公开(公告)号：US10998130B2

公开(公告)日：2021-05-04

申请号：US16555169

申请日：2019-08-29

Applicant: TDK CORPORATION

Inventor： Hitoshi Ohkubo ,  Masazumi Arata ,  Manabu Ohta ,  Shou Kawadahara ,  Yoshihiro Maeda ,  Takahiro Kawahara ,  Hokuto Eda ,  Shigeki Sato

IPC: H01F41/04 ,  H01F17/00 ,  H01F27/29

Abstract: In a coil component and a method for manufacturing the same, a winding part of a coil is grown by plating so as to extend between resin walls of a resin body provided before the coil is grown by plating. The resin wall is interposed between adjacent turns of the winding part of the coil during the plating growth, and therefore contact between adjacent turns of the winding part of the coil cannot occur.

公开(公告)号：US10468184B2

公开(公告)日：2019-11-05

申请号：US14951004

申请日：2015-11-24

Applicant: TDK CORPORATION

Inventor： Hitoshi Ohkubo ,  Masazumi Arata ,  Manabu Ohta ,  Shou Kawadahara ,  Yoshihiro Maeda ,  Takahiro Kawahara ,  Hokuto Eda ,  Shigeki Sato

IPC: H01F41/04 ,  H01F17/00 ,  H01F27/29

Abstract: In a coil component 1 and a method for manufacturing the same, a winding part of a coil is grown by plating so as to extend between resin walls of a resin body provided before the coil is grown by plating. The resin wall is interposed between adjacent turns of the winding part of the coil during the plating growth, and therefore contact between adjacent turns of the winding part of the coil cannot occur.

公开(公告)号：US12217902B2

公开(公告)日：2025-02-04

申请号：US17545629

申请日：2021-12-08

Applicant: TDK CORPORATION

Inventor： Masataro Saito ,  Hokuto Eda ,  Kohei Takahashi ,  Takamasa Iwasaki ,  Masazumi Arata

IPC: H01F27/32 ,  H01F17/04 ,  H01F27/29

Abstract: By overlapping the protruding portion of the first insulator and the protruding portion of the second insulator via the protruding portion of the substrate, the DC superposition characteristic of the coil component is improved.

公开(公告)号：US11854733B2

公开(公告)日：2023-12-26

申请号：US17108023

申请日：2020-12-01

Applicant: TDK CORPORATION

Inventor： Masataro Saito ,  Masazumi Arata ,  Hokuto Eda ,  Kohei Takahashi ,  Takamasa Iwasaki

IPC: H01F5/00 ,  H01F27/28 ,  H01F27/32 ,  H01F27/29

CPC classification number: H01F27/2804 ,  H01F27/29 ,  H01F27/323 ,  H01F2027/2809

Abstract: In a coil component, a double coil is configured of a first coil portion and a second coil portion, and a first through conductor of the first coil portion and a second through conductor of the second coil portion are adjacent to each other. Thus, the first coil portion and the second coil portion have enhanced magnetic coupling at locations (that is, the first through conductor and the second through conductor) at which planar coil patterns of upper and lower surfaces of an insulating substrate are connected, in addition to magnetic coupling in the planar coil patterns wound around a through hole. Therefore, according to the coil component, a high coupling coefficient between the first coil portion and the second coil portion is realized.

公开(公告)号：US11557427B2

公开(公告)日：2023-01-17

申请号：US16733293

申请日：2020-01-03

Applicant: TDK CORPORATION

Inventor： Hitoshi Ohkubo ,  Masazumi Arata ,  Manabu Ohta ,  Yuuya Kaname ,  Yoshihiro Maeda ,  Takahiro Kawahara ,  Hokuto Eda ,  Shigeki Sato

IPC: H01F27/32 ,  H01F17/00 ,  H01F17/04

Abstract: A coil component in which a change in thicknesses of the winding part is prevented is provided. According to the coil component, since each of a pair of neighboring resin walls and a seed part between the pair of resin walls are separated by a predetermined distance, a plating part grown on the seed part is easy to grow uniformly between the pair of neighboring resin walls. For this reason, the winding part whose surface is gentle and in which a change in thickness is prevented is obtained by plating growth.

公开(公告)号：US10943719B2

公开(公告)日：2021-03-09

申请号：US16877944

申请日：2020-05-19

Applicant: TDK CORPORATION

Inventor： Miyuki Asai ,  Hokuto Eda ,  Masazumi Arata ,  Hitoshi Ohkubo

IPC: H01F5/06 ,  H01F17/00

Abstract: In a coil component, an insulation layer covers an upper surface of a conductor pattern. Accordingly, insulating properties between the conductor pattern and a magnetic body are enhanced, and insulating properties between the conductor patterns are enhanced. In addition, in the coil component, the magnetic body enters a space between resin walls such that the insulation layer is covered. Therefore, a volume of the magnetic body above the conductor pattern is increased, and high coil characteristics are realized.

公开(公告)号：US10559417B2

公开(公告)日：2020-02-11

申请号：US15166519

申请日：2016-05-27

Applicant: TDK CORPORATION

Inventor： Hitoshi Ohkubo ,  Masazumi Arata ,  Manabu Ohta ,  Yuuya Kaname ,  Yoshihiro Maeda ,  Takahiro Kawahara ,  Hokuto Eda ,  Shigeki Sato

IPC: H01F5/00 ,  H01F27/32

Abstract: A coil component in which a change in thicknesses of the winding part is prevented is provided. According to the coil component, since each of a pair of neighboring resin walls and a seed part between the pair of resin walls are separated by a predetermined distance, a plating part grown on the seed part is easy to grow uniformly between the pair of neighboring resin walls. For this reason, the winding part whose surface is gentle and in which a change in thickness is prevented is obtained by plating growth.

公开(公告)号：US10210974B2

公开(公告)日：2019-02-19

申请号：US14952028

申请日：2015-11-25

Applicant: TDK CORPORATION

Inventor： Hitoshi Ohkubo ,  Masazumi Arata ,  Manabu Ohta ,  Shou Kawadahara ,  Yoshihiro Maeda ,  Takahiro Kawahara ,  Hokuto Eda ,  Shigeki Sato

IPC: H01F1/24 ,  H01F17/00 ,  H01F17/04 ,  H01F27/29

Abstract: In a coil component (planar coil element), at least part of a third metal magnetic powder constituting a metal magnetic powder and having a minimum average grain diameter is uncoated, which suppresses a reduction in magnetic permeability. On the other hand, the remaining metal powders are coated with glass, which improves the insulating properties of a metal magnetic powder-containing resin and reduces core loss.