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    Epoxy resin composition for encapsulation of semi-conductor device
    1.
    发明授权
    Epoxy resin composition for encapsulation of semi-conductor device 失效
    用于半导体器件封装的环氧树脂组合物

    公开(公告)号：US4719255A

    公开(公告)日：1988-01-12

    申请号：US760770

    申请日：1985-07-31

    申请人： Akira Yoshizumi ,  Hisayuki Hirai ,  Kazutaka Matsumoto ,  Shinetsu Fujieda ,  Michiya Higashi

    发明人： Akira Yoshizumi ,  Hisayuki Hirai ,  Kazutaka Matsumoto ,  Shinetsu Fujieda ,  Michiya Higashi

    IPC分类号： C08L63/00 ,  H01B3/40

    CPC分类号： H01B3/40 ,  C08L63/00

    摘要： An epoxy resin composition for encapsulation of semiconductor device comprises the components (a), (b), (c) and at least one of the components (d) and (e) as shown below:(a) 100 parts by weight of an epoxy resin having at least 2 epoxy groups in one molecule;(b) 8 to 65 parts by weight of a novolak type phenolic resin with an ortho ratio less than 50%;(c) 1.2 to 40 parts by weight of a polyvinyl acetal compound;(d) 0.8 to 30 parts by weight of a silicone oil; and(e) 4 to 80 parts by weight of a rubber-modified phenolic resin.The described epoxy resins composition for encapsulation of semiconductor devices can retain its high glass transition temperature in the cured product and also has low modulus of elasticity, as well as excellent humidity resistance and thermal shock resistance.

    摘要翻译： 用于半导体器件封装的环氧树脂组合物包括如下所示的组分（a），（b），（c）和组分（d）和（e）中的至少一种：（a）100重量份的 一个分子中具有至少2个环氧基团的环氧树脂; （b）8〜65重量份邻位比小于50％的酚醛清漆型酚醛树脂; （c）1.2〜40重量份的聚乙烯醇缩醛化合物; （d）0.8〜30重量份的硅油; 和（e）4至80重量份的橡胶改性酚醛树脂。 所述用于半导体器件封装的环氧树脂组合物可以在固化产物中保持其高的玻璃化转变温度，并且还具有低的弹性模量以及优异的耐湿性和耐热冲击性。

    Maleimide resin composition and resin encapsulated semiconductor device manufactured using the composition
    3.
    发明授权
    Maleimide resin composition and resin encapsulated semiconductor device manufactured using the composition 失效
    使用该组合物制造的马来酰亚胺树脂组合物和树脂封装的半导体器件

    公开(公告)号：US5272377A

    公开(公告)日：1993-12-21

    申请号：US785812

    申请日：1991-10-31

    申请人： Hiroshi Shimozawa ,  Shinetsu Fujieda ,  Michiya Higashi ,  Akira Yoshizumi

    发明人： Hiroshi Shimozawa ,  Shinetsu Fujieda ,  Michiya Higashi ,  Akira Yoshizumi

    IPC分类号： C08L61/06 ,  C08K5/14 ,  C08K5/5313 ,  C08L35/00 ,  C08L61/04 ,  C08L79/08 ,  H01B3/30 ,  H01L23/29 ,  H01L23/31 ,  H01L23/28

    CPC分类号： H01L23/293 ,  C08K5/14 ,  C08K5/5313 ,  C08L79/085 ,  H01B3/306 ,  H01L2224/48091 ,  H01L2224/48247 ,  H01L2224/48465 ,  H01L2924/1433

    摘要： The device characteristics is in containing a maleimide resin with a content of 0.2 weight percent of less of an organic acid, a phenolic resin, and a combination of a basic catalyst and a peroxide as a curing catalyst. In addition, additives as a mold release agent such as a polyethylene wax and an inorganic filler are contained. The maleimide resin composition is prepared in such a manner that a part of the phenolic resin is preblended with the curing catalyst in advance of other components, while the remainder of the phenolic resin is added to the maleimide resin to prepolymerize, and then, the preblend and the prepolyer are blended the other components. The maleimide resin composition has excellent moldability by improvement of curing characteristics through combined use of a basic catalyst and a peroxide as a curing agent. Besides, a resin encapsulated semiconductor device manufactured by encapsulating a semiconductor element with the resin composition has excellent heat resistance and moisture-resistance reliability.

    摘要翻译： 该装置的特征在于含有0.2重量％以下的有机酸，酚醛树脂，碱性催化剂和过氧化物的组合的马来酰亚胺树脂作为固化催化剂。 此外，含有作为脱模剂的添加剂如聚乙烯蜡和无机填料。 马来酰亚胺树脂组合物的制备方法是将一部分酚醛树脂与其它组分预先与固化催化剂预混合，同时将剩余的酚醛树脂加入到马来酰亚胺树脂中进行预聚合，然后将预混物 并将预分散器与其它组分混合。 马来酰亚胺树脂组合物通过组合使用碱性催化剂和作为固化剂的过氧化物来改善固化特性，具有优异的成型性。 此外，通过用树脂组合物封装半导体元件制造的树脂封装的半导体器件具有优异的耐热性和耐湿可靠性。

    Resin encapsulation type semiconductor device
    6.
    发明授权
    Resin encapsulation type semiconductor device 失效
    树脂封装型半导体器件

    公开(公告)号：US5346743A

    公开(公告)日：1994-09-13

    申请号：US28696

    申请日：1993-03-08

    申请人： Ken Uchida ,  Michiya Higashi ,  Shinetsu Fujieda

    发明人： Ken Uchida ,  Michiya Higashi ,  Shinetsu Fujieda

    IPC分类号： C08G59/32 ,  C08G59/68 ,  C08L63/00 ,  H01B3/40 ,  H01L23/29

    CPC分类号： H01L23/293 ,  C08G59/3218 ,  C08G59/686 ,  C08L63/00 ,  H01B3/40 ,  H01L2224/48091 ,  H01L2224/48247 ,  H01L2224/48465 ,  H01L2924/1433 ,  H01L2924/181 ,  Y10T428/239

    摘要： According to a first embodiment of the present invention, there is provided a resin encapsulation type semiconductor device, comprising a semiconductor element and an epoxy resin composition used as an encapsulating resin, the composition containing as essential components:(a) an epoxy resin represented by formula (I) given below: ##STR1## where R.sup.1, R.sup.2, R.sup.3, and R.sup.4 are hydrogen or an alkyl group respectively, and n.gtoreq.0,(b) a phenolic resin curing agent,(c) an imidazole compound, and(d) triphenyl phosphate.In the first embodiment of the present invention, a heat resistance skeletal structure is formed by the epoxy resin (a) and the phenolic resin curing agent (b) in the epoxy resin composition after cured, leading to an improved resistance to heat and to an improved package crack resistance. Further, the combination of the imidazole compound (c) used as a curing catalyst and triphenyl phosphate (d) permits ensuring a high reliability in terms of the humidity resistance and also permits improving the resistance to the external contamination.

    摘要翻译： 根据本发明的第一实施例，提供一种树脂封装型半导体器件，其包含半导体元件和用作封装树脂的环氧树脂组合物，该组合物含有作为必要成分的组合物：（a）由 式（I）：其中R1，R2，R3和R4分别是氢或烷基，n≥0，（b）酚醛树脂固化剂，（c） 咪唑化合物和（d）磷酸三苯酯。 在本发明的第一实施方案中，环氧树脂组合物中的环氧树脂（a）和酚醛树脂固化剂（b）在固化后形成耐热骨架结构，导致耐热性提高 提高包装抗裂性。 此外，用作固化催化剂的咪唑化合物（c）和磷酸三苯酯（d）的组合可以确保在耐湿性方面的高可靠性，并且还可以改善对外部污染的抵抗力。