公开(公告)号：US4719255A

公开(公告)日：1988-01-12

申请号：US760770

申请日：1985-07-31

申请人： Akira Yoshizumi ,  Hisayuki Hirai ,  Kazutaka Matsumoto ,  Shinetsu Fujieda ,  Michiya Higashi

发明人： Akira Yoshizumi ,  Hisayuki Hirai ,  Kazutaka Matsumoto ,  Shinetsu Fujieda ,  Michiya Higashi

IPC分类号： C08L63/00 ,  H01B3/40

CPC分类号： H01B3/40 ,  C08L63/00

摘要： An epoxy resin composition for encapsulation of semiconductor device comprises the components (a), (b), (c) and at least one of the components (d) and (e) as shown below:(a) 100 parts by weight of an epoxy resin having at least 2 epoxy groups in one molecule;(b) 8 to 65 parts by weight of a novolak type phenolic resin with an ortho ratio less than 50%;(c) 1.2 to 40 parts by weight of a polyvinyl acetal compound;(d) 0.8 to 30 parts by weight of a silicone oil; and(e) 4 to 80 parts by weight of a rubber-modified phenolic resin.The described epoxy resins composition for encapsulation of semiconductor devices can retain its high glass transition temperature in the cured product and also has low modulus of elasticity, as well as excellent humidity resistance and thermal shock resistance.

摘要翻译： 用于半导体器件封装的环氧树脂组合物包括如下所示的组分（a），（b），（c）和组分（d）和（e）中的至少一种：（a）100重量份的 一个分子中具有至少2个环氧基团的环氧树脂; （b）8〜65重量份邻位比小于50％的酚醛清漆型酚醛树脂; （c）1.2〜40重量份的聚乙烯醇缩醛化合物; （d）0.8〜30重量份的硅油; 和（e）4至80重量份的橡胶改性酚醛树脂。 所述用于半导体器件封装的环氧树脂组合物可以在固化产物中保持其高的玻璃化转变温度，并且还具有低的弹性模量以及优异的耐湿性和耐热冲击性。