen-Yu Huang ,  Chee-Key Chung ,  Chang-Fu Lin ,  Kong-Toon Ng ,  Rui-Feng Tai ,  Bo-Hao Ma

IPC: H01L23/31 ,  H01L23/522 ,  H01L23/00 ,  H01L25/065

Abstract: An electronic package and a method for fabricating the same are provided. The method includes: forming a circuit structure on an encapsulant; embedding a first electronic component and a plurality of conductive posts in the encapsulant; and disposing a second electronic component on the circuit structure. Since the first and second electronic components are arranged on opposite sides of the circuit structure, the electronic package can provide multi-function and high efficiency.

公开(公告)号：US20230268328A1

公开(公告)日：2023-08-24

申请号：US18309756

申请日：2023-04-28

Applicant: SILICONWARE PRECISION INDUSTRIES CO., LTD.

Inventor： Kong-Toon Ng ,  Hung-Ho Lee ,  Chee-Key Chung ,  Chang-Fu LIN ,  Chi-Hsin Chiu

IPC: H01L25/10 ,  H01L21/56 ,  H01L23/00 ,  H01L25/00

CPC classification number: H01L25/105 ,  H01L21/568 ,  H01L24/82 ,  H01L24/81 ,  H01L24/24 ,  H01L24/16 ,  H01L25/50 ,  H01L2224/73209 ,  H01L2224/82005 ,  H01L2224/16145 ,  H01L2224/24153 ,  H01L2225/1035 ,  H01L2225/1041 ,  H01L2225/1058

Abstract: An electronic package is provided, including: an encapsulation layer embedded with a first electronic component and conductive pillars; a circuit structure disposed on one surface of the encapsulation layer; a second electronic component disposed on the circuit structure; an insulation layer formed on the other surface of the encapsulation layer; and a circuit portion disposed on the insulation layer. Since the first and second electronic components are disposed on two sides of the circuit structure, respectively, the electronic package has various functions and high performance. A method for fabricating the electronic package is also provided.