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公开(公告)号：US10278290B2
公开(公告)日：2019-04-30
申请号：US15654281
申请日：2017-07-19
Applicant: TDK CORPORATION
Inventor： Kenichi Yoshida , Mitsuhiro Tomikawa
IPC: H01L27/108 , H01L29/76 , H01L29/94 , H01L31/119 , H05K1/18 , H05K1/11 , H05K1/03 , H01L23/00 , H01L23/538
Abstract: An electronic component embedded substrate 1 includes a substrate 10 having a wiring layer 11 and an insulating layer 12; an electronic component 20 built in the substrate 10, and having a pair of electrode layers 21A and 21B, and a dielectric layer 22; and a stress relieving layer 30 provided closer to the wiring layer 11 than the insulating layer 12 is in the lamination direction, wherein at least part of an end portion of the electronic component 20 on the wiring layer 11 side is in contact with the stress relieving layer 30, wherein at least part of an end portion of the electronic component 20 on the insulating layer 12 side is in contact with the insulating layer 12, and wherein the Young's modulus of the stress relieving layer 30 is lower than the Young's modulus of the electrode layer 21B.
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公开(公告)号：US10211157B2
公开(公告)日：2019-02-19
申请号：US15633013
申请日：2017-06-26
Applicant: TDK CORPORATION
Inventor： Kenichi Yoshida , Mitsuhiro Tomikawa , Eiko Wakata
Abstract: An electronic component includes a first electronic component and a second electronic component that is stacked on the first electronic component. A second electrode layer of the first electronic component includes a plurality of divided electrode layers, and a pair of electrodes of the second electronic component are electrically connected to different electrode layers included in the plurality of electrode layers of the second electrode layer, and a first electrode layer of the first electronic component is divided into a plurality of electrode layers to correspond to the electrode layers which are included in the second electrode layer and which are electrically connected to the pair of electrodes of the second electronic component.
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