公开(公告)号：US11101263B2

公开(公告)日：2021-08-24

申请号：US16547615

申请日：2019-08-22

Applicant: TEXAS INSTRUMENTS INCORPORATED

Inventor： Steve Edward Harrell ,  Keith Eric Sanborn ,  Wai Lee ,  Erika Lynn Mazotti

IPC: H01L27/00 ,  H01L23/525 ,  H01L27/08 ,  H01L49/02

Abstract: An electronic device, e.g. a trimmable resistor, includes a plurality of fused resistors, each fused resistor including one or more doped resistive regions formed in a semiconductor substrate. The doped resistive regions may be thermistors. Each fused resistor further includes a corresponding one of a plurality of fusible links. A first terminal of each of the fused resistors is connected to a first terminal of the corresponding fusible link. First and second interconnection buses are located over the substrate, with the first interconnection bus connecting to a second terminal of each of the fused resistors, and the second interconnection bus connecting to a second terminal of each of the fusible links. The plurality of fused resistors have resistance values that form an exponential progression.

公开(公告)号：US20220365018A1

公开(公告)日：2022-11-17

申请号：US17709692

申请日：2022-03-31

Applicant: Texas Instruments Incorporated

Inventor： Ricky Alan Jackson ,  Wai Lee

IPC: G01N27/22

Abstract: Monolithic humidity sensor devices, and methods of manufacture. The devices include circuitry on or over a silicon substrate. A primary passivation barrier is formed over the circuitry with conductive vias therethrough; a capacitor, comprising metal fingers with spaces therebetween, is formed above said primary passivation barrier and electrically coupled by the conductive vias to the circuitry. A secondary passivation barrier is formed over the capacitor. A hygroscopic material layer is formed over the secondary passivation barrier, wherein the capacitor is operable to exhibit a capacitance value responsive to moisture present in the hygroscopic material layer and the circuitry is operable to generate a signal responsive to said capacitance value.

公开(公告)号：US20200075573A1

公开(公告)日：2020-03-05

申请号：US16547615

申请日：2019-08-22

Applicant: TEXAS INSTRUMENTS INCORPORATED

Inventor： Steve Edward Harrell ,  Keith Eric Sanborn ,  Wai Lee ,  Erika Lynn Mazotti

IPC: H01L27/00 ,  H01L23/525

Abstract: An electronic device, e.g. a trimmable resistor, includes a plurality of fused resistors, each fused resistor including one or more doped resistive regions formed in a semiconductor substrate. The doped resistive regions may be thermistors. Each fused resistor further includes a corresponding one of a plurality of fusible links. A first terminal of each of the fused resistors is connected to a first terminal of the corresponding fusible link. First and second interconnection buses are located over the substrate, with the first interconnection bus connecting to a second terminal of each of the fused resistors, and the second interconnection bus connecting to a second terminal of each of the fusible links. The plurality of fused resistors have resistance values that form an exponential progression.