公开(公告)号：US20070218765A1

公开(公告)日：2007-09-20

申请号：US11635090

申请日：2006-12-07

申请人： Thomas Cohen ,  Brian Kirk ,  Marc Cartier

发明人： Thomas Cohen ,  Brian Kirk ,  Marc Cartier

IPC分类号： H01R13/648

CPC分类号： H01R12/727 ,  H01R12/585 ,  H01R12/724 ,  H01R13/514 ,  H01R13/516 ,  H01R13/6461 ,  H01R13/6587 ,  H01R13/6599 ,  H01R43/16 ,  H01R43/24 ,  Y10T29/4922

摘要： An electrical connector includes a wafer formed with a ground shield made from a non-conductive material made conductive with conductive particles disposed therein, thereby eliminating the necessity of the metal ground shield plate found in prior art connectors while maintaining sufficient performance characteristics and minimizing electrical noise generated in the wafer. The wafer housing is formed with a first, insulative housing at least partially surrounding a pair of signal strips and a second, conductive housing at least partially surrounding the first, insulative housing and the signal strips. The housings provide the wafer with sufficient structural integrity, obviating the need for additional support structures or components for a wafer. Ground strips may be employed in the wafer and may be formed in the same plane as the signal strips. The second, conductive housing may be connected (e.g., molded) to the ground strips and spaced appropriately from the signal strips. The wafer may also include air gaps between the signal strips of one wafer and the conductive housing of an adjacent wafer further reducing electrical noise or other losses (e.g., cross-talk) without sacrificing significant signal strength.

摘要翻译： 电连接器包括形成有由不导电材料制成的接地屏蔽的晶片，其中导电颗粒被布置在其中，从而消除了现有技术连接器中发现的金属接地屏蔽板的必要性，同时保持足够的性能特性并最小化电噪声 在晶片中产生。 晶片壳体形成有至少部分地围绕一对信号带的第一绝缘壳体和至少部分地围绕第一绝缘壳体和信号条的第二导电壳体。 这些外壳为晶片提供了足够的结构完整性，从而避免了对晶片的附加支撑结构或部件的需要。 接地条可以用在晶片中，并且可以形成在与信号条相同的平面中。 第二导电壳体可以被连接（例如，模制）到接地条并且与信号条适当地隔开。 晶片还可以包括一个晶片的信号条和相邻晶片的导电外壳之间的气隙，从而进一步降低电噪声或其他损耗（例如串扰），而不会牺牲显着的信号强度。

公开(公告)号：US20070004282A1

公开(公告)日：2007-01-04

申请号：US11183564

申请日：2005-07-18

申请人： Thomas Cohen ,  Brian Kirk ,  Marc Cartier

发明人： Thomas Cohen ,  Brian Kirk ,  Marc Cartier

IPC分类号： H01R13/648

CPC分类号： H01R12/727 ,  H01R12/585 ,  H01R12/724 ,  H01R13/514 ,  H01R13/516 ,  H01R13/6461 ,  H01R13/6587 ,  H01R13/6599 ,  H01R43/16 ,  H01R43/24 ,  Y10T29/4922

摘要： An electrical connector includes a wafer formed with a ground shield made from a non-conductive material made conductive with conductive particles disposed therein, thereby eliminating the necessity of the metal ground shield plate found in prior art connectors while maintaining sufficient performance characteristics and minimizing electrical noise generated in the wafer. The wafer housing is formed with a first, insulative housing at least partially surrounding a pair of signal strips and a second, conductive housing at least partially surrounding the first, insulative housing and the signal strips. The housings provide the wafer with sufficient structural integrity, obviating the need for additional support structures or components for a wafer. Ground strips may be employed in the wafer and may be formed in the same plane as the signal strips. The second, conductive housing may be connected (e.g., molded) to the ground strips and spaced appropriately from the signal strips. The wafer may also include air gaps between the signal strips of one wafer and the conductive housing of an adjacent wafer further reducing electrical noise or other losses (e.g., cross-talk) without sacrificing significant signal strength.

摘要翻译： 电连接器包括形成有由不导电材料制成的接地屏蔽的晶片，其中导电颗粒被布置在其中，从而消除了现有技术连接器中发现的金属接地屏蔽板的必要性，同时保持足够的性能特性并最小化电噪声 在晶片中产生。 晶片壳体形成有至少部分地围绕一对信号带的第一绝缘壳体和至少部分地围绕第一绝缘壳体和信号条的第二导电壳体。 这些外壳为晶片提供了足够的结构完整性，从而避免了对晶片的附加支撑结构或部件的需要。 接地条可以用在晶片中，并且可以形成在与信号条相同的平面中。 第二导电壳体可以被连接（例如，模制）到接地条并且与信号条适当地隔开。 晶片还可以包括一个晶片的信号条和相邻晶片的导电外壳之间的气隙，从而进一步降低电噪声或其他损耗（例如串扰），而不会牺牲显着的信号强度。

公开(公告)号：US20050136739A1

公开(公告)日：2005-06-23

申请号：US10744328

申请日：2003-12-23

申请人： Donald Milbrand ,  Thomas Cohen

发明人： Donald Milbrand ,  Thomas Cohen

IPC分类号： H01R12/16 ,  H01R13/502 ,  H01R13/648

CPC分类号： H01R12/737 ,  H01R12/712 ,  H01R12/721 ,  H01R13/502 ,  H01R13/6585

摘要： There is disclosed a two-piece electrical connector assembly having a first electrical connector and a second electrical connector. The first electrical connector includes a plurality of first signal conductors disposed along first and second sides of a first insulative housing and first ground plates disposed along the first and second sides of the first insulative housing and positioned adjacent the plurality of first signal conductors. The first electrical connector defines a slot for receiving an edge of a first printed circuit board. The second electrical connector includes a plurality of second signal conductors disposed along first and second sides of a second insulative housing and second ground plates disposed along the first and second sides of the second insulative housing and positioned adjacent the plurality of second signal conductors. Each of the second ground plates has a surface with a first edge and a second edge, at least one of the first edge or the second edge being bent in the direction toward the corresponding second signal conductor. When the first electrical connector and the second electrical connector are mated, the first signal conductors and corresponding second signal conductors are substantially enclosed and shielded by the first and second ground plates.

摘要翻译： 公开了一种具有第一电连接器和第二电连接器的两件式电连接器组件。 第一电连接器包括沿着第一绝缘壳体的第一和第二侧布置的多个第一信号导体和沿着第一绝缘壳体的第一和第二侧布置并且邻近多个第一信号导体定位的第一接地板。 第一电连接器限定用于接收第一印刷电路板的边缘的槽。 第二电连接器包括沿着第二绝缘壳体的第一和第二侧布置的多个第二信号导体和沿着第二绝缘壳体的第一和第二侧布置并且邻近多个第二信号导体定位的第二接地板。 每个第二接地板具有具有第一边缘和第二边缘的表面，第一边缘或第二边缘中的至少一个沿着朝向相应的第二信号导体的方向弯曲。 当第一电连接器和第二电连接器配合时，第一信号导体和对应的第二信号导体基本上被第一和第二接地板封闭和屏蔽。

公开(公告)号：US20050070160A1

公开(公告)日：2005-03-31

申请号：US10675087

申请日：2003-09-30

申请人： Thomas Cohen ,  Marc Cartier ,  John Dunham ,  Jason Payne

发明人： Thomas Cohen ,  Marc Cartier ,  John Dunham ,  Jason Payne

IPC分类号： H01R12/16 ,  H01R13/648

CPC分类号： H01R12/724 ,  H01R13/6585 ,  Y10S439/947

摘要： There is disclosed an electrical connector assembly having a first electrical connector mateable to a second electrical connector. In one embodiment, the first electrical connector includes a plurality of wafers, with each wafer having an insulative housing, a plurality of signal conductors and a shield plate. A portion of the shield plate is exposed so that a conductive member can electrically connect the shield plates of the wafers at the exposed portion of the shield plate. In one embodiment, the second electrical connector includes an insulative housing, and a plurality of signal conductors and ground conductors in a plurality of rows. Each row corresponds to a wafer of the first electrical connector. Each signal conductor has a contact tail and each ground conductors has two contact tails. The signal conductors and the ground conductors are positioned adjacent to one another so that for each signal conductor contact tail, there are ground conductor contact tails adjacent either side of the signal conductor contact tail.

摘要翻译： 公开了一种具有可与第二电连接器配合的第一电连接器的电连接器组件。 在一个实施例中，第一电连接器包括多个晶片，每个晶片具有绝缘壳体，多个信号导体和屏蔽板。 屏蔽板的一部分被暴露，使得导电构件可以在屏蔽板的暴露部分处电连接晶片的屏蔽板。 在一个实施例中，第二电连接器包括绝缘壳体，以及多个信号导体和多行中的接地导体。 每行对应于第一电连接器的晶片。 每个信号导体具有接触尾部，并且每个接地导体具有两个接触尾部。 信号导体和接地导体彼此相邻地定位，使得对于每个信号导体接触尾部，在信号导体接触尾部的任一侧具有接地导体接触尾部。

公开(公告)号：US5993259A

公开(公告)日：1999-11-30

申请号：US797537

申请日：1997-02-07

申请人： Philip T. Stokoe ,  Thomas Cohen ,  Steven J. Allen

发明人： Philip T. Stokoe ,  Thomas Cohen ,  Steven J. Allen

IPC分类号： H01R12/50 ,  H01R13/514 ,  H01R43/16 ,  H01R13/648

CPC分类号： H01R13/514 ,  H01R23/688 ,  H01R12/716 ,  H01R12/724 ,  H01R13/6587 ,  H01R43/16

摘要： A high speed, high density electrical connector for use with printed circuit boards. The connector is in two pieces with one piece having pins and shield plates and the other having socket type signal contacts and shield plates. The shields have a grounding arrangement which is adapted to control the electromagnetic fields, for various system architectures, simultaneous switching configurations and signal speeds, allowing all of the socket type signal contacts to be used for signal transmission. Additionally, at least one piece of the connector is manufactured from wafers, with each ground plane and signal column injection molded into components which, when combined, form a wafer. This construction allows very close spacing between adjacent columns of signal contacts as well as tightly controlled spacing between the signal contacts and the shields. It also allows for easy and flexible manufacture, such as a connector that has wafers intermixed in a configuration to accommodate single ended, point to point and differential applications.

摘要翻译： 用于印刷电路板的高速，高密度电连接器。 连接器为两片，一片具有销和屏蔽板，另一个具有插座型信号触点和屏蔽板。 屏蔽件具有适于控制电磁场的接地装置，用于各种系统架构，同时开关配置和信号速度，允许将所有插座型信号触点用于信号传输。 另外，至少一片连接器由晶片制成，每个接地平面和信号柱都注射成型，当被组合时形成晶片。 这种结构允许在相邻的信号触点列之间具有非常紧密的间隔，以及在信号触头和屏蔽之间的紧密控制的间隔。 它还允许简单和灵活的制造，例如具有在配置中混合以适应单端，点对点和差分应用的晶片的连接器。

公开(公告)号：US20080026638A1

公开(公告)日：2008-01-31

申请号：US11902552

申请日：2007-09-24

申请人： Thomas Cohen ,  Mark Gallus ,  John Dunham

发明人： Thomas Cohen ,  Mark Gallus ,  John Dunham

IPC分类号： H01R13/648

CPC分类号： H01R12/716 ,  H01R12/585 ,  H01R12/724 ,  H01R12/727 ,  H01R13/514 ,  H01R13/6474 ,  H01R13/6587 ,  H01R13/6591 ,  H05K1/14 ,  H05K7/1445 ,  H05K2201/044 ,  H05K2201/10189 ,  H05K2203/1572

摘要： A differential connector has a plurality of rows. Each row includes a plurality of signal conductors provided as differential pairs. Each signal conductor has a first contact end connectable to a printed circuit board, a second contact end, and an intermediate portion having a first width. For each differential pair, one first contact end lies along a first line parallel to the plurality of rows and the other first contact end lies along a second line parallel to and spaced from the first line. The differential connector further includes a plurality of ground conductors, with each ground conductor corresponding to a differential pair. Each ground conductor has a first contact end connectable to the printed circuit board, a second contact end, and an intermediate portion having a second width that is at least twice the first width.

摘要翻译： 差分连接器具有多行。 每行包括多个作为差分对提供的信号导体。 每个信号导体具有可连接到印刷电路板的第一接触端，第二接触端和具有第一宽度的中间部分。 对于每个差分对，一个第一接触端沿着平行于多个行的第一线设置，而另一个第一接触端沿着与第一线平行并与之隔开的第二线。 差分连接器还包括多个接地导体，每个接地导体对应于差分对。 每个接地导体具有可连接到印刷电路板的第一接触端，第二接触端和具有至少两倍于第一宽度的第二宽度的中间部分。

公开(公告)号：US20070054554A1

公开(公告)日：2007-03-08

申请号：US11220382

申请日：2005-09-06

申请人： Trent Do ,  Thomas Cohen

发明人： Trent Do ,  Thomas Cohen

IPC分类号： H01R13/648

CPC分类号： H01R13/6587

摘要： An electrical connector with a reference contact for improved shielding. The contact provides multiple points of contact between members in the ground structure of two mating connectors. The points of contact are arranged to provide desirable current flow in the signal paths and ground structures of the connectors. The contact is stamped from a shield plate and has multiple elongated members that provide spring force for adequate electrical connection. The elongated members are curved to position the points of contact with the desired orientation. Such a contact structure may be used alone or in combination with other compliant structures providing further points of contact.

摘要翻译： 具有参考触点的电连接器，用于改善屏蔽。 接触件提供两个配合连接器的接地结构中的构件之间的多个接触点。 接触点被布置成在连接器的信号路径和接地结构中提供期望的电流。 接触件由屏蔽板冲压而成，并具有多个细长构件，其提供用于充分电连接的弹簧力。 细长构件弯曲以将接触点定位成所需的取向。 这样的接触结构可以单独使用或者与提供另外的接触点的其它柔顺结构组合使用。

公开(公告)号：US20060141870A1

公开(公告)日：2006-06-29

申请号：US11059492

申请日：2005-02-08

申请人： Donald Milbrand ,  Thomas Cohen

发明人： Donald Milbrand ,  Thomas Cohen

IPC分类号： H01R13/514

CPC分类号： H01R13/5219 ,  H01R12/714

摘要： A chip socket with one or more seals protecting the contact members. The seals are formed in a multi-step molding process. In a first step, an insulative housing is formed with grooves in the surface. In the second step, a seal material is molded into the grooves with a portion extending above the surface of the insulative housing. In use, surfaces of the chip socket are pressed against a semiconductor chip or a circuit board. When pressed together, the components of the connector system form seals that protect contact members from environmental conditions. The seals allow reliable electrical connections to be made with reduced force per contact. Greater flexibility in designing the contact members is therefore provided contact members having a low spring force and a relatively large deflection range, thereby accommodating a less stringent coplanarity requirement for the chip and circuit board.

摘要翻译： 具有一个或多个密封件的芯片插座，用于保护接触构件。 密封件以多步骤成型工艺形成。 在第一步骤中，在表面上形成有凹槽的绝缘壳体。 在第二步骤中，密封材料被模制到具有在绝缘壳体的表面上方延伸的部分的槽中。 在使用中，芯片插座的表面被压靠在半导体芯片或电路板上。 当压在一起时，连接器系统的部件形成密封件，保护接触件免受环境条件的影响。 密封件允许以每次接触力减小的力量进行可靠的电连接。 因此，设计接触构件的更大灵活性是提供具有低弹簧力和相对大的偏转范围的接触构件，从而适应对于芯片和电路板的较不严格的共平面要求。

公开(公告)号：US06238245B1

公开(公告)日：2001-05-29

申请号：US09389854

申请日：1999-08-26

申请人： Philip T. Stokoe ,  Thomas Cohen ,  Steven J. Allen

发明人： Philip T. Stokoe ,  Thomas Cohen ,  Steven J. Allen

IPC分类号： H01R13648

CPC分类号： H01R13/514 ,  H01R12/716 ,  H01R12/724 ,  H01R13/6476 ,  H01R13/6586 ,  H01R13/6587 ,  H01R43/16

摘要： A high speed, high density electrical connector for use with printed circuit boards. The connector is in two pieces with one piece having pins and shield plates and the other having socket type signal contacts and shield plates. The shields have a grounding arrangement which is adapted to control the electromagnetic fields, for various system architectures, simultaneous switching configurations and signal speeds, allowing all of the socket type signal contacts to be used for signal transmission. Additionally, at least one piece of the connector is manufactured from wafers, with each ground plane and signal column injection molded into components which, when combined, form a wafer. This construction allows very close spacing between adjacent columns of signal contacts as well as tightly controlled spacing between the signal contacts and the shields. It also allows for easy and flexible manufacture, such as a connector that has wafers intermixed in a configuration to accommodate single ended, point to point and differential applications.