公开(公告)号：US20250069940A1

公开(公告)日：2025-02-27

申请号：US18946976

申请日：2024-11-14

Applicant: Tokyo Electron Limited

Inventor： Norihiko AMIKURA ,  Masatomo KITA ,  Masahiro DOGOME ,  Takami FUKASAWA ,  Daisuke HAYASHI ,  Toshiaki TOYOMAKI

IPC: H01L21/687 ,  B25J11/00 ,  H01L21/683

Abstract: A transfer device for simultaneously or separately transferring a wafer and a consumable part having a circular shape is disclosed. The consumable part is disposed in a wafer processing module, and the outer diameter of the consumable part is larger than the outer diameter of the wafer. The transfer device comprises an end effector configured to place the wafer and the consumable part thereon simultaneously or separately, an arm configured to move the end effector, and a controller configured to control the arm, to place the consumable part on the end effector such that the center of gravity of the consumable part coincides with a first position when transferring the consumable part, and to place the wafer on the end effector such that the center of gravity of the wafer coincides with a second position between the first position and front ends of the end effector when transferring the wafer.

公开(公告)号：US20190214289A1

公开(公告)日：2019-07-11

申请号：US16223841

申请日：2018-12-18

Applicant: TOKYO ELECTRON LIMITED

Inventor： Masahiro DOGOME ,  Keisuke KONDOH

IPC: H01L21/687 ,  B25J9/16 ,  B25J18/04 ,  B65G47/90 ,  H01L21/677 ,  H01L21/67

Abstract: A substrate gripping mechanism, for gripping a substrate between a fixed clamp portion to be engaged with an edge portion of a substrate and a movable clamp portion configured to reciprocate with respect to the fixed clamp portion by a reciprocating driving unit, includes an interlocking member configured to move together with the movable clamp portion, and a first sensor and a second sensor, each having a detection region and configured to detect whether or not the interlocking member exists in the detection region. The interlocking member has a first to a fourth portion connected in a reciprocating direction of the movable clamp portion. The first to the fourth portion have shapes to make detection results thereof by the first sensor and the second sensor different from each other.

公开(公告)号：US20220230898A1

公开(公告)日：2022-07-21

申请号：US17577152

申请日：2022-01-17

Applicant: TOKYO ELECTRON LIMITED

Inventor： Masahiro DOGOME ,  Masatomo KITA

IPC: H01L21/67 ,  H01J37/32 ,  H01L21/677

Abstract: Embodiments of this application discloses a substrate processing apparatus comprising: a vacuum transfer module having a vacuum transfer space and an opening; a wall unit attached to the opening and including a first gate valve and a second gate valve; a substrate processing module attached to the wall unit and having a substrate processing space communicating with the vacuum transfer space via the first gate valve; and a ring stocker attached to the wall unit and having a storage space for storing at least one annular member used in a plasma processing module. Moreover, the apparatus further includes a transfer mechanism disposed in the vacuum transfer space and transfers a substrate between the vacuum transfer space and the substrate processing space through the first gate valve and also transfers at least one annular member between the vacuum transfer space and the storage space via the second gate valve.

公开(公告)号：US20170011940A1

公开(公告)日：2017-01-12

申请号：US15202658

申请日：2016-07-06

Applicant: TOKYO ELECTRON LIMITED

Inventor： Takehiro SHINDO ,  Tadashi SHIONERI ,  Masahiro DOGOME

IPC: H01L21/67 ,  H01L21/677

CPC classification number: H01L21/67259 ,  H01L21/67167 ,  H01L21/67196 ,  H01L21/67739 ,  H01L21/67742 ,  H01L21/68

Abstract: When an edge of a wafer passes above a right sensor and a left sensor disposed in a conveyance route of the wafer to a substrate processing chamber, four edge intersecting points are acquired in a first wafer coordinate system, and a reference edge intersecting point set composed of two adjacent edge intersecting points is created from the four edge intersecting points. Between the two remaining edge intersecting points which do not constitute the reference edge intersecting point set, an edge intersecting point present within an area surrounded by two circles defined based on the two edge intersecting points constituting the reference edge intersecting point set is selected as an effective edge intersecting point, and a central position of a circle passing through the reference edge intersecting points and the effective edge intersecting point is acquired as a central position of the wafer.

Abstract translation: 当晶片的边缘穿过位于晶片的输送路径中的右传感器和左传感器到基板处理室时，在第一晶片坐标系中获取四个边缘交叉点，并且基准边交点点组合 从四个边缘相交点创建两个相邻的边缘相交点。 在不构成参考边缘相交点集的两个剩余边缘相交点之间，选择存在于由构成参考边缘相交点集合的两个边缘相交点限定的两个圆圈围成的区域内的边缘相交点作为有效 并且获取通过参考边缘的交叉点和有效边缘交叉点的圆的中心位置作为晶片的中心位置。

公开(公告)号：US20220059395A1

公开(公告)日：2022-02-24

申请号：US17404671

申请日：2021-08-17

Applicant: TOKYO ELECTRON LIMITED

Inventor： Masahiro DOGOME

IPC: H01L21/687 ,  B25J11/00 ,  B25J18/02 ,  B25J9/14

Abstract: There is provided a device for transferring a substrate under air pressure. The device comprises a base part, a transfer arm part configured to transfer a substrate, a telescopic shaft part which is provided between the base part and the transfer arm part, and divided into a plurality of division shaft parts having a tubular shape, an annular channel which is provided in a circumference of a surface of a division shaft parts, and an exhaust channel which is connected to the annular channel so as to exhaust the gas flowing into the annular channel.

公开(公告)号：US20210280441A1

公开(公告)日：2021-09-09

申请号：US17195322

申请日：2021-03-08

Applicant: TOKYO ELECTRON LIMITED

Inventor： Norihiko AMIKURA ,  Masahiro DOGOME ,  Masatomo KITA

IPC: H01L21/67 ,  H01L21/677

Abstract: A substrate transfer system includes an atmospheric substrate transfer module, a vacuum substrate transfer module, and a load lock module disposed on a side surface of the atmospheric substrate transfer module and disposed on an upper surface or a lower surface of the vacuum substrate transfer module. The load lock module includes a container having a first substrate transfer opening and a second substrate transfer opening, a first gate configured to open or close the first substrate transfer opening, a second gate configured to open or close the second substrate transfer opening, and a substrate actuator configured to vertically move a substrate through the second substrate transfer opening between a first position in the container and a second position in the vacuum substrate transfer module.

公开(公告)号：US20160011587A1

公开(公告)日：2016-01-14

申请号：US14794893

申请日：2015-07-09

Applicant: TOKYO ELECTRON LIMITED

Inventor： Masahiro DOGOME ,  Hiroshi IKARI ,  Toshiaki TOYOMAKI ,  Genichi NANASAKI ,  Takehiro SHINDO

IPC: G05B19/418

CPC classification number: G05B19/4189 ,  B25J11/0095 ,  B25J19/0066 ,  B25J21/00 ,  B65G47/91 ,  G05B2219/45031 ,  G05B2219/45054 ,  H01L21/67766 ,  H01L21/68 ,  Y02P90/083 ,  Y02P90/28

Abstract: Provided is a conveyance robot replacement apparatus used for replacing a conveyance robot installed in an atmosphere conveyance chamber of a semiconductor manufacturing apparatus in order to convey a substrate. The conveyance robot replacement apparatus includes a positioning unit configured to determine a position of the conveyance robot replacement apparatus with respect to the atmospheric conveyance chamber, a holding unit configured to suspend the conveyance robot to be supported, a guide portion configured to guide advancing and retreating into and from the atmospheric conveyance chamber of the holding unit by being engaged with the positioning unit, a position adjustment unit configured move the holding unit in each of the longitudinal direction, the horizontal direction, and the vertical direction to adjust a position of the holding unit, and a connecting component connectable to the holding unit as well as the conveyance robot.

Abstract translation: 提供一种输送机器人更换装置，其用于更换安装在半导体制造装置的气氛输送室中的输送机器人，以便输送基板。 所述输送机器人更换装置包括定位单元，所述定位单元构造为确定所述输送机器人更换装置相对于所述大气输送室的位置;保持单元，其构造成将所述运送机器人悬挂在被支撑体上;引导部，其构造成引导前进和后退 通过与所述定位单元接合而进入和离开所述保持单元的大气输送室，所述位置调整单元构造成在所述纵向方向，水平方向和垂直方向中的每一个中移动所述保持单元，以调整所述保持单元的位置 单元，以及可连接到保持单元和输送机器人的连接部件。

公开(公告)号：US20250096020A1

公开(公告)日：2025-03-20

申请号：US18963762

申请日：2024-11-29

Applicant: TOKYO ELECTRON LIMITED

Inventor： Masahiro DOGOME ,  Masatomo KITA

IPC: H01L21/67 ,  H01J37/32 ,  H01L21/677

Abstract: Embodiments of this application discloses a substrate processing apparatus comprising: a vacuum transfer module having a vacuum transfer space and an opening; a wall unit attached to the opening and including a first gate valve and a second gate valve; a substrate processing module attached to the wall unit and having a substrate processing space communicating with the vacuum transfer space via the first gate valve; and a ring stocker attached to the wall unit and having a storage space for storing at least one annular member used in a plasma processing module. Moreover, the apparatus further includes a transfer mechanism disposed in the vacuum transfer space and transfers a substrate between the vacuum transfer space and the substrate processing space through the first gate valve and also transfers at least one annular member between the vacuum transfer space and the storage space via the second gate valve.

公开(公告)号：US20240213057A1

公开(公告)日：2024-06-27

申请号：US18600829

申请日：2024-03-11

Applicant: Tokyo Electron Limited

Inventor： Masahiro DOGOME ,  Masatomo KITA

IPC: H01L21/67 ,  H01L21/677 ,  H01L21/687

CPC classification number: H01L21/67196 ,  H01L21/67742 ,  H01L21/68764

Abstract: A transfer apparatus includes a first vacuum transfer module; a first transfer robot disposed in the first vacuum transfer module and at least one ring. In addition, a second vacuum transfer module is provided; and a second transfer robot is disposed in the second vacuum transfer module. A tubular connecting module is disposed between the first vacuum transfer module and the second vacuum transfer module. Further, the first vacuum transfer module, the second vacuum transfer module and the tubular connecting module are arranged along a first direction, with the tubular connecting module having a first length in the first direction, and the first length is smaller than the diameter of the wafer. A wafer support is rotatably attached to the tubular connecting module and at least three ring supporting members outwardly extend from the wafer support to support the at least one ring.

公开(公告)号：US20230317480A1

公开(公告)日：2023-10-05

申请号：US18129473

申请日：2023-03-31

Applicant: Tokyo Electron Limited

Inventor： Masahiro DOGOME

IPC: H01L21/67 ,  H01L21/677 ,  H01L21/687 ,  H01J37/32

CPC classification number: H01L21/67196 ,  H01L21/67739 ,  H01L21/68792 ,  H01J37/32513 ,  H01J37/32899 ,  H01J2237/166 ,  H01J2237/186

Abstract: A gate valve apparatus and a semiconductor manufacturing apparatus, in which a volume of a drive portion for driving a valve body is reduced, are provided. The gate valve apparatus includes a housing having an opening, a valve body configured to open and close the opening, and a drive portion configured to drive the valve body, in which the drive portion includes a first crankshaft including a first input shaft rotatably supported by a side wall of the housing and a first output shaft rotatably supported by the valve body, a second crankshaft including a second input shaft rotatably supported by the side wall of the housing and a second output shaft rotatably supported by the valve body, a rotation transmission portion configured to transmit rotation of the first input shaft to the second input shaft, and an actuator configured to rotate the first input shaft.