公开(公告)号：US09387535B2

公开(公告)日：2016-07-12

申请号：US13742380

申请日：2013-01-16

Applicant: U.S. Army Research Laboratory ATTN: RDRL-LOC-I

Inventor： Kristopher A. Darling ,  Micah J. Gallagher ,  Anthony J. Roberts ,  Laszlo J. Kecskes

IPC: B02C17/18 ,  B22F9/04 ,  C22C1/10

CPC classification number: B22F9/04 ,  B02C17/18 ,  B22F2009/041 ,  C22C1/1084

Abstract: The invention is an apparatus and method for safely depressurizing milling vials. The invention utilizes a machinist vise in communication with a pneumatic air cylinder mounted in a jig inside glove box enclosure. The invention utilizes a method for safely depressurizing milling vials. The milling vials are placed into the machinist vise inside the enclosure. The ram of the pneumatic air cylinder is placed on top of the milling vial and the pneumatic air cylinder is pressed firmly against the cap of the milling vial. Next, the air inside the enclosure is evacuated of atmosphere after which the pressure is slowly released from the pneumatic air cylinder. During this stage of the method the operator is a safe distance from the enclosure. As pressure is removed from the pneumatic air cylinder the ram is retracted and the cap of milling vial is removed.

Abstract translation: 本发明是用于安全减压研磨小瓶的装置和方法。 本发明利用与安装在手套箱外壳内的夹具中的气动气缸连通的机械师台钳。 本发明利用了一种用于安全减压研磨小瓶的方法。 研磨小瓶被放置在机壳内的机械师台钳内。 气动气缸的压头放置在研磨小瓶的顶部，气动气缸紧紧地压靠在研磨小瓶的盖上。 接下来，将外壳内的空气排出大气，然后从气动气缸缓慢释放压力。 在该方法的这个阶段，操作者距离机箱是安全的距离。 当压力从气动气缸中移除时，压头缩回，并且铣刀的盖子被移除。

公开(公告)号：US20150375301A1

公开(公告)日：2015-12-31

申请号：US13779803

申请日：2013-02-28

Applicant: U.S. Army Research Laboratory ATTN: RDRL-LOC-I

Inventor： Kristopher A. Darling ,  Laszlo J. Kecskes ,  Brady G. Butler

IPC: B22F9/04 ,  B02C23/06 ,  B02C17/20 ,  B02C17/18 ,  C22C9/00 ,  F42B1/032

CPC classification number: B22F9/04 ,  B02C17/1815 ,  B02C17/20 ,  B02C23/00 ,  B02C23/06 ,  B22F1/0018 ,  B22F2009/043 ,  B22F2009/049 ,  B22F2999/00 ,  C22C1/0425 ,  C22C9/00 ,  F42B1/032 ,  B22F2202/03

Abstract: A binary or higher order high-density thermodynamically stable nanostructured copper-tantalum based metallic system according to embodiments of the invention may be formed of: a solvent of copper (Cu) metal that comprises 70 to 100 atomic percent (at. %) of the metallic system; and a solute of tantalum (Ta) metal dispersed in the solvent metal, that comprises 0.01 to 15 at. % of the metallic system. The metallic system is thermally stable, with the absence of substantial gross grain growth, such that the internal grain size of the solvent metal is substantially suppressed to no more than about 250 nm at approximately 98% of the melting point temperature of the solvent metal and the solute metal remains substantially uniformly dispersed in the solvent metal at that temperature. Processes for forming these metallic systems may include: subjecting powder metals of solvent and the solute to a high-energy milling process using a high-energy milling device to impart high impact energies to its contents. Due to their high-density thermodynamically stable nanostructured, these metallic systems are an ideal candidate for fabricating shaped charge liners for ordinance.

Abstract translation: 根据本发明的实施方案的二元或更高阶高密度热力学稳定的纳米结构铜 - 钽基金属体系可以由以下物质形成：铜（Cu）金属的溶剂，其包含70至100原子％（原子百分比） 金属系统 以及分散在溶剂金属中的钽（Ta）金属溶质，其含有0.01〜15at。 ％的金属系统。 金属体系是热稳定的，不存在实质的总晶粒生长，使得溶剂金属的内部晶粒尺寸在溶剂金属的熔点温度的约98％下基本上被抑制到不超过约250nm， 在该温度下，溶质金属基本均匀地分散在溶剂金属中。 用于形成这些金属体系的方法可以包括：使用高能研磨装置对溶剂的粉末金属和溶质进行高能量研磨工艺，以赋予其内容物高的冲击能。 由于它们的高密度热力学稳定的纳米结构，这些金属系统是制造用于法规的成形充电衬垫的理想候选者。

公开(公告)号：US11725262B2

公开(公告)日：2023-08-15

申请号：US17886949

申请日：2022-08-12

Applicant: U.S. Army Research Laboratory ATTN: RDRL-LOC-I

Inventor： John J. Pittari, III ,  Steven M. Kilczewski ,  Jeffrey J. Swab ,  Kristopher A. Darling ,  Billy C. Hornbuckle ,  Heather A. Murdoch ,  Robert J. Dowding

IPC: C22C29/02 ,  B22F3/105 ,  C22C29/08 ,  B22F3/14 ,  C22C29/06 ,  C22C1/051

CPC classification number: C22C29/02 ,  B22F3/105 ,  B22F3/14 ,  C22C1/051 ,  C22C29/067 ,  C22C29/08

Abstract: A sintered cemented carbide body including tungsten carbide, and a substantially cobalt-free binder including an iron-based alloy sintered with the tungsten carbide. The iron-based alloy is approximately 2-25% of the overall weight percentage of the sintered tungsten carbide and iron-based alloy. The tungsten carbide may be approximately 90 wt % and the iron-based alloy may be approximately 10 wt % of the overall weight percentage of the sintered tungsten carbide and iron-based alloy. The tungsten carbide may comprise a substantially same size before and after undergoing sintering. The iron-based alloy may be sintered with the tungsten carbide using a uniaxial hot pressing process, a spark plasma sintering process, or a pressureless sintering process. The sintered tungsten carbide and iron-based alloy has a hardness value of at least 15 GPa and a fracture toughness value of at least 11 MPa√m.

公开(公告)号：US09333558B2

公开(公告)日：2016-05-10

申请号：US13779803

申请日：2013-02-28

Applicant: U.S. Army Research Laboratory ATTN: RDRL-LOC-I

Inventor： Kristopher A. Darling ,  Laszlo J. Kecskes ,  Brady G. Butler

IPC: B22F9/04 ,  C22C9/00 ,  F42B1/032 ,  B02C17/20 ,  B02C17/18 ,  B02C23/06

CPC classification number: B22F9/04 ,  B02C17/1815 ,  B02C17/20 ,  B02C23/00 ,  B02C23/06 ,  B22F1/0018 ,  B22F2009/043 ,  B22F2009/049 ,  B22F2999/00 ,  C22C1/0425 ,  C22C9/00 ,  F42B1/032 ,  B22F2202/03

Abstract: A binary or higher order high-density thermodynamically stable nanostructured copper-tantalum based metallic system according to embodiments of the invention may be formed of: a solvent of copper (Cu) metal that comprises 70 to 100 atomic percent (at. %) of the metallic system; and a solute of tantalum (Ta) metal dispersed in the solvent metal, that comprises 0.01 to 15 at. % of the metallic system. The metallic system is thermally stable, with the absence of substantial gross grain growth, such that the internal grain size of the solvent metal is substantially suppressed to no more than about 250 nm at approximately 98% of the melting point temperature of the solvent metal and the solute metal remains substantially uniformly dispersed in the solvent metal at that temperature. Processes for forming these metallic systems may include: subjecting powder metals of solvent and the solute to a high-energy milling process using a high-energy milling device to impart high impact energies to its contents. Due to their high-density thermodynamically stable nanostructured, these metallic systems are an ideal candidate for fabricating shaped charge liners for ordinance.

Abstract translation: 根据本发明的实施方案的二元或更高阶高密度热力学稳定的纳米结构铜 - 钽基金属体系可以由以下物质形成：铜（Cu）金属的溶剂，其包含70至100原子％（原子百分比） 金属系统 以及分散在溶剂金属中的钽（Ta）金属溶质，其含有0.01〜15at。 ％的金属系统。 金属体系是热稳定的，不存在实质的总晶粒生长，使得溶剂金属的内部晶粒尺寸在溶剂金属的熔点温度的约98％时基本上被抑制到不超过约250nm，并且 在该温度下，溶质金属基本均匀地分散在溶剂金属中。 用于形成这些金属体系的方法可以包括：使用高能研磨装置对溶剂的粉末金属和溶质进行高能量研磨工艺，以赋予其内容物高的冲击能。 由于它们的高密度热力学稳定的纳米结构，这些金属系统是制造用于法规的成形充电衬垫的理想候选者。