公开(公告)号：US20230003510A1

公开(公告)日：2023-01-05

申请号：US17939080

申请日：2022-09-07

Applicant: Tokyo Seimitsu Co., Ltd.

Inventor： Hideki MORII ,  Katsufumi MORIYAMA

IPC: G01B11/12 ,  G01B11/00

Abstract: The inner surface shape measurement device, which measures an inner surface shape of a small hole formed in a workpiece, includes: a rotating body for rotating the workpiece around a rotation axis, and a linear-and-tilting-motion stage; an elongated probe capable of being inserted into the small hole of the workpiece; a probe linear-and-tilting-motion mechanism capable of adjusting posture of the probe; a camera, configured to be rotatable integrally with the rotating body, for imaging the probe from at least three circumferential positions on a rotation trajectory centered on a rotation axis; and a controller for adjusting the posture of the probe using the probe linear-and-tilting-motion mechanism based on an image taken by the camera at each of the circumferential positions.