Array substrate for liquid crystal display device and method of fabricating the same
    11.
    发明申请
    Array substrate for liquid crystal display device and method of fabricating the same 有权
    液晶显示装置用阵列基板及其制造方法

    公开(公告)号:US20090309102A1

    公开(公告)日:2009-12-17

    申请号:US12318047

    申请日:2008-12-19

    IPC分类号: H01L29/04 H01L21/336

    摘要: An array substrate for a liquid crystal display device includes: a gate line and a gate electrode on a substrate, the gate electrode connected to the gate line; a gate insulating layer on the gate line and the gate electrode, the gate insulating layer including an organic insulating material such that a radical of carbon chain has a composition ratio of about 8% to about 11% by weight; a semiconductor layer on the gate insulating layer over the gate electrode; a data line crossing the gate line to define a pixel region; source and drain electrodes on the semiconductor layer, the source electrode connected to the data line and the drain electrode spaced apart from the source electrode; a passivation layer on the data line, the source electrode and the drain electrode, the passivation layer having a drain contact hole exposing the drain electrode; and a pixel electrode on the passivation layer, the pixel electrode connected to the drain electrode through the drain contact hole

    摘要翻译: 液晶显示装置的阵列基板包括:栅极线和衬底上的栅电极,栅电极连接到栅极线; 栅极线上的栅极绝缘层和栅电极,所述栅极绝缘层包括有机绝缘材料,使得碳链的基团的组成比为约8%至约11%重量; 位于栅电极上的栅极绝缘层上的半导体层; 与栅极线交叉以限定像素区域的数据线; 源电极和漏电极,源极连接到数据线,漏电极与源电极间隔开; 数据线上的钝化层,源电极和漏电极,钝化层具有暴露漏电极的漏极接触孔; 以及钝化层上的像素电极,所述像素电极通过漏极接触孔连接到漏电极

    Process for the production of multilayered bulk materials
    12.
    发明授权
    Process for the production of multilayered bulk materials 失效
    生产多层散装材料的方法

    公开(公告)号:US6103187A

    公开(公告)日:2000-08-15

    申请号:US198498

    申请日:1998-11-24

    摘要: The present invention relates to a process of the production of multilayered bulk materials. A plurality of constituting powders of a desired multilayered material are mixed at a predetermined ratio, particle of the powders being smaller than 100 .mu.m in size. The powder mixture is mechanically alloyed for a predetermined period of time by using a high-energy ball mill in an argon-filled glove box. The mechanically alloyed powder is loaded in a mold and is then hot-pressed under a uniaxial compressive pressure at a predetermined temperature, resulting in a composition having multilayered structure. The process according to the present invention provides an effective way of overcoming thickness limitations of conventional multilayered materials and enabling low-cost mass production of multilayered materials.

    摘要翻译: 本发明涉及生产多层散装材料的方法。 将多种所需多层材料的组成粉末以预定比例混合,粉末颗粒的尺寸小于100微米。 通过在充氩手套箱中使用高能球磨机将粉末混合物机械合金化预定的时间。 将机械合金化粉末装载到模具中,然后在单轴压缩压力下在预定温度下热压,得到具有多层结构的组成。 根据本发明的方法提供了克服常规多层材料的厚度限制并能够低成本大量生产多层材料的有效方式。