公开(公告)号：US20230402352A1

公开(公告)日：2023-12-14

申请号：US18318893

申请日：2023-05-17

Applicant: TDK CORPORATION

Inventor： Kazuma YAMAWAKI ,  Hiraku HIRABAYASHI

IPC: H01L23/495 ,  H01L23/00

CPC classification number: H01L23/49565 ,  H01L24/48 ,  H01L24/49 ,  H01L23/4952 ,  H01L2224/48245 ,  H01L2224/49171 ,  H01L2224/48257

Abstract: A lead frame includes a die pad, a plurality of leads, and a frame member. The frame member includes a first connection bar extending in a first direction and a second connection bar extending in a second direction. The die pad is connected to the second connection bar. The plurality of leads include a plurality of first leads connected to the first connection bar and a plurality of second leads connected to the second connection bar. The number of the plurality of second leads is smaller than the number of the plurality of first leads. Each of the plurality of second leads is connected to one corresponding first lead of the plurality of first leads.

公开(公告)号：US20230008088A1

公开(公告)日：2023-01-12

申请号：US17734674

申请日：2022-05-02

Applicant: TDK CORPORATION

Inventor： Norikazu OTA ,  Hiraku HIRABAYASHI ,  Kazuma YAMAWAKI ,  Shuhei MIYAZAKI ,  Kazuya WATANABE

IPC: G01R33/09 ,  G01R33/02

Abstract: A magnetic sensor device includes at least one magnetic sensor and a support. A center of gravity of an element layout area of the at least one magnetic sensor is deviated from a center of gravity of a reference plane of the support. The at least one magnetic sensor includes four resistor sections constituted by a plurality of magnetoresistive elements. Magnetization of a free layer in each of two of the resistor sections includes a component in a third magnetization direction. The magnetization of a free layer in each of the other two resistor sections includes a component in a fourth magnetization direction opposite to the third magnetization direction.

公开(公告)号：US20200035574A1

公开(公告)日：2020-01-30

申请号：US16407623

申请日：2019-05-09

Applicant: TDK Corporation

Inventor： Yongfu CAI ,  Shuhei MIYAZAKI ,  Kazuma YAMAWAKI

IPC: H01L23/28 ,  H01L23/498 ,  H01L23/00

Abstract: An electronic component package of an embodiment of the disclosure includes a base, a first plated layer, a first electronic component chip, a second plated layer, and a second electronic component chip. The base includes a first surface and a second surface. The first plated layer covers the first surface. The first electronic component chip is provided on the first plated layer with a first insulating layer being interposed therebetween. The second plated layer covers the second surface. The second electronic component chip is provided on the second plated layer with a second insulating layer being interposed therebetween. The first plated layer and the second plated layer each include a first metal material that is less likely to undergo an ion migration phenomenon than silver (Ag).

公开(公告)号：US20180017634A1

公开(公告)日：2018-01-18

申请号：US15641529

申请日：2017-07-05

Applicant: TDK CORPORATION

Inventor： Kunihiro UEDA ,  Yoshimitsu WADA ,  Hiraku HIRABAYASHI ,  Kazuma YAMAWAKI ,  Tsuyoshi UMEHARA

IPC: G01R33/00 ,  G01R33/09

CPC classification number: G01R33/0005 ,  G01R33/0082 ,  G01R33/0094 ,  G01R33/09

Abstract: This sensor unit includes a base having a substantially-rectangular planar shape including a first side and a second side that are substantially orthogonal to each other, and a plurality of first sensors provided on the base and arranged on a first axis. The first axis is substantially parallel to the first side and passes through a center position of the base.

公开(公告)号：US20240418801A1

公开(公告)日：2024-12-19

申请号：US18743261

申请日：2024-06-14

Applicant: TDK CORPORATION

Inventor： Kazuma YAMAWAKI

IPC: G01R33/00

Abstract: A magnetic sensor device includes a plurality of magnetic detection element arrays formed in a first layer, and a wiring layer that is formed in a second layer different from the first layer and electrically connected to the plurality of magnetic detection element arrays. The plurality of magnetic detection element arrays include a first magnetic detection element array and a second magnetic detection element array, the first magnetic detection element array and the second magnetic detection element array are each configured of the same number of magnetic detection elements, and in a plane-normal direction from the second layer to the first layer, the number of magnetic detection elements of the first magnetic detection element array overlapping an outline of the wiring layer is substantially the same as the number of magnetic detection elements of the second magnetic detection element array overlapping the outline of the wiring layer.

公开(公告)号：US20240219484A1

公开(公告)日：2024-07-04

申请号：US18607811

申请日：2024-03-18

Applicant: TDK CORPORATION

Inventor： Kunihiro UEDA ,  Yoshimitsu WADA ,  Hiraku HIRABAYASHI ,  Kazuma YAMAWAKI ,  Tsuyoshi UMEHARA

IPC: G01R33/00 ,  B82Y10/00 ,  B82Y25/00 ,  B82Y40/00 ,  G01R15/20 ,  G01R33/07 ,  G01R33/09

CPC classification number: G01R33/0005 ,  B82Y10/00 ,  B82Y25/00 ,  B82Y40/00 ,  G01R33/0094 ,  G01R33/09 ,  G01R33/091 ,  G01R33/093 ,  G01R33/096 ,  G01R33/098 ,  G01R15/205 ,  G01R33/0082 ,  G01R33/07

Abstract: This sensor unit includes a base having a substantially-rectangular planar shape including a first side and a second side that are substantially orthogonal to each other, and a plurality of first sensors provided on the base and arranged on a first axis. The first axis is substantially parallel to the first side and passes through a center position of the base.

公开(公告)号：US20240019505A1

公开(公告)日：2024-01-18

申请号：US18344309

申请日：2023-06-29

Applicant: TDK CORPORATION

Inventor： Kazuma YAMAWAKI ,  Shuhei MIYAZAKI

IPC: G01R33/09

CPC classification number: G01R33/09

Abstract: A magnetic sensor device includes a sensor substrate and a sensor element circuitry. The sensor substrate has a surface. The sensor element circuitry is provided on the surface of the sensor substrate and includes one or more magnetic sensor elements. As viewed in a plane parallel to the surface, the sensor substrate has a perimeter that is substantially octagonal. The perimeter includes two short sides opposed to each other, two long sides opposed to each other, and four corners. The four corners are each chamfered entirely or partially in a thickness direction that is substantially orthogonal to the surface. A ratio of a length of each of the four corners along each of the two long sides of the sensor substrate to a length of each of the two long sides of the sensor substrate is less than or equal to 0.39.

公开(公告)号：US20230056523A1

公开(公告)日：2023-02-23

申请号：US17857838

申请日：2022-07-05

Applicant: TDK CORPORATION

Inventor： Kazuma YAMAWAKI ,  Shuhei MIYAZAKI

IPC: H01L23/495 ,  H01L21/48

Abstract: A lead frame includes a die pad, a plurality of leads, at least one support lead, and a frame member. The frame member includes two first connection bars and two second connection bars. The plurality of leads include a plurality of specific leads. The plurality of specific leads are each connected to the first connection bar. At least one of the specific leads is connected to the second connection bar via the at least one support lead. The cross-sectional second-order moment of a cross section of the at least one support lead perpendicular to a Y direction around an X axis is equal to or more than the cross-sectional second-order moment of a cross section of the at least one support lead perpendicular to an X direction around a Y axis.

公开(公告)号：US20240418800A1

公开(公告)日：2024-12-19

申请号：US18748563

申请日：2024-06-20

Applicant: TDK CORPORATION

Inventor： Kazuma YAMAWAKI

IPC: G01R33/00 ,  G01R33/09

Abstract: A magnetic sensor device 1 includes a support substrate 2, and a sensor substrate 10 fixed to the support substrate 2. The sensor substrate 10 includes a first surface 10B facing the support substrate 2, and a second surface 10A that is located on an opposite side to the first surface 10B and that is provided with a functional film 20 including a plurality of magnetic detection elements E, a hole portion 11 is formed in the first surface 10B, an outline O11 of the hole portion 11 includes at least one corner C1, C2, C3 . . . , and each of the plurality of magnetic detection elements E is disposed not to overlap any of the at least one corner C1, C2, C3 . . . in a plan view seen in a plane-normal direction Z from the second surface 10A toward the first surface 10B.

公开(公告)号：US20240085499A1

公开(公告)日：2024-03-14

申请号：US18448444

申请日：2023-08-11

Applicant: TDK CORPORATION

Inventor： Kazuma YAMAWAKI ,  Shuhei MIYAZAKI

IPC: G01R33/09

CPC classification number: G01R33/098

Abstract: A magnetic sensor device includes a stacked structure including a sensor substrate and a sensor element circuitry. The sensor substrate has a surface and a perimeter. The sensor element circuitry is provided on the surface of the sensor substrate, has a perimeter, and includes one or more magnetic sensor elements. As viewed in a plane parallel to the surface, a portion or all of the perimeter of the sensor element circuitry is located at a position different from a position of the perimeter of the sensor substrate.