公开(公告)号：US20240393104A1

公开(公告)日：2024-11-28

申请号：US18795866

申请日：2024-08-06

Applicant: Tokyo Seimitsu Co., Ltd.

Inventor： Yoshiyuki KAWATA ,  Katsufumi MORIYAMA ,  Hideki MORII

IPC: G01B11/24 ,  G01D5/347 ,  H04N23/695

Abstract: A surface shape measuring device includes a camera that captures the observation image acquired by the optical head, a drive unit that causes the optical head to scan relatively in a scanning direction perpendicular to the measurement target, an encoder for detecting a position of the optical head in the scanning direction with respect to the measurement target, an imaging instructing unit that instructs the camera to capture the observation image based on a position signal output from the encoder for each predetermined interval, a frame dropping occurrence rate calculating unit that calculates a frame dropping occurrence rate indicating an occurrence rate of frame dropping of the camera, and a measurement condition setting unit that sets a measurement condition for measuring a surface shape of the measurement target based on the frame dropping occurrence rate.

公开(公告)号：US20240393097A1

公开(公告)日：2024-11-28

申请号：US18795599

申请日：2024-08-06

Applicant: Tokyo Seimitsu Co., Ltd.

Inventor： Yoshiyuki KAWATA ,  Katsufumi MORIYAMA ,  Hideki MORII

IPC: G01B9/02055 ,  G01B11/24

Abstract: A three-dimensional shape measuring device includes a holder that changes the reference light path length in response to temperature change, and a temperature adjusting unit that adjusts a temperature of the holder to a target temperature, so as to make a measurement light path length equal to a reference light path length with high accuracy at low cost regardless of a temperature of an installation environment. A three-dimensional shape measuring device includes a temperature adjusting unit that adjusts the temperature of the holder and a temperature control unit that controls the temperature adjusting unit so as to selectively switch a measurement mode between a first measurement mode in which the reference light path length is made equal to a measurement light path length and a second measurement mode in which the reference light path length is made different from the measurement light path length.

公开(公告)号：US20230028748A1

公开(公告)日：2023-01-26

申请号：US17939226

申请日：2022-09-07

Applicant: Tokyo Seimitsu Co., Ltd.

Inventor： Hideki MORII ,  Katsufumi MORIYAMA ,  Hiroaki KIMURA

IPC: G01B11/24 ,  G01B11/00

Abstract: The following are observed using a camera: a first position of a small hole of a workpiece, which is fixed to a linear-and-tilting-motion stage and rotating with a rotating body, and a second position thereof different from the first position, at a first rotation angle of the rotating body; and the first position and the second position of the small hole of the workpiece at a second rotation angle different from the first rotation angle of the rotating body. A position and a tilt of the small hole are calculated from coordinates of the respective observed positions, and small hole information, which includes the position and the tilt of the small hole, is outputted.

公开(公告)号：US20240393098A1

公开(公告)日：2024-11-28

申请号：US18795910

申请日：2024-08-06

Applicant: Tokyo Seimitsu Co., Ltd.

Inventor： Yoshiyuki KAWATA ,  Katsufumi MORIYAMA ,  Hideki MORII

IPC: G01B9/02055 ,  G01B11/24

Abstract: An adjustment method for a shape measuring device that radiates light from a light source to a master for adjustment and a reference surface respectively as measurement light and reference light and measures a shape of a surface to be measured of a measurement target using multiplexed light of the measurement light and the reference light respectively reflected by the master for adjustment and the reference surface, the adjustment method including; measuring the master for adjustment in an adjusted state in which a focus position matches an interference position and calculating and storing a matching degree parameter indicating a matching degree between the focus position and the interference position as an adjustment matching degree parameter; when the measurement target is measured, measuring the master for adjustment, calculating the matching degree parameter and comparing the matching degree parameter with the adjustment matching degree parameter, to confirm the matching degree.

公开(公告)号：US20230003510A1

公开(公告)日：2023-01-05

申请号：US17939080

申请日：2022-09-07

Applicant: Tokyo Seimitsu Co., Ltd.

Inventor： Hideki MORII ,  Katsufumi MORIYAMA

IPC: G01B11/12 ,  G01B11/00

Abstract: The inner surface shape measurement device, which measures an inner surface shape of a small hole formed in a workpiece, includes: a rotating body for rotating the workpiece around a rotation axis, and a linear-and-tilting-motion stage; an elongated probe capable of being inserted into the small hole of the workpiece; a probe linear-and-tilting-motion mechanism capable of adjusting posture of the probe; a camera, configured to be rotatable integrally with the rotating body, for imaging the probe from at least three circumferential positions on a rotation trajectory centered on a rotation axis; and a controller for adjusting the posture of the probe using the probe linear-and-tilting-motion mechanism based on an image taken by the camera at each of the circumferential positions.