WAFER ALIGNMENT STRUCTURE
    11.
    发明公开

    公开(公告)号:US20240136303A1

    公开(公告)日:2024-04-25

    申请号:US18548433

    申请日:2022-02-23

    Applicant: Tesla, Inc.

    CPC classification number: H01L23/544 H01L23/367 H01L2223/54426

    Abstract: A system on a wafer (SoW) assembly is disclosed. The SoW assembly can include a first SoW assembly structure with a first coefficient of thermal expansion (CTE). The first SoW assembly structure includes first to third slots at different locations. The SoW assembly can include a second SoW assembly structure stacked on the first SoW assembly structure. The second SoW assembly structure has a second CTE different from the first CTE. The second SoW assembly structure has first to third pins extending therefrom and disposed in the first to third slots. The first and second slots shaped to allow the first and second pins to move along a first axis, and the third slot shaped to allow the third pin to move along a second axis. The first SoW assembly structure can be a SoW and the second SoW assembly structure can be a heat dissipation structure in certain applications.

    WIRING SYSTEM ARCHITECTURE
    13.
    发明申请

    公开(公告)号:US20220250562A1

    公开(公告)日:2022-08-11

    申请号:US17652599

    申请日:2022-02-25

    Applicant: Tesla, Inc.

    Abstract: A new wiring and power and communications system for an automobile that includes a plurality of devices, wherein the devices are connected to a backbone section that has an outer sheathing, a first conductor disposed within the outer sheathing, a second conductor disposed within the outer sheathing, a pair of inner sheathing members disposed within the outer sheathing and located on opposing sides of the at least one conductor, the inner sheathing members configured to electrically insulate the first conductor from the second conductor, and a shield member disposed within the outer sheathing.

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