METHOD FOR MANUFACTURING DIELECTRIC LAYER, RESIN COMPOSITION, AND LAMINATE COMPRISING DIELECTRIC LAYER

    公开(公告)号:US20230420156A1

    公开(公告)日:2023-12-28

    申请号:US18208068

    申请日:2023-06-09

    Applicant: TOPPAN INC.

    CPC classification number: H01B3/002 H05K9/0081

    Abstract: A manufacturing method for manufacturing a dielectric layer included in a reflective electromagnetic wave absorber, the method including the steps of: preparing a resin composition containing at least one dielectric compound and a resin component, and having a relative permittivity higher than 10.0 at a frequency of 3.7 GHz or 90 GHz; and forming a dielectric layer made from this resin composition and having a thickness of 20 to 7000 μm. A resin composition according to the present disclosure is used to form a dielectric layer included in a reflective electromagnetic wave absorber, the resin composition containing at least one dielectric compound and a resin component, and having a relative permittivity higher than 10.0 at a frequency of 3.7 GHz or 90 GHz.

    ELECTROMAGNETIC WAVE SUPPRESSION SHEET AND METHOD OF MANUFACTURING SAME

    公开(公告)号:US20220159885A1

    公开(公告)日:2022-05-19

    申请号:US17442505

    申请日:2020-03-26

    Abstract: An electromagnetic wave suppression sheet includes an electromagnetic wave transmitting layer having conductivity and transparency; a suppression layer having transparency; a conductive mesh having openings formed by woven lines; and an adhesive layer having transparency in this order from an outer side toward an inner side. The openings of the conductive mesh have a region in which the suppression layer and the adhesive layer are in contact with each other. A method of manufacturing an electromagnetic wave suppression sheet includes steps of preparing a laminate including the suppression layer, and the conductive mesh disposed to be in contact with the suppression layer; and applying a pressure to the conductive mesh in a direction of the suppression layer.

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