公开(公告)号：US09824811B2

公开(公告)日：2017-11-21

申请号：US14576904

申请日：2014-12-19

Applicant: Texas Instruments Incorporated

Inventor： Haiying Li ,  Benjamin Michael Sutton ,  Ming Li

IPC: H01F5/00 ,  H01F27/28 ,  H01F27/02 ,  H01F41/04 ,  H01F17/00 ,  H01F17/06

CPC classification number: H01F27/2804 ,  H01F17/0033 ,  H01F17/045 ,  H01F17/062 ,  H01F27/022 ,  H01F27/2895 ,  H01F27/327 ,  H01F41/041 ,  H01F41/127 ,  H01F2027/2809 ,  H01F2027/2814

Abstract: An embedded coil assembly embodiment includes a ferrite ring having an annular axis. The ferrite ring is positioned on a conductive metal surface. A plurality of separate, spaced apart conductive structures extend over the ferrite ring and are attached to the conductive metal surface in a first region of the conductive surface positioned radially outwardly of the annular axis of the ferrite ring and in a second region of the conductive surface positioned radially inwardly of the annular axis of the ferrite ring. An encapsulation layer covers, the ferrite ring and at least a portion of the plurality of conductive structures.

公开(公告)号：US11676884B2

公开(公告)日：2023-06-13

申请号：US17242121

申请日：2021-04-27

Applicant: Texas Instruments Incorporated

Inventor： Benjamin Michael Sutton ,  Sreenivasan K Koduri ,  Subhashish Mukherjee

IPC: H01L23/495 ,  H01L23/522

CPC classification number: H01L23/49503 ,  H01L23/4951 ,  H01L23/49548 ,  H01L23/5227 ,  H01L2224/48247 ,  H01L2924/0002

Abstract: A coupling device provides galvanic isolation using a leadframe that is configured to support two integrated circuit chips in a coplanar manner. Each chip contains an inductive coupling coil. The lead frame includes a set of bond pads for attaching bond wires to couple to the two integrated circuit chips. Two separated die attach pads support the two chips. Each die attach pad is configured to support one of the two integrated circuit chips with a plurality of cantilevered fingers.

公开(公告)号：US20160181004A1

公开(公告)日：2016-06-23

申请号：US14576934

申请日：2014-12-19

Applicant: Texas Instruments Incorporated

Inventor： Haiying Li ,  Benjamin Michael Sutton ,  Ming Li

IPC: H01F27/28 ,  H01F41/12 ,  H01F41/04

CPC classification number: H01F27/2804 ,  H01F17/0006 ,  H01F17/0033 ,  H01F17/062 ,  H01F27/022 ,  H01F27/2895 ,  H01F41/041 ,  H01F41/043 ,  H01F41/127

Abstract: An embodiment of coil assembly includes a laterally disposed ferrite ring having a central opening. A laterally disposed annular conductive member is positioned above the ferrite ring and has a plurality of spaced-apart circumferential segments. A plurality of bond wires are connected at opposite ends thereof to outer and inner portions of the plurality of spaced-apart circumferential segments. A layer of mold compound covers the ferrite ring and the bond wires.

Abstract translation: 线圈组件的实施例包括具有中心开口的横向设置的铁氧体环。 横向设置的环形导电构件位于铁氧体环的上方并且具有多个间隔开的周向段。 多个接合线在其相对端连接到多个间隔开的周向段的外部和内部。 一层模具化合物覆盖铁氧体环和接合线。

公开(公告)号：US20160181003A1

公开(公告)日：2016-06-23

申请号：US14576904

申请日：2014-12-19

Applicant: Texas Instruments Incorporated

Inventor： Haiying Li ,  Benjamin Michael Sutton ,  Ming Li

IPC: H01F27/28 ,  H01F41/04 ,  H01F27/02

CPC classification number: H01F27/2804 ,  H01F17/0033 ,  H01F17/045 ,  H01F17/062 ,  H01F27/022 ,  H01F27/2895 ,  H01F27/327 ,  H01F41/041 ,  H01F41/127 ,  H01F2027/2809 ,  H01F2027/2814

Abstract: An embedded coil assembly embodiment includes a ferrite ring having an annular axis. The ferrite ring is positioned on a conductive metal surface. A plurality of separate, spaced apart conductive structures extend over the ferrite ring and are attached to the conductive metal surface in a first region of the conductive surface positioned radially outwardly of the annular axis of the ferrite ring and in a second region of the conductive surface positioned radially inwardly of the annular axis of the ferrite ring. An encapsulation layer covers, the ferrite ring and at least a portion of the plurality of conductive structures.

Abstract translation: 嵌入式线圈组件实施例包括具有环形轴线的铁氧体环。 铁氧体环位于导电金属表面上。 多个分离的间隔开的导电结构在铁氧体环上延伸并且在导电表面的位于铁氧体环的环形轴线的径向外侧的第一区域中并且在导电表面的第二区域中附接到导电金属表面 位于铁氧体环的环形轴线的径向内侧。 封装层覆盖铁氧体环和多个导电结构的至少一部分。

公开(公告)号：US20150325501A1

公开(公告)日：2015-11-12

申请号：US14275762

申请日：2014-05-12

Applicant: Texas Instruments Incorporated

Inventor： Benjamin Michael Sutton ,  Sreenivasan K. Koduri ,  Subhashish Mukherjee

IPC: H01L23/495

CPC classification number: H01L23/49503 ,  H01L23/4951 ,  H01L23/5227 ,  H01L2224/48247 ,  H01L2924/0002

Abstract: A coupling device provides galvanic isolation using a leadframe that is configured to support two integrated circuit chips in a coplanar manner. Each chip contains an inductive coupling coil. The lead frame includes a set of bond pads for attaching bond wires to couple to the two integrated circuit chips. Two separated die attach pads support the two chips. Each die attach pad is configured to support one of the two integrated circuit chips with a plurality of cantilevered fingers.

Abstract translation: 耦合器件使用引线框提供电隔离，引线框被配置为以共面方式支撑两个集成电路芯片。 每个芯片都包含一个电感耦合线圈。 引线框架包括用于附接接合线以耦合到两个集成电路芯片的一组接合焊盘。 两个分离的芯片连接焊盘支持两个芯片。 每个管芯附接垫被配置成用多个悬臂指状物支撑两个集成电路芯片中的一个。

公开(公告)号：US20150021721A1

公开(公告)日：2015-01-22

申请号：US13947235

申请日：2013-07-22

Applicant: Texas Instruments Incorporated

Inventor： Matthew David Romig ,  Marie-Solange Anne Milleron ,  Benjamin Michael Sutton

IPC: B81B7/00 ,  B81C1/00

CPC classification number: B81C1/00269 ,  B81C2203/0118 ,  B81C2203/0154 ,  H03H3/0076

Abstract: A method of forming a packaged electronic device includes fabricating a MEMS structure, such as a BAW structure, on a first semiconductor wafer substrate; forming a cavity in a second semiconductor wafer substrate; and mounting the second substrate on the first substrate such that the MEMS structure is positioned inside the cavity in the second substrate. A wafer level assembly and an integrated circuit package are also described.

Abstract translation: 形成封装的电子器件的方法包括在第一半导体晶片衬底上制造诸如BAW结构的MEMS结构; 在第二半导体晶片衬底中形成空腔; 以及将所述第二基板安装在所述第一基板上，使得所述MEMS结构位于所述第二基板中的所述腔内。 还描述了晶片级组件和集成电路封装。