Abstract:
A liquid crystal display device has a reinforced rigidity against external impacts. The liquid crystal display device includes a liquid crystal display panel and a backlight assembly; and a bottom chassis disposed to receive the liquid crystal display panel and the backlight assembly, the bottom chassis having a projection projected from an inner surface of the bottom chassis towards the liquid crystal display panel and the backlight assembly.
Abstract:
Disclosed is a welding-type fixing cap used for attachment to both ends of a cylindrical battery composed of metal materials. The welding-type fixing cap comprises a ring-shaped side wall; a visor surface extending outwards from one end of the side wall; a welding lug formed on the visor surface, wherein the welding lug is meltable in a welding process; a cutting hole formed in the side wall, wherein the cutting hole is dimensioned and configured for discharging gas. The welding lug is positioned distal to the side wall and proximal to a cutting hole. The welding-type fixing cap has a sufficient strength, while recuding electric current leakage during a contact-resistance welding.
Abstract:
A serial interface interposed between two serially connected unit cells provides mechanical strength to the serial connection and conductive coupling therebetween. The serial interface includes an inter-connector having a first vent hole formed therein configured for conductively coupling an anode outer wall of a first unit cell and a cathode terminal of a second unit cell to each other; and a spacer having a second vent hole formed therein and configured to be disposed between the inter-connector and an anode outer wall of the second unit cell to prevent a short-circuit due to the movement of the inter-connector.
Abstract:
A semiconductor device includes a semiconductor substrate having a first conductivity type and having an upper portion, a pair of bit lines extending in a first direction and doped with an impurity of a second conductivity type opposite to the first conductivity type and spaced from one another in the upper portion of the semiconductor substrate, a first line formed between the pair of bit lines having a plurality of alternating recessed device isolation regions and channel regions, with each of the channel regions contacting each bit line of the at least one pair of bit lines, and word lines formed at right angles to the first lines and covering the channel regions.