公开(公告)号：US20230140621A1

公开(公告)日：2023-05-04

申请号：US18090664

申请日：2022-12-29

Applicant: TDK CORPORATION

Inventor： Yongfu CAI ,  Shuhei MIYAZAKI ,  Kazuma YAMAWAKI

IPC: H01L23/28 ,  H01L23/498 ,  H01L23/00

Abstract: An electronic component package of an embodiment of the disclosure includes a base, a first plated layer, a first electronic component chip, a second plated layer, and a second electronic component chip. The base includes a first surface and a second surface. The first plated layer covers the first surface. The first electronic component chip is provided on the first plated layer with a first insulating layer being interposed therebetween. The second plated layer covers the second surface. The second electronic component chip is provided on the second plated layer with a second insulating layer being interposed therebetween. The first plated layer and the second plated layer each include a first metal material that is less likely to undergo an ion migration phenomenon than silver (Ag).

公开(公告)号：US20230053559A1

公开(公告)日：2023-02-23

申请号：US17857872

申请日：2022-07-05

Applicant: TDK CORPORATION

Inventor： Kazuma YAMAWAKI ,  Shuhei MIYAZAKI

IPC: H01L23/495 ,  H01L21/48

Abstract: A lead frame includes a die pad, a plurality of leads, a frame member, and at least one wire. The frame member includes two first connection bars and two second connection bars. The plurality of leads include a plurality of specific leads. Each of the specific leads is connected to the first connection bar. At least one of the specific leads is connected to the second connection bar via the at least one wire.

公开(公告)号：US20200209324A1

公开(公告)日：2020-07-02

申请号：US16816685

申请日：2020-03-12

Applicant: TDK CORPORATION

Inventor： Kunihiro UEDA ,  Yoshimitsu WADA ,  Hiraku HIRABAYASHI ,  Kazuma YAMAWAKI ,  Tsuyoshi UMEHARA

IPC: G01R33/00 ,  G01R33/09

Abstract: This sensor unit includes a base having a substantially-rectangular planar shape including a first side and a second side that are substantially orthogonal to each other, and a plurality of first sensors provided on the base and arranged on a first axis. The first axis is substantially parallel to the first side and passes through a center position of the base.

公开(公告)号：US20240418806A1

公开(公告)日：2024-12-19

申请号：US18748864

申请日：2024-06-20

Applicant: TDK Corporation

Inventor： Kazuma YAMAWAKI

IPC: G01R33/09 ,  H10N50/10 ,  H10N50/80

Abstract: A magnetic sensor device 1 includes a support substrate 2 and a sensor substrate 10 fixed to the support substrate 2. The sensor substrate 10 includes a first surface 10B facing the support substrate 2 and a second surface 10A that is located on an opposite side to the first surface 10B and that is provided with a functional film 20 including a plurality of magnetic detection elements E, a hole portion 11 is formed in the first surface 10B, an outline O11 of the hole portion 11 includes at least one corner C1, C2, C3 . . . , at least one corner C1, C2, C3 . . . includes a first corner C1 that overlaps at least one of the plurality of magnetic detection elements E in a plan view seen in a plane-normal direction Z from the second surface 10A to the first surface 10B, and the first corner C1 has a radius of curvature of 5 μm or more.

公开(公告)号：US20240418542A1

公开(公告)日：2024-12-19

申请号：US18743267

申请日：2024-06-14

Applicant: TDK CORPORATION

Inventor： Kazuma YAMAWAKI

IPC: G01D5/16 ,  G01B7/30 ,  G01R15/20 ,  G01R19/00 ,  G03B5/00 ,  G03B13/36 ,  H04N23/68

Abstract: A magnetic sensor device includes a plurality of magnetic detection element arrays formed in a first layer, and a wiring layer that is formed in a second layer different from the first layer and electrically connected to the plurality of magnetic detection element arrays, wherein the plurality of magnetic detection element arrays include a first magnetic detection element array, and in a plane-normal direction from the second layer to the first layer, the wiring layer overlaps the first magnetic detection element array to encompass an entirety of the first magnetic detection element array, and the plurality of magnetic detection element arrays do not overlap an outline of the wiring layer.

公开(公告)号：US20240280652A1

公开(公告)日：2024-08-22

申请号：US18591026

申请日：2024-02-29

Applicant: TDK CORPORATION

Inventor： Norikazu OTA ,  Hiraku HIRABAYASHI ,  Kazuma YAMAWAKI ,  Shuhei MIYAZAKI ,  Kazuya WATANABE

IPC: G01R33/09 ,  G01R33/02

CPC classification number: G01R33/098 ,  G01R33/0206 ,  G01R33/093

Abstract: A magnetic sensor device includes at least one magnetic sensor and a support. A center of gravity of an element layout area of the at least one magnetic sensor is deviated from a center of gravity of a reference plane of the support. The at least one magnetic sensor includes four auxiliary resistor sections constituted by a plurality of magnetoresistive elements. The element layout area includes first to fourth areas for laying out the four auxiliary resistor sections, respectively. Two of the first to fourth areas are arranged so that at least parts of the respective two areas sandwich a reference axis therebetween, and other two of the first to fourth areas are arranged so that at least parts of the respective other two areas sandwich the reference axis therebetween.

公开(公告)号：US20230280420A1

公开(公告)日：2023-09-07

申请号：US18197913

申请日：2023-05-16

Applicant: TDK CORPORATION

Inventor： Norikazu OTA ,  Hiraku HIRABAYASHI ,  Kazuma YAMAWAKI ,  Shuhei MIYAZAKI ,  Kazuya WATANABE

IPC: G01R33/09 ,  G01R33/02

CPC classification number: G01R33/098 ,  G01R33/0206 ,  G01R33/093

Abstract: A magnetic sensor device includes at least one magnetic sensor and a support. A center of gravity of an element layout area of the at least one magnetic sensor is deviated from a center of gravity of a reference plane of the support. The at least one magnetic sensor includes four resistor sections constituted by a plurality of magnetoresistive elements. Magnetization of a free layer in each of two of the resistor sections includes a component in a third magnetization direction. The magnetization of a free layer in each of the other two resistor sections includes a component in a fourth magnetization direction opposite to the third magnetization direction.

公开(公告)号：US20220214409A1

公开(公告)日：2022-07-07

申请号：US17703495

申请日：2022-03-24

Applicant: TDK CORPORATION

Inventor： Kunihiro UEDA ,  Yoshimitsu WADA ,  Hiraku HIRABAYASHI ,  Kazuma YAMAWAKI ,  Tsuyoshi UMEHARA

IPC: G01R33/00 ,  G01R33/09

Abstract: This sensor unit includes a base having a substantially-rectangular planar shape including a first side and a second side that are substantially orthogonal to each other, and a plurality of first sensors provided on the base and arranged on a first axis. The first axis is substantially parallel to the first side and passes through a center position of the base.

公开(公告)号：US20160169707A1

公开(公告)日：2016-06-16

申请号：US15051373

申请日：2016-02-23

Applicant: TDK CORPORATION

Inventor： Yohei HIROTA ,  Homare TOKIDA ,  Hiraku HIRABAYASHI ,  Kazuma YAMAWAKI

IPC: G01D5/20

CPC classification number: G01D5/20 ,  G01D5/145 ,  G01R33/09 ,  G01R33/093

Abstract: A first, a second, and a third computing circuit respectively generate a first post-computation signal with a second harmonic component reduced as compared with first and second signals, a second post-computation signal with the second harmonic component reduced as compared with third and fourth signals, and a third post-computation signal with the second harmonic component reduced as compared with fifth and sixth signals. A fourth and a fifth computing circuit respectively generate a fourth post-computation signal with a third harmonic component reduced as compared with the first and second post-computation signals, and a fifth post-computation signal with the third harmonic component reduced as compared with the second and third post-computation signals. A sixth computing circuit determines a detected angle value based on the fourth and fifth post-computation signals.