公开(公告)号：US12218089B2

公开(公告)日：2025-02-04

申请号：US18153847

申请日：2023-01-12

Applicant: Taiwan Semiconductor Manufacturing Co., Ltd.

Inventor： Chen-Hua Yu ,  Kuo-Chung Yee ,  Chih-Hang Tung

IPC: H01L23/00 ,  H01L25/00 ,  H01L25/065

Abstract: A semiconductor device includes a first die, a second die on the first die, and a third die on the second die, the second die being interposed between the first die and the third die. The first die includes a first substrate and a first interconnect structure on an active side of the first substrate. The second die includes a second substrate, a second interconnect structure on a backside of the second substrate, and a power distribution network (PDN) structure on the second interconnect structure such that the second interconnect structure is interposed between the PDN structure and the second substrate.

公开(公告)号：US20220310482A1

公开(公告)日：2022-09-29

申请号：US17841007

申请日：2022-06-15

Applicant: Taiwan Semiconductor Manufacturing Co., Ltd.

Inventor： Sheng-Tsung Hsiao ,  Jen Yu Wang ,  Chung-Jung Wu ,  Tung-Liang Shao ,  Chih-Hang Tung

IPC: H01L23/473 ,  H01L21/48 ,  H01L21/56 ,  H01L21/78 ,  H01L23/31 ,  H01L23/498 ,  H01L23/58 ,  H01L23/00

Abstract: Semiconductor devices including lids having liquid-cooled channels and methods of forming the same are disclosed. In an embodiment, a semiconductor device includes a first integrated circuit die; a lid coupled to the first integrated circuit die, the lid including a plurality of channels in a surface of the lid opposite the first integrated circuit die; a cooling cover coupled to the lid opposite the first integrated circuit die; and a heat transfer unit coupled to the cooling cover through a pipe fitting, the heat transfer unit being configured to supply a liquid coolant to the plurality of channels through the cooling cover.

公开(公告)号：US20220037231A1

公开(公告)日：2022-02-03

申请号：US17114886

申请日：2020-12-08

Applicant: Taiwan Semiconductor Manufacturing Co., Ltd.

Inventor： Sheng-Tsung Hsiao ,  Jen Yu Wang ,  Chung-Jung Wu ,  Tung-Liang Shao ,  Chih-Hang Tung

IPC: H01L23/473 ,  H01L23/31 ,  H01L23/498 ,  H01L23/58 ,  H01L23/00 ,  H01L21/48 ,  H01L21/56 ,  H01L21/78

Abstract: Semiconductor devices including lids having liquid-cooled channels and methods of forming the same are disclosed. In an embodiment, a semiconductor device includes a first integrated circuit die; a lid coupled to the first integrated circuit die, the lid including a plurality of channels in a surface of the lid opposite the first integrated circuit die; a cooling cover coupled to the lid opposite the first integrated circuit die; and a heat transfer unit coupled to the cooling cover through a pipe fitting, the heat transfer unit being configured to supply a liquid coolant to the plurality of channels through the cooling cover.

公开(公告)号：US20210407942A1

公开(公告)日：2021-12-30

申请号：US17232528

申请日：2021-04-16

Applicant: Taiwan Semiconductor Manufacturing Co., Ltd.

Inventor： Chen-Hua Yu ,  Kuo-Chung Yee ,  Chih-Hang Tung

IPC: H01L23/00 ,  H01L25/065 ,  H01L25/00

Abstract: A semiconductor device includes a first die, a second die on the first die, and a third die on the second die, the second die being interposed between the first die and the third die. The first die includes a first substrate and a first interconnect structure on an active side of the first substrate. The second die includes a second substrate, a second interconnect structure on a backside of the second substrate, and a power distribution network (PDN) structure on the second interconnect structure such that the second interconnect structure is interposed between the PDN structure and the second substrate.

公开(公告)号：US20240249999A1

公开(公告)日：2024-07-25

申请号：US18605947

申请日：2024-03-15

Applicant: Taiwan Semiconductor Manufacturing Co., Ltd.

Inventor： Sheng-Tsung Hsiao ,  Jen Yu Wang ,  Chung-Jung Wu ,  Tung-Liang Shao ,  Chih-Hang Tung

IPC: H01L23/473 ,  H01L21/48 ,  H01L21/56 ,  H01L21/78 ,  H01L23/00 ,  H01L23/31 ,  H01L23/498 ,  H01L23/58

CPC classification number: H01L23/473 ,  H01L21/4853 ,  H01L21/486 ,  H01L21/4882 ,  H01L21/563 ,  H01L21/565 ,  H01L21/78 ,  H01L23/3121 ,  H01L23/3135 ,  H01L23/49827 ,  H01L23/585 ,  H01L24/16 ,  H01L2224/16227 ,  H01L2924/18161

Abstract: Semiconductor devices including lids having liquid-cooled channels and methods of forming the same are disclosed. In an embodiment, a semiconductor device includes a first integrated circuit die; a lid coupled to the first integrated circuit die, the lid including a plurality of channels in a surface of the lid opposite the first integrated circuit die; a cooling cover coupled to the lid opposite the first integrated circuit die; and a heat transfer unit coupled to the cooling cover through a pipe fitting, the heat transfer unit being configured to supply a liquid coolant to the plurality of channels through the cooling cover.

公开(公告)号：US11107747B2

公开(公告)日：2021-08-31

申请号：US16419672

申请日：2019-05-22

Applicant: Taiwan Semiconductor Manufacturing Co., Ltd.

Inventor： Tung-Liang Shao ,  Jen-Yu Wang ,  Chung-Jung Wu ,  Chih-Hang Tung ,  Chen-Hua Yu

IPC: H01L23/42 ,  H01L23/00 ,  H01L23/31 ,  H01L21/56 ,  H01L25/18

Abstract: A semiconductor package is provided. The semiconductor package includes a substrate and a semiconductor die over the substrate. A heat-dissipating feature covers the substrate and the semiconductor die, and a composite thermal interface material (TIM) structure is thermally bonded between the semiconductor die and the heat-dissipating feature. The composite TIM structure includes a metal-containing matrix material layer and polymer particles embedded in the metal-containing matrix material layer.

公开(公告)号：US09216469B2

公开(公告)日：2015-12-22

申请号：US14057117

申请日：2013-10-18

Applicant: Taiwan Semiconductor Manufacturing Co., Ltd.

Inventor： Yi-Li Hsiao ,  Da-Yuan Shih ,  Chih-Hang Tung ,  Chen-Hua Yu

IPC: B23K37/00 ,  B23K3/06 ,  B23K1/20

CPC classification number: B23K3/0638 ,  B23K1/20 ,  B23K3/0623 ,  B23K2101/40 ,  H01L24/05 ,  H01L24/11 ,  H01L24/13 ,  H01L24/742 ,  H01L2224/0401 ,  H01L2224/05624 ,  H01L2224/05647 ,  H01L2224/05655 ,  H01L2224/05666 ,  H01L2224/11003 ,  H01L2224/1131 ,  H01L2224/1181 ,  H01L2224/11849 ,  H01L2224/13294 ,  H01L2224/133 ,  H01L2224/13301 ,  H01L2224/13309 ,  H01L2224/13311 ,  H01L2224/13313 ,  H01L2224/13318 ,  H01L2224/1332 ,  H01L2224/13339 ,  H01L2224/13347 ,  H01L2924/381 ,  H01L2924/3841 ,  H05K3/3484 ,  H05K2203/041 ,  H01L2924/00012 ,  H01L2924/00014 ,  H01L2924/01048 ,  H01L2924/014 ,  H01L2924/013

Abstract: Some embodiments of the present disclosure relate to an apparatus and method to form a pattern of solder bumps. A solder paste is applied a plate comprising a pattern of holes, where each hole is partially filled by a piston attached to a movable stage. The remainder of the holes are filled by applying a force to the solder paste with a first solder paste application tool. A second solder paste application tool then removes excess paste from the front surface of the plate. The solder paste is then disposed onto a surface of a substrate by moving the movable stage, which fills a larger portion of each hole with a piston, forces the solder paste out of each hole, and forms pattern of solder paste on the surface of the substrate. The pattern of solder paste is then subjected to additional processing to form a pattern of solder bumps.

Abstract translation: 本公开的一些实施例涉及形成焊料凸块图案的装置和方法。 焊膏被施加包括孔图案的板，其中每个孔由附接到可移动台的活塞部分地填充。 通过用第一焊膏施加工具向焊膏施加力来填补剩余的孔。 然后第二个焊膏应用工具从板的前表面去除多余的糊状物。 然后通过移动填充每个孔的较大部分的可移动台用活塞将焊膏设置在基板的表面上，迫使焊膏从每个孔中出来，并在焊料的表面上形成焊膏图案 基质。 然后对焊膏的图案进行附加处理以形成焊料凸块的图案。

公开(公告)号：US20230420337A1

公开(公告)日：2023-12-28

申请号：US17809128

申请日：2022-06-27

Applicant: Taiwan Semiconductor Manufacturing Co., Ltd.

Inventor： Chung-Jung Wu ,  Sheng-Tsung Hsiao ,  Jen Yu Wang ,  Tung-Liang Shao ,  Chih-Hang Tung

IPC: H01L23/473 ,  H01L23/40 ,  H01L25/065

CPC classification number: H01L23/473 ,  H01L23/4006 ,  H01L25/0655 ,  H01L2924/15311 ,  H01L2224/16227 ,  H01L2023/4087 ,  H01L2023/405 ,  H01L2224/16238 ,  H01L24/16

Abstract: Cooling covers including trapezoidal cooling chambers for cooling packaged semiconductor devices and methods of forming the same are disclosed. In an embodiment, a cooling cover for a semiconductor device includes an inlet; an outlet; and a cooling chamber in fluid communication with the inlet and the outlet, the cooling chamber having a trapezoidal shape in a cross-sectional view.

公开(公告)号：US20220285310A1

公开(公告)日：2022-09-08

申请号：US17664484

申请日：2022-05-23

Applicant: Taiwan Semiconductor Manufacturing Co., Ltd.

Inventor： Chen-Hua Yu ,  Ying-Jui Huang ,  Chih-Hang Tung ,  Tung-Liang Shao ,  Ching-Hua Hsieh ,  Chien Ling Hwang ,  Yi-Li Hsiao ,  Su-Chun Yang

IPC: H01L23/00 ,  H01L21/48 ,  H01L25/00

Abstract: A method includes picking up a first package component, removing an oxide layer on an electrical connector of the first package component, placing the first package component on a second package component after the oxide layer is removed, and bonding the first package component to the second package component.

公开(公告)号：US11410910B2

公开(公告)日：2022-08-09

申请号：US17114886

申请日：2020-12-08

Applicant: Taiwan Semiconductor Manufacturing Co., Ltd.

Inventor： Sheng-Tsung Hsiao ,  Jen Yu Wang ,  Chung-Jung Wu ,  Tung-Liang Shao ,  Chih-Hang Tung

IPC: H01L23/473 ,  H01L21/48 ,  H01L21/56 ,  H01L21/78 ,  H01L23/31 ,  H01L23/498 ,  H01L23/58 ,  H01L23/00

Abstract: Semiconductor devices including lids having liquid-cooled channels and methods of forming the same are disclosed. In an embodiment, a semiconductor device includes a first integrated circuit die; a lid coupled to the first integrated circuit die, the lid including a plurality of channels in a surface of the lid opposite the first integrated circuit die; a cooling cover coupled to the lid opposite the first integrated circuit die; and a heat transfer unit coupled to the cooling cover through a pipe fitting, the heat transfer unit being configured to supply a liquid coolant to the plurality of channels through the cooling cover.