公开(公告)号：US20210050251A1

公开(公告)日：2021-02-18

申请号：US16866565

申请日：2020-05-05

Applicant: Taiwan Semiconductor Manufacturing Co., Ltd.

Inventor： Yi-Li Hsiao ,  Chih-Hang Tung ,  Chen-Hua Yu ,  Tung-Liang Shao ,  Su-Chun Yang

IPC: H01L21/768 ,  H01L21/50

Abstract: A bonding method of package components and a bonding apparatus are provided. The method includes: providing at least one first package component and a second package component, wherein the at least one first package component has first electrical connectors and a first dielectric layer at a bonding surface of the at least one first package component, and the second package component has second electrical connectors and a second dielectric layer at a bonding surface of the second package component; bringing the at least one first package component and the second package component in contact, such that the first electrical connectors approximate or contact the second electrical connectors; and selectively heating the first electrical connectors and the second electrical connectors by electromagnetic induction, in order to bond the first electrical connectors with the second electrical connectors.