公开(公告)号：US20220274260A1

公开(公告)日：2022-09-01

申请号：US17682754

申请日：2022-02-28

Applicant: Tokyo Electron Limited

Inventor： Masahiro DOGOME

IPC: B25J11/00 ,  B25J15/00

Abstract: A substrate accommodating device accommodating a substrate transferred by a transfer device having an end effector configured to hold a substrate and a member including a consumable part disposed in a substrate processing apparatus for processing the substrate includes a container. A first opening through which the end effector holding the substrate passes is formed on a sidewall of the container. A recess into which front ends of the end effector are inserted is formed on an inner surface of the container facing the first opening.

公开(公告)号：US20220208576A1

公开(公告)日：2022-06-30

申请号：US17563906

申请日：2021-12-28

Applicant: TOKYO ELECTRON LIMITED

Inventor： Masahiro DOGOME ,  Masatomo KITA

IPC: H01L21/67 ,  C23C16/455 ,  C23C16/44

Abstract: A substrate processing apparatus includes one or more substrate processing modules; a vacuum transfer module connected to the one or more substrate processing modules;
and a load-lock module including at least three load-lock chambers arranged along a first horizontal direction. A tubular fitting module is disposed between the vacuum transfer module and the load-lock module, and the tubular fitting module has a first opening and a second opening. The first opening is connected to the load-lock module, and the second opening is connected to the vacuum transfer module. The first opening has a first length in the first horizontal direction, the second opening has a second length in the first horizontal direction, and the first length is larger than the second length. A transfer mechanism transfers a substrate between the one or more substrate processing modules and the load-lock module through the tubular fitting module.

公开(公告)号：US20220013339A1

公开(公告)日：2022-01-13

申请号：US17368887

申请日：2021-07-07

Applicant: Tokyo Electron Limited

Inventor： Masahiro DOGOME

IPC: H01J37/32 ,  H01L21/687 ,  H01L21/683

Abstract: There is provided a substrate support of a plasma processing apparatus. The substrate support includes a wafer placement surface and a ring placement surface on which a first ring and a second ring disposed at an outer peripheral side of the first ring without overlapping with the first ring in a vertical direction are placed, with a hole at a boundary between the first ring and the second ring. The substrate support further includes a lifter pin having a first holding portion and a second holding portion, the second holding portion being unitary with and extending axially from a base end of the first holding portion and having a protruding portion protruding from an outer circumference of the first holding portion, and a driving mechanism configured to raise and lower the lifter pin.